公开(公告)号：US09875969B2

公开(公告)日：2018-01-23

申请号：US13531827

申请日：2012-06-25

申请人： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

发明人： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

IPC分类号： H01L23/12 ,  H01L23/538 ,  H01L23/13 ,  H01L23/00 ,  H01L25/065 ,  H01L21/683

CPC分类号： H01L23/5385 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00

摘要： A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

公开(公告)号：US08227904B2

公开(公告)日：2012-07-24

申请号：US12459007

申请日：2009-06-24

申请人： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

发明人： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

IPC分类号： H01L23/538

CPC分类号： H01L23/5385 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00

摘要： A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

摘要翻译： 多芯片封装包括具有第一侧面（111），相对的第二侧面（112）和从第一侧向第二侧延伸的第三侧面（213）的基板（110），第一模具（120） ）和附接到所述基板的第一侧的第二模具（130），以及邻近所述基板的第三侧并连接到所述第一模具和所述第二模具的桥接件（140） 。 基板的任何部分都不在桥下。 该桥在第一管芯和第二管芯之间形成连接。 或者，桥可以设置在衬底中的空腔（615,915）中，或者设置在衬底和裸片层（750）之间。 该桥可以构成一个有源管芯，并且可以使用引线键连接到衬底（241,841,1141,1541）。

公开(公告)号：US20100327424A1

公开(公告)日：2010-12-30

申请号：US12459007

申请日：2009-06-24

申请人： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

发明人： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

IPC分类号： H01L23/538 ,  H01L21/60

CPC分类号： H01L23/5385 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00

摘要： A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

摘要翻译： 多芯片封装包括具有第一侧面（111），相对的第二侧面（112）和从第一侧向第二侧延伸的第三侧面（213）的基板（110），第一模具（120） ）和附接到所述基板的第一侧的第二模具（130），以及邻近所述基板的第三侧并连接到所述第一模具和所述第二模具的桥接件（140） 。 基板的任何部分都不在桥下。 该桥在第一管芯和第二管芯之间形成连接。 或者，桥可以设置在衬底中的空腔（615,915）中，或者设置在衬底和裸片层（750）之间。 该桥可以构成一个有源管芯，并且可以使用引线键连接到衬底（241,841,1141,1541）。

公开(公告)号：US20120261838A1

公开(公告)日：2012-10-18

申请号：US13531827

申请日：2012-06-25

申请人： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

发明人： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

IPC分类号： H01L25/07 ,  H01L21/60 ,  H01L23/538

CPC分类号： H01L23/5385 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00

摘要： A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

摘要翻译： 多芯片封装包括具有第一侧面（111），相对的第二侧面（112）和从第一侧向第二侧延伸的第三侧面（213）的基板（110），第一模具（120） ）和附接到所述基板的第一侧的第二模具（130），以及邻近所述基板的第三侧并连接到所述第一模具和所述第二模具的桥接件（140） 。 基板的任何部分都不在桥下。 该桥在第一管芯和第二管芯之间形成连接。 或者，桥可以设置在衬底中的空腔（615,915）中，或者设置在衬底和裸片层（750）之间。 该桥可以构成一个有源管芯，并且可以使用引线键连接到衬底（241,841,1141,1541）。

公开(公告)号：US20180026393A1

公开(公告)日：2018-01-25

申请号：US15215531

申请日：2016-07-20

申请人： Feras Eid ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Amit Sudhir Baxi ,  Vincent S. Mageshkumar

发明人： Feras Eid ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Amit Sudhir Baxi ,  Vincent S. Mageshkumar

IPC分类号： H01R13/62 ,  H01R13/631 ,  H01R13/627

CPC分类号： H01R13/6205 ,  H01R11/30 ,  H01R13/627 ,  H01R13/631

摘要： Discussed generally herein are methods and devices including or providing a magnetic, detachable, conductive connector to provide an electrical and mechanical connection between parts. A device can include a first substrate, at least one electric component on or at least partially in a first surface of the first substrate, an adhesive on the first surface of the first substrate to temporarily attached the device to skin of a user, a contact pad electrically coupled to an electric component of the at least one electric component, the contact pad on or at least partially in a second surface of the substrate, the first surface opposite the second surface, and a conductive magnetic connector electrically and mechanically connected to the contact pad through a first conductive adhesive.

