公开(公告)号：US5672400A

公开(公告)日：1997-09-30

申请号：US576710

申请日：1995-12-21

申请人： Dennis D. Hansen ,  Michael A. Kropp ,  Glen Connell

发明人： Dennis D. Hansen ,  Michael A. Kropp ,  Glen Connell

IPC分类号： B32B27/00 ,  C08G69/40 ,  C08G69/44 ,  C09J9/02 ,  C09J177/00 ,  C09J177/12 ,  H01B1/22 ,  H05K3/32 ,  H05K3/36 ,  B32B9/00

CPC分类号： H05K3/323 ,  B32B27/00 ,  C08G69/40 ,  C08G69/44 ,  C09J177/00 ,  C09J177/12 ,  C09J9/02 ,  H01B1/22 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K3/361 ,  Y10S428/901 ,  Y10T428/14 ,  Y10T428/24917

摘要： The present invention provides a microelectronic assembly wherein a semi-crystalline copolymer adhesive composition, preferably provided in the form of a film, is used to electrically interconnect a first circuit pattern on a first substrate to a second circuit pattern on a second substrate. The adhesive composition preferably includes a semi-crystalline copolymer comprising polyether and polyamide monomeric units, a tackifier, and conductive particles.

摘要翻译： 本发明提供了一种微电子组件，其中优选以薄膜形式提供的半结晶共聚物粘合剂组合物用于将第一衬底上的第一电路图案与第二衬底上的第二电路图案电互连。 粘合剂组合物优选包括包含聚醚和聚酰胺单体单元的半结晶共聚物，增粘剂和导电颗粒。

公开(公告)号：US20130267136A1

公开(公告)日：2013-10-10

申请号：US13988581

申请日：2011-12-28

申请人： Dmitriy Salnikov ,  Michael A. Kropp ,  Ilya Gorodisher

发明人： Dmitriy Salnikov ,  Michael A. Kropp ,  Ilya Gorodisher

IPC分类号： C09J163/00 ,  C09J7/00

CPC分类号： C09J163/00 ,  C08G59/245 ,  C08G59/56 ,  C08G59/66 ,  C08K5/0025 ,  C09J7/00 ,  C09J7/10 ,  C09J7/30 ,  C09J2400/263 ,  C09J2400/283 ,  C09J2463/00 ,  Y10T442/10

摘要： Adhesive compositions are provided comprising: a) a base resin comprising an epoxy resin; b) a first epoxy curative; and c) a second epoxy curative; wherein the first and second epoxy curatives are chosen such that the second epoxy curative may remain substantially unreacted in the composition under conditions of temperature and duration that render the first epoxy curative substantially reacted with epoxy resin in the composition. In some embodiments, the first epoxy curative is substantially reacted with epoxy resin in the composition and the second epoxy curative is substantially unreacted in the composition. In some embodiments, the adhesive composition is used in the form of an adhesive film.

摘要翻译： 提供了粘合剂组合物，其包含：a）包含环氧树脂的基础树脂; b）第一种环氧固化剂; 和c）第二环氧固化剂; 其中选择第一和第二环氧固化剂使得第二环氧固化剂在温度和持续时间条件下在组合物中基本上未反应，使第一环氧固化剂基本上与组合物中的环氧树脂反应。 在一些实施方案中，第一环氧固化剂基本上与组合物中的环氧树脂反应，第二环氧固化剂在组合物中基本上未反应。 在一些实施方案中，粘合剂组合物以粘合剂膜的形式使用。

公开(公告)号：US20100214732A1

公开(公告)日：2010-08-26

申请号：US12705008

申请日：2010-02-12

申请人： Scott B. CHARLES ,  Michael A. Kropp ,  Ashu N. Mujumdar

发明人： Scott B. CHARLES ,  Michael A. Kropp ,  Ashu N. Mujumdar

IPC分类号： G06F1/16 ,  B29C67/24 ,  C08J5/00 ,  B29C35/08 ,  B29C39/00 ,  H05K5/00

CPC分类号： H05K5/061 ,  H05K5/062

摘要： This disclosure relates to gasket materials used for attaching and sealing covers to enclosures. More particularly, this disclosure relates to form-in-place gaskets, applied to surfaces of containers for sensitive electronic components. The gaskets include a flexible polymer and a micropowder polyolefin filler.

摘要翻译： 本公开涉及用于将盖子附接和密封到外壳上的垫圈材料。 更具体地说，本公开内容涉及适用于敏感电子部件的容器表面的成形衬垫。 垫片包括柔性聚合物和微粉聚烯烃填料。

公开(公告)号：US20090155596A1

公开(公告)日：2009-06-18

申请号：US11955070

申请日：2007-12-12

申请人： Michael A. Kropp ,  Roger A. Grisle ,  Eric G. Larson

发明人： Michael A. Kropp ,  Roger A. Grisle ,  Eric G. Larson

IPC分类号： C09J5/06 ,  C09J163/00 ,  B32B37/12

CPC分类号： C09J163/00 ,  B41J2/17536 ,  C09D11/101 ,  Y10T428/31511

摘要： A method of applying a curable composition. The method includes providing a curable composition comprising about 10 to about 60 weight percent of one or more epoxy resins; about 20 to about 80 weight percent of one or more resins selected from polyester resins, ethyl vinyl acetate resins, thermoplastic resins, and acrylate resins; up to about 30 weight percent of one or more hydroxyl-containing compounds; and an initiator selected from a photoinitiator, a thermal initiator, and combinations thereof. The method further includes initiating cure of the curable composition.

