利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

45 条记录 (耗时 0.022 秒)

    Methods of selectively filling apertures
    1.
    发明授权
    Methods of selectively filling apertures 失效

    公开(公告)号：US06066889A

    公开(公告)日：2000-05-23

    申请号：US158811

    申请日：1998-09-22

    申请人： Gerald Walter Jones ,  Heike Marcello ,  Kostas Papathomas

    发明人： Gerald Walter Jones ,  Heike Marcello ,  Kostas Papathomas

    IPC分类号： H01L21/48 ,  H05K3/00 ,  H01L23/04

    CPC分类号： H01L21/486 ,  H05K3/0094 ,  H05K2201/0959 ,  H05K2203/0278 ,  H05K3/0082

    摘要： A novel method of filling apertures in substrates, such as through holes, is provided. The method utilizes a photoimageable film, and comprises the following steps: applying a photoimagable, hole fill film over the apertures; reflowing the hole fill film to flow into the apertures; exposing the hole fill film to actinic radiation, preferably ultraviolet light, through a phototool, which preferably has openings slightly larger than the diameter of the apertures; then at least partially curing the hole fill film; and developing the hole fill film to remove the unexposed hole fill film. An advantage of the present method is that the apertures may be selectively filled. After the apertures are filled, the hole fill film is cured, preferably by baking. Thereafter, the substrate is preferably subjected to further processing steps; for example, nubs of cured hole fill film are preferably removed. If desired, the substrate is circuitized. If desired, features are gold plated, such as for example, electrolessly gold plated. The hole fill film preferably has solids which comprise 0 to about 20% of a thixotrope and about 80% to about 100% parts of an epoxy resin system; the epoxy resin system comprises: from about 10% to about 80% of phenoxy polyol resin which is the condensation product of epichlorohydrin and bisphenol A, having a molecular weight of from about 40,000 to about 130,000; from about 20% to about 90% of an epoxidized multifunctional bisphenol A formaldehyde novolac resin having a molecular weight of from about 4,000 to about 10,000; from about 35% to about 50% of a diglycidyl ether of bisphenol A, preferably halogenated, and having a molecular weight of from about 600 to about 2,500; and from about 0.1 to about 15 parts by weight of the total resin weight, a cationic photoinitiator. The invention also relates to circuitized structures produced according to the method.

    Methods for selectively filling apertures
    2.
    发明授权
    Methods for selectively filling apertures 失效
    选择性填充孔径的方法

    公开(公告)号：US06376158B1

    公开(公告)日：2002-04-23

    申请号：US09484671

    申请日：2000-01-18

    申请人： Gerald Walter Jones ,  Heike Marcello ,  Kostas Papathomas

    发明人： Gerald Walter Jones ,  Heike Marcello ,  Kostas Papathomas

    IPC分类号： G03F700

    CPC分类号： H01L21/486 ,  H05K3/0082 ,  H05K3/0094 ,  H05K2201/0959 ,  H05K2203/0278

    摘要： A novel method of filling apertures in substrates, such as through holes, is provided. The method utilizes a phtoimageable film, and comprises the following steps: applying a photoimagable, hole fill film over the apertures, preferably having a solvent content of 7-18%; reflowing the hole fill film to flow into the apertures; exposing the hole fill film to actinic radiation, preferably ultraviolet light, through a phototool, which preferably has openings slightly larger than the diameter of the apertures; then at least partially curing the hole fill film; and developing the hole fill film to remove the unexposed hole fill film. Thus, the apertures may be selectively filled. After the apertures are filled, the hole fill film is cured. Thereafter, the substrate may be subjected to further processing steps, for example, nubs of cured hole fill film can be removed. If desired, the substrate is circuitized and overplated with gold.

    摘要翻译： 提供了一种在诸如通孔的基板中填充孔的新方法。 该方法利用可成像的薄膜，并且包括以下步骤：在光孔上施加可光成像的孔填充薄膜，优选具有7-18％的溶剂含量; 回填孔填充膜流入孔中; 将孔填充膜暴露于通过光学工具的光化辐射，优选紫外光，其优选具有比孔的直径稍大的开口; 然后至少部分固化孔填充膜; 并开发孔填充膜以去除未曝光的孔填充膜。 因此，可以选择性地填充孔。 填充孔后，孔填充膜固化。 此后，可以对基板进行进一步的加工步骤，例如，可以去除固化的孔填充膜的凸点。 如果需要，衬底被电路化并用金过镀。