公开(公告)号：US06542506B1

公开(公告)日：2003-04-01

申请号：US09375566

申请日：1999-08-17

Applicant: Hee-Jin Lee

Inventor： Hee-Jin Lee

IPC: H04L1256

CPC classification number: H04L12/40058 ,  H04L12/40065 ,  H04L12/40071 ,  H04L12/40097 ,  H04L12/46 ,  H04L45/00 ,  H04L49/107 ,  H04L69/16 ,  H04L69/161 ,  H04L69/166 ,  H04L69/168 ,  H04L69/169 ,  H04L2012/5618 ,  H04L2012/5621 ,  H04L2012/5626 ,  H04L2012/5667 ,  H04Q11/0478

Abstract: A method of transferring data between networks includes storing a connection path set between predetermined data from a first network and a predetermined address in a second network during initial connection between the first and second networks, and transferring the predetermined data from the first network along the stored path. Accordingly, data transmission speed is faster by pre-mapping a data path between networks, and hardware and software loads on the gateway for repeating data between networks can be reduced.

Abstract translation: 在网络之间传送数据的方法包括在第一和第二网络之间的初始连接期间存储在第一网络的预定数据与第二网络中的预定地址之间设置的连接路径，以及沿着存储的第一网络从第一网络传送预定数据 路径。 因此，通过预先映射网络之间的数据路径，数据传输速度更快，并且可以减少网关上用于在网络之间重复数据的硬件和软件负载。

公开(公告)号：US08524539B2

公开(公告)日：2013-09-03

申请号：US13210607

申请日：2011-08-16

Applicant: Hee-Jin Lee ,  Joong-Hyun Baek

Inventor： Hee-Jin Lee ,  Joong-Hyun Baek

IPC: H01L21/00

CPC classification number: H01L23/4334 ,  H01L23/3128 ,  H01L23/3192 ,  H01L23/3677 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/02166 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/0615 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/06519 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48647 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552

Abstract: Provided are a semiconductor package of a semiconductor chip, a semiconductor module, an electronic system, and methods of manufacturing the same. The method includes mounting a semiconductor chip on a package substrate, forming a molding member on the semiconductor chip, forming via holes penetrating the molding member to expose a portion of a top surface of the semiconductor chip, the via holes being arranged in a lattice shape in a plan view, and forming thermally conductive via plugs in the via holes.

Abstract translation: 提供半导体芯片，半导体模块，电子系统的半导体封装及其制造方法。 该方法包括将半导体芯片安装在封装基板上，在半导体芯片上形成模制构件，形成穿过模制构件的通孔以暴露半导体芯片的顶表面的一部分，通孔布置成格子状 并且在通孔中通过塞子形成热传导。

公开(公告)号：US07990568B2

公开(公告)日：2011-08-02

申请号：US11498823

申请日：2006-08-04

Applicant: Hee-Jin Lee

Inventor： Hee-Jin Lee

IPC: G06K15/02 ,  G06K15/00

CPC classification number: G06F3/1208 ,  G06F3/1205 ,  G06F3/1256 ,  G06F3/1284

Abstract: An apparatus and method are provided for setting a printing option using a preview image. Setting the printing option includes an image preview unit displaying a preview image corresponding to printing data and enabling the preview image to be manipulated for setting a printing setting, a control unit controlling printing of the preview image according to the printing setting of the manipulated preview image, and a printing option setting unit setting a printing option, wherein the control unit applies the printing setting of the preview image to the printing option of the printing option setting unit.