公开(公告)号：US20190207290A1

公开(公告)日：2019-07-04

申请号：US16325351

申请日：2016-09-30

申请人： Brandon M. Rawlings ,  Shawna M. Liff ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Aleksandar Aleksov, I ,  Johanna M. Swan ,  Richard J. Dischier

发明人： Brandon M. Rawlings ,  Shawna M. Liff ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Aleksandar Aleksov, I ,  Johanna M. Swan ,  Richard J. Dischier

IPC分类号： H01P11/00 ,  H01P3/12 ,  H01P3/14 ,  H01P3/123

CPC分类号： H01P11/002 ,  H01P3/122 ,  H01P3/123 ,  H01P3/14

摘要： A method of making a waveguide, comprises: extruding a first dielectric material as a waveguide core of the waveguide, wherein the waveguide core is elongate; and coextruding an outer layer with the waveguide core, wherein the outer layer is arranged around the waveguide core.

公开(公告)号：US20140085846A1

公开(公告)日：2014-03-27

申请号：US13625406

申请日：2012-09-24

申请人： Qing Ma ,  Johanna M. Swan ,  Robert Starkston ,  John S. Guzek ,  Robert L. Sankman ,  Aleksandar Aleksov

发明人： Qing Ma ,  Johanna M. Swan ,  Robert Starkston ,  John S. Guzek ,  Robert L. Sankman ,  Aleksandar Aleksov

IPC分类号： H05K1/18 ,  B32B38/04 ,  B32B38/10 ,  H05K1/00

CPC分类号： H01L23/5386 ,  B32B2457/08 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/08238 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/81192 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/18162 ,  H01L2924/2064 ,  H01L2924/20641 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4688 ,  H05K2201/017 ,  H05K2203/1469 ,  Y10T156/1057 ,  H01L2924/014 ,  H01L2924/00

摘要： Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.

摘要翻译： 本说明书的实施例涉及制造微电子结构的领域。 微电子结构可以包括与轨迹路由结构分开形成的玻璃布线结构，其中玻璃布线结构以层叠或嵌入的形式结合到迹线布线基板中。 还公开了微电子封装的实施例，其包括设置在微电子衬底的玻璃布线结构附近并通过多个互连与微电子衬底耦合的至少一个微电子器件。 此外，公开了微电子结构的实施例，其包括嵌入微电子密封剂内的至少一个微电子器件，该微电子器件具有连接到微电子密封剂的玻璃布线结构和形成在玻璃布线结构上的迹线布线结构。

公开(公告)号：US20180084643A1

公开(公告)日：2018-03-22

申请号：US15267872

申请日：2016-09-16

申请人： Amit Sudhir Baxi ,  Vincent S. Mageshkumar ,  Adel A. Elsherbini ,  Sasha Oster ,  Feras Eid ,  Aleksandar Aleksov ,  Johanna M. Swan

发明人： Amit Sudhir Baxi ,  Vincent S. Mageshkumar ,  Adel A. Elsherbini ,  Sasha Oster ,  Feras Eid ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC分类号： H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC分类号： H05K1/147 ,  A61B5/00 ,  A61B5/6833 ,  A61B2562/164 ,  A61B2562/166 ,  H05K1/0283 ,  H05K1/112 ,  H05K1/181 ,  H05K3/365 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10303 ,  H05K2201/10318

摘要： A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.

公开(公告)号：US20180308792A1

公开(公告)日：2018-10-25

申请号：US15762548

申请日：2015-09-25

申请人： Vivek Raghunathan ,  Yonggang Li ,  Aleksandar Aleksov ,  Adel A. Elsherbini ,  Johanna M. Swan

发明人： Vivek Raghunathan ,  Yonggang Li ,  Aleksandar Aleksov ,  Adel A. Elsherbini ,  Johanna M. Swan

IPC分类号： H01L23/498 ,  H01L21/48 ,  B23K26/06 ,  H01L21/768 ,  B23K26/36

摘要： Discussed generally herein are methods and devices for flexible fabrics or that otherwise include thin traces. A device can include a flexible polyimide material, and a first plurality of traces on the flexible polyimide material, wherein the first plurality of traces are patterned on the flexible polyimide material using laser spallation.

公开(公告)号：US20180097268A1

公开(公告)日：2018-04-05

申请号：US15282050

申请日：2016-09-30

申请人： Sasha Oster ,  Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Teles Kamgaing ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

发明人： Sasha Oster ,  Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Teles Kamgaing ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC分类号： H01P3/16 ,  H01P11/00 ,  H05K7/14

CPC分类号： H01P3/122 ,  H01P3/14 ,  H01P3/16 ,  H01P11/006

摘要： A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.