摘要翻译： 施加可固化组合物的方法。 该方法包括提供包含约10至约60重量％的一种或多种环氧树脂的可固化组合物; 约20至约80重量％的一种或多种选自聚酯树脂，乙酸乙烯酯树脂，热塑性树脂和丙烯酸酯树脂的树脂; 至多约30重量％的一种或多种含羟基化合物; 和选自光引发剂，热引发剂及其组合的引发剂。 该方法还包括引发可固化组合物的固化。

公开(公告)号：US06395124B1

公开(公告)日：2002-05-28

申请号：US09365289

申请日：1999-07-30

申请人： Joel D. Oxman ,  Michael A. Kropp

发明人： Joel D. Oxman ,  Michael A. Kropp

IPC分类号： B32B3128

CPC分类号： B32B7/12 ,  B32B2037/243 ,  B32B2038/0092 ,  B32B2307/40 ,  B32B2429/02 ,  B32B2457/08 ,  C08F2/46 ,  C08F290/067 ,  C09J4/00 ,  C09J4/06 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01037 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/12041 ,  C08F222/1006 ,  H01L2924/00

摘要： A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure. An underfilled flip chip assembly on an integrated circuit board substrate can be prepared by the method described above. The photopolymerizable adhesive composition can be applied directly to one or both surfaces of an aligned integrated chip and circuit board substrate or the chip aligned on an integrated circuit board substrate can be capillary underfilled with the photopolymerizable adhesive composition, which is subsequently cured. Data storage disks can also be prepared by the method of the invention.

摘要翻译： 层压结构的方法包括至少两层和在这些层之间的可光聚合的粘合剂组合物，至少一层是不透明的，有色的或反射的。 这些层中的一层或两层对波长在大于400nm和高达1200nm的波长的光化辐射是透射的。 可光聚合的粘合剂组合物吸收辐射透射层的所识别的光谱区域中的辐射。 通过在所识别的光谱区域中通过辐射透射层引导辐射并产生层压结构来实现固化。 可以通过上述方法制备集成电路板基板上的未充满的倒装芯片组件。 可光聚合的粘合剂组合物可以直接施加到对准的集成芯片和电路板基板的一个或两个表面，或者在集成电路板基板上排列的芯片可以被毛发填充，然后可光聚合的粘合剂组合物随后被固化。 数据存储盘也可以通过本发明的方法来制备。

公开(公告)号：US5863664A

公开(公告)日：1999-01-26

申请号：US682224

申请日：1996-07-17

申请人： Fred B. McCormick ,  David J. Drath ,  Ilya Gorodisher ,  Michael A. Kropp ,  Michael C. Palazzotto ,  Melville R. V. Sahyun

发明人： Fred B. McCormick ,  David J. Drath ,  Ilya Gorodisher ,  Michael A. Kropp ,  Michael C. Palazzotto ,  Melville R. V. Sahyun

IPC分类号： F16F15/02 ,  B32B27/00 ,  B32B27/06 ,  C08F4/42 ,  C08G73/00 ,  C08G73/06 ,  C08J5/00 ,  C08L79/04 ,  C09J4/02 ,  G03F7/027 ,  G03F7/029

CPC分类号： G03F7/027 ,  B32B27/06 ,  C08G73/065 ,  C08G73/0655 ,  C08G73/0661 ,  G03F7/029 ,  Y10T428/31855

摘要： A composition of matter includes a polymerizable mixture comprising 1 to 99 weight percent of a first monomer and an initiator therefor, the first monomer being one of 1) at least one free-radically polymerizable monomer or 2) at least one cyanate ester monomer, and 99 to 1 weight percent of a second monomer and an initiator therefor, the second monomer being the member of 1) or 2) that is not selected as the first monomer, wherein the curative for the cyanate ester is a transition metal-containing organometallic compound curing agent and the curative for the free-radically polymerizable monomer is a free-radical generating curing agent or a transition metal-containing organometallic compound. The polymeric mixtures are useful, for example, in applications requiring high performance, such as high temperature performance; in composites, particularly structural composites; structural adhesives; vibration damping materials; electronic applications such as printed wiring boards, semiconductor encapsulants and electronic adhesives; photoresists; injection molding and prepregs; protective coatings; tough self-supporting films; and high performance binders. In addition, a curable composition including (1) an ethylenically unsaturated monomer or (2) an ethylenically unsaturated monomer and a cyanate ester monomer, and certain organometallic neutral compounds is useful in the graphic arts.