Abstract translation: 提供了一种用于使用预览图像设置打印选项的装置和方法。 设置打印选项包括图像预览单元，其显示对应于打印数据的预览图像，并且使得能够操纵预览图像以设置打印设置;控制单元，根据操作的预览图像的打印设置来控制预览图像的打印 以及设置打印选项的打印选项设置单元，其中控制单元将预览图像的打印设置应用于打印选项设置单元的打印选项。

公开(公告)号：US20100076166A1

公开(公告)日：2010-03-25

申请号：US12448198

申请日：2008-03-06

Applicant: Heon Kim ,  Sung-Ho Chun ,  Hee-Jin Lee ,  Dmitry Kravchuk ,  Kyung-Jun Kim ,  Sang-Kook Kim ,  Sung-Joon Oh ,  Hye-Ran Seong ,  Byung-Hyun Lee ,  Hye-won Jeong ,  Jung-Ho Jo ,  Yun-Jeong Lee ,  Dong-Hyun Oh

Inventor： Heon Kim ,  Sung-Ho Chun ,  Hee-Jin Lee ,  Dmitry Kravchuk ,  Kyung-Jun Kim ,  Sang-Kook Kim ,  Sung-Joon Oh ,  Hye-Ran Seong ,  Byung-Hyun Lee ,  Hye-won Jeong ,  Jung-Ho Jo ,  Yun-Jeong Lee ,  Dong-Hyun Oh

IPC: C08F20/10 ,  C08F4/52 ,  C08F4/12 ,  C08F4/72 ,  B05D3/06

CPC classification number: C07D303/40 ,  C07C69/73 ,  C07C69/734 ,  C07C2602/42 ,  G02F1/133711 ,  G02F1/133788 ,  Y10T428/1005

Abstract: The present invention relates to a novel cyclic olefin compound, a polymer including the cyclic olefin compound, a liquid crystal alignment film including the polymer, and a liquid crystal display device including the liquid crystal alignment film. Since the polymer includes the cyclic olefin compound as a main chain, the thermal stability is excellent and the photoreactive speed is high. Accordingly, the production time can be reduced, the production cost can be reduced, and the anchoring force of the liquid crystal can be increased because the alignment property is stabilized due to the curing.

Abstract translation: 本发明涉及一种新型的环状烯烃化合物，包含该环状烯烃化合物的聚合物，包含该聚合物的液晶取向膜以及包括该液晶取向膜的液晶显示装置。 由于聚合物包含环状烯烃化合物作为主链，所以热稳定性优异，光反应速度快。 因此，可以降低生产时间，降低生产成本，并且由于固化而使取向性能稳定，可以提高液晶的锚固力。

公开(公告)号：US20070064288A1

公开(公告)日：2007-03-22

申请号：US11498823

申请日：2006-08-04

Applicant: Hee-Jin Lee

Inventor： Hee-Jin Lee

IPC: G03F3/10

CPC classification number: G06F3/1208 ,  G06F3/1205 ,  G06F3/1256 ,  G06F3/1284

Abstract: An apparatus and method are provided for setting a printing option using a preview image. Setting the printing option includes an image preview unit displaying a preview image corresponding to printing data and enabling the preview image to be manipulated for setting a printing setting, a control unit controlling printing of the preview image according to the printing setting of the manipulated preview image, and a printing option setting unit setting a printing option, wherein the control unit applies the printing setting of the preview image to the printing option of the printing option setting unit.

Abstract translation: 提供了一种用于使用预览图像设置打印选项的装置和方法。 设置打印选项包括图像预览单元，其显示对应于打印数据的预览图像，并且使得能够操纵预览图像以设置打印设置;控制单元，根据操作的预览图像的打印设置来控制预览图像的打印 以及设置打印选项的打印选项设置单元，其中控制单元将预览图像的打印设置应用于打印选项设置单元的打印选项。

公开(公告)号：US20160190109A1

公开(公告)日：2016-06-30

申请号：US14983510

申请日：2015-12-29

Applicant: Dae-Ho Lee ,  Hyo-Soon Kang ,  Seok-Hong Kwon ,  Tae-Young Yoon ,  Hee-Jin Lee

Inventor： Dae-Ho Lee ,  Hyo-Soon Kang ,  Seok-Hong Kwon ,  Tae-Young Yoon ,  Hee-Jin Lee