公开(公告)号：US5620795A

公开(公告)日：1997-04-15

申请号：US500123

申请日：1995-07-10

申请人： Christopher A. Haak ,  Michael A. Kropp ,  Greggory S. Bennett

发明人： Christopher A. Haak ,  Michael A. Kropp ,  Greggory S. Bennett

IPC分类号： C08F220/16 ,  C08F220/18 ,  C09J4/00 ,  C09J7/02 ,  C09J9/02 ,  C09J133/06 ,  C09J133/08 ,  F16F9/30 ,  H05K3/32 ,  B32B7/12

CPC分类号： F16F9/306 ,  C08F220/18 ,  C09J133/08 ,  C09J4/00 ,  C09J7/0217 ,  C09J9/02 ,  C08F2220/1858 ,  C09J2201/606 ,  C09J2205/31 ,  H05K3/321 ,  H05K3/323 ,  Y10T428/2804 ,  Y10T428/2848 ,  Y10T428/2857 ,  Y10T428/2891

摘要： Pressure sensitive adhesives and heat activatable adhesives that are the reaction product of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.; a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T.sub.g greater than 15.degree. C.; 0-5 parts by weight of a polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T.sub.g greater than 15.degree. C.; and an electrically conductive agent.

摘要翻译： 压敏粘合剂和可热活化的粘合剂，其是均聚物Tg小于0℃的一元醇的丙烯酸酯的反应产物; 其均聚物的溶解度参数不大于10.50且Tg大于15℃的非极性烯属不饱和单体; 0-5重量份的均聚物的溶解度参数大于10.50且Tg大于15℃的极性烯属不饱和单体; 和导电剂。

公开(公告)号：US08729197B2

公开(公告)日：2014-05-20

申请号：US13814794

申请日：2011-07-19

申请人： Michael A. Kropp

发明人： Michael A. Kropp

IPC分类号： B65B3/00 ,  C08L63/00 ,  C08L63/02 ,  C08L63/04

CPC分类号： C09J163/00 ,  C08G18/003 ,  C08G59/42 ,  C08G59/50 ,  C08G59/68 ,  C08L63/00 ,  C08L75/00 ,  C08L2205/02 ,  C08L2205/05 ,  C08L2666/22 ,  C08L33/08

摘要： Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.

摘要翻译： 描述了对塑料基板表现出良好粘附性的室温固化环氧粘合剂。 粘合剂含有包含第一环氧树脂和第二环氧树脂的环氧树脂组分; 每当量胺当量重量至少为50克的第一种胺固化剂; 每当量胺当量重量不超过45克的第二胺固化剂; 乙酰乙酰氧基官能化化合物; 金属盐催化剂; 和多官能丙烯酸酯。

公开(公告)号：US20120211119A1

公开(公告)日：2012-08-23

申请号：US13504532

申请日：2010-11-11

申请人： Joseph D. Rule ,  Michael A. Kropp ,  Kevin M. Lewandowski

发明人： Joseph D. Rule ,  Michael A. Kropp ,  Kevin M. Lewandowski

IPC分类号： F16L9/22 ,  B23P11/00

CPC分类号： F16L21/00 ,  F16B1/0014 ,  F16B3/00 ,  F16L21/03 ,  F16L47/20 ,  Y10T29/49865 ,  Y10T29/49908

摘要： Methods of joining pipe section and joined pipe assemblies are described. The pipe sections, e.g., pipes and couplers, are joined by a mechanical interference bond formed using a shape memory polymer key. The key can be inserted into a first keyway of one pipe section, the pipes fitted to align first keyway with a second keyway of the second pipe section, and the shape memory polymer activated to at least partially fill both keyways.

摘要翻译： 描述了连接管段和连接管组件的方法。 管道部分，例如管道和耦合器，通过使用形状记忆聚合物键形成的机械干涉结合。 钥匙可以插入到一个管段的第一键槽中，管道装配成将第一键槽与第二管段的第二键槽对齐，并且形状记忆聚合物被激活以至少部分地填充两个键槽。

公开(公告)号：US07482201B2

公开(公告)日：2009-01-27

申请号：US11972904

申请日：2008-01-11

申请人： Scott B. Charles ,  Kathleen M. Gross ,  Steven C. Hackett ,  Michael A. Kropp ,  William J. Schultz ,  Wendy L. Thompson

发明人： Scott B. Charles ,  Kathleen M. Gross ,  Steven C. Hackett ,  Michael A. Kropp ,  William J. Schultz ,  Wendy L. Thompson

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/295 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/305 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/05442

摘要： The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.

摘要翻译： 本发明提供了制造所述制品的电子制品和方法。 电子制品包括使用包含热固性树脂，固化催化剂和基本上球形，非聚集，无定形和固体的表面处理纳米颗粒的反应产物的底部填充粘合剂粘合并电连接到基底的电子部件。