IPC: H01L25/16 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L25/162 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A stack semiconductor package includes a first semiconductor package having a first package substrate and a first semiconductor chip mounted on the first package substrate. The first semiconductor chip includes first chip pads arranged along a side portion thereof. The stack semiconductor package includes a second semiconductor package disposed on the first semiconductor package, and includes a second package substrate. A first sub-chip and a second sub-chip is mounted on the second semiconductor package and arranged side by side extending along a direction of a first side portion of the second package substrate. Each of the first and second sub-chips includes second chip pads arranged along a side portion thereof. Connection wiring paths between interface portions and connection pads may be reduced and simplified, thereby preventing connection wires from being tangled. Moreover, connection wiring paths between a logic chip and a memory chip may be minimized, thereby providing high speed performance.

Abstract translation: 堆叠半导体封装包括具有第一封装衬底和安装在第一封装衬底上的第一半导体芯片的第一半导体封装。 第一半导体芯片包括沿其侧部布置的第一芯片焊盘。 堆叠半导体封装包括设置在第一半导体封装上的第二半导体封装，并且包括第二封装衬底。 第一子芯片和第二子芯片安装在第二半导体封装上并且沿着第二封装衬底的第一侧部分的方向并排布置。 第一和第二子芯片中的每一个包括沿着其侧部布置的第二芯片焊盘。 可以减少和简化接口部分和连接焊盘之间的连接布线路径，从而防止连接线缠结。 此外，逻辑芯片和存储芯片之间的连接布线路径可以最小化，从而提供高速性能。

公开(公告)号：US08310046B2

公开(公告)日：2012-11-13

申请号：US13235850

申请日：2011-09-19

Applicant: Joong-Hyun Baek ,  Hee-Jin Lee

Inventor： Joong-Hyun Baek ,  Hee-Jin Lee

IPC: H01L23/34

CPC classification number: H01L23/427 ,  H01L23/481 ,  H01L24/24 ,  H01L24/82 ,  H01L24/90 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/73253 ,  H01L2224/9202 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/14 ,  H01L2924/15311

Abstract: A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.

Abstract translation: 提供具有垂直发热路径的晶片叠层半导体封装（WSP）及其制造方法。 WSP包括其上安装有半导体芯片的基板; 在衬底上垂直堆叠的多个半导体芯片; 在多个半导体芯片中垂直形成的冷却通孔，并被密封; 形成在冷却通孔圆周上的微孔; 并且冷却剂填充在冷却通孔的内部。 因此，WSP降低了半导体芯片之间的温度差，并且迅速消散了堆叠的半导体芯片产生的热量。

公开(公告)号：US20120182569A1

公开(公告)日：2012-07-19

申请号：US13427566

申请日：2012-03-22

Applicant: Hee-Jin Lee

Inventor： Hee-Jin Lee

IPC: G06F3/12

CPC classification number: G06F3/1208 ,  G06F3/1205 ,  G06F3/1256 ,  G06F3/1284

Abstract: An apparatus and method are provided for setting a printing option using a preview image. Setting the printing option includes an image preview unit displaying a preview image corresponding to printing data and enabling the preview image to be manipulated for setting a printing setting, a control unit controlling printing of the preview image according to the printing setting of the manipulated preview image, and a printing option setting unit setting a printing option, wherein the control unit applies the printing setting of the preview image to the printing option of the printing option setting unit.

Abstract translation: 提供了一种用于使用预览图像设置打印选项的装置和方法。 设置打印选项包括图像预览单元，其显示对应于打印数据的预览图像，并且使得能够操纵预览图像以设置打印设置;控制单元，根据操作的预览图像的打印设置来控制预览图像的打印 以及设置打印选项的打印选项设置单元，其中控制单元将预览图像的打印设置应用于打印选项设置单元的打印选项。

公开(公告)号：US07959989B2

公开(公告)日：2011-06-14

申请号：US12448198

申请日：2008-03-06

Applicant: Heon Kim ,  Sung-Ho Chun ,  Hee-Jin Lee ,  Dmitry Kravchuk ,  Kyung-Jun Kim ,  Sang-Kook Kim ,  Sung-Joon Oh ,  Hye-Ran Seong ,  Byung-Hyun Lee ,  Hye-Won Jeong ,  Jung-Ho Jo ,  Yun-Jeong Lee ,  Dong-Hyun Oh

Inventor： Heon Kim ,  Sung-Ho Chun ,  Hee-Jin Lee ,  Dmitry Kravchuk ,  Kyung-Jun Kim ,  Sang-Kook Kim ,  Sung-Joon Oh ,  Hye-Ran Seong ,  Byung-Hyun Lee ,  Hye-Won Jeong ,  Jung-Ho Jo ,  Yun-Jeong Lee ,  Dong-Hyun Oh

IPC: C09K19/38 ,  C08F136/20 ,  C07C69/52 ,  C08F4/70

CPC classification number: C07D303/40 ,  C07C69/73 ,  C07C69/734 ,  C07C2602/42 ,  G02F1/133711 ,  G02F1/133788 ,  Y10T428/1005

Abstract: The present invention relates to a novel cyclic olefin compound, a polymer including the cyclic olefin compound, a liquid crystal alignment film including the polymer, and a liquid crystal display device including the liquid crystal alignment film. Since the polymer includes the cyclic olefin compound as a main chain, the thermal stability is excellent and the photoreactive speed is high. Accordingly, the production time can be reduced, the production cost can be reduced, and the anchoring force of the liquid crystal can be increased because the alignment property is stabilized due to the curing.

Abstract translation: 本发明涉及一种新型的环状烯烃化合物，包含该环状烯烃化合物的聚合物，包含该聚合物的液晶取向膜以及包括该液晶取向膜的液晶显示装置。 由于聚合物包含环状烯烃化合物作为主链，所以热稳定性优异，光反应速度快。 因此，可以降低生产时间，降低生产成本，并且由于固化而使取向性能稳定，可以提高液晶的锚固力。

公开(公告)号：US08344601B2

公开(公告)日：2013-01-01

申请号：US12691156

申请日：2010-01-21

Applicant: Joong-Hyun Baek ,  Hee-Jin Lee

Inventor： Joong-Hyun Baek ,  Hee-Jin Lee

IPC: H01J1/02

CPC classification number: H01L33/647 ,  G02B6/0023 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/01066 ,  H01L2924/00014

Abstract: A light emitting device with improved heat dissipation is provided. The light emitting device includes a first lead frame, a second lead frame, a light emitting element and a housing. The first lead frame includes a light emitting element mounting portion, a first heat dissipation portion extending from the light emitting element mounting portion in a first direction, and second and third heat dissipation portions extending from the light emitting element mounting portion in a second direction opposite to the first direction. The second lead frame extends in the second direction and is disposed between and spaced apart from the second and third heat dissipation portions. The light emitting element is mounted on the light emitting element mounting portion and is electrically coupled to the first and second lead frames. The housing encapsulates the first and second lead frames. The second and third heat dissipation portions have a first width and the second lead frame has a second width the same as or different from the first width.

Abstract translation: 提供了具有改善的散热的发光装置。 发光器件包括第一引线框架，第二引线框架，发光元件和壳体。 第一引线框架包括发光元件安装部分，从第一方向从发光元件安装部分延伸的第一散热部分和从发光元件安装部分沿相反的第二方向延伸的第二和第三散热部分 到第一个方向。 第二引线框架沿第二方向延伸并且设置在第二和第三散热部分之间并与第二和第三散热部分间隔开。 发光元件安装在发光元件安装部分上并且电耦合到第一引线框架和第二引线框架。 壳体封装第一和第二引线框架。 第二和第三散热部分具有第一宽度，第二引线框架具有与第一宽度相同或不同的第二宽度。