-
公开(公告)号：US08758546B2
公开(公告)日：2014-06-24
申请号：US13805553
申请日：2011-09-12
IPC分类号： H01L21/00
CPC分类号： H01L24/29 , B32B7/12 , B32B27/08 , B32B27/281 , B32B27/283 , B32B27/304 , B32B27/32 , B32B27/36 , B32B2307/306 , B32B2307/416 , B32B2307/536 , B32B2457/00 , C08L27/06 , C08L67/00 , C08L79/08 , C08L83/04 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L25/0753 , H01L33/005 , H01L33/48 , H01L33/60 , H01L33/62 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29387 , H01L2224/2939 , H01L2224/294 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75315 , H01L2224/75317 , H01L2224/7532 , H01L2224/7598 , H01L2224/75985 , H01L2224/81001 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81444 , H01L2224/83192 , H01L2224/83203 , H01L2224/8385 , H01L2224/83851 , H01L2224/83907 , H01L2224/9205 , H01L2224/9211 , H01L2224/92143 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2933/0033 , H01L2933/0066 , Y10T156/10 , Y10T428/24967 , Y10T428/31544 , Y10T428/31663 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A buffer film for multi-chip packaging which does not cause out of alignment during multi-chip packaging and ensures favorable connection reliability has a structure in which a heat-resistant resin layer having a linear expansion coefficient of 80 ppm/° C. or less and a flexible resin layer made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80 are laminated. A multi-chip module can be produced by aligning a plurality of chip devices on a substrate through an adhesive to perform temporary adhesion, disposing the buffer film for multi-chip packaging between the chip devices and a bonding head so that the heat-resistant resin layer is on a chip device side, and connecting the plurality of chip devices with the substrate by applying heat and pressure to the chip devices toward the substrate with the bonding head.
摘要翻译： 用于多芯片封装的缓冲膜在多芯片封装期间不会导致对准并且确保良好的连接可靠性具有这样的结构，其中线膨胀系数为80ppm /℃或更低的耐热树脂层 并且层压由具有根据JIS K6253的肖氏A硬度为10至80的树脂材料制成的柔性树脂层。 可以通过粘合剂对基板上的多个芯片装置进行临时粘合，在芯片装置之间设置用于多芯片封装的缓冲膜和接合头，从而制造多芯片模块，使得耐热树脂 层位于芯片器件侧，并且通过利用接合头向衬底施加热和压力来将多个芯片器件与衬底连接。
-
2.发明申请CURABLE RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, DIE-BONDING AGENT, NON-CONDUCTIVE PASTE, ADHESIVE EPOXY RESIN FILM, NON-CONDUCTIVE EPOXY RESIN FILM, ANISOTROPIC CONDUCTIVE PASTE, AND ANISOTROPIC CONDUCTIVE FILM 审中-公开可固化树脂组合物，粘合剂环氧树脂粘合剂，粘合剂，非导电性粘合剂，粘合性环氧树脂膜，非导电性环氧树脂膜，各向异性导电胶和各向异性导电膜公开(公告)号：US20130056686A1
公开(公告)日：2013-03-07
申请号：US13640540
申请日：2011-04-13
IPC分类号： C08F224/00 , H01B1/12 , C09J163/06 , C08L63/06 , C08K5/1545
CPC分类号： C08G59/42 , C08F220/18 , C08L33/068 , C08L63/00 , C09J9/02 , C09J163/00 , H01L2224/14 , H01L2224/48091 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , C08F2220/1808 , C08F2220/325 , H01L2924/00014
摘要： To provide a curable resin composition that can improve resistant properties such as thermal impact resistance even in a high-temperature and high-humidity environment and has a high adhesive property, high conduction reliability and superior crack resistant property. The curable resin composition contains an epoxy resin and an epoxy resin-use curing agent, and is characterized in that a difference between a maximum value of tan δ in a viscoelastic spectrum and a value of the tan δ at −40° C. thereof is 0.1 or more.
摘要翻译： 为了提供即使在高温高湿环境下也能够提高耐热冲击性等耐性的固化性树脂组合物，具有高粘合性，高导电性和优异的抗龟裂性。 固化性树脂组合物含有环氧树脂和环氧树脂用固化剂，其特征在于，粘弹性光谱中的tanδ的最大值与其-40℃下的tanδ的值之差为 0.1以上。
-
3.发明授权Light-reflective anisotropic conductive adhesive agent, and light emitting device 有权光反射各向异性导电粘合剂和发光装置公开(公告)号：US08916894B2
公开(公告)日：2014-12-23
申请号：US13640784
申请日：2011-04-13
IPC分类号： H01L23/48 , C09J11/04 , C09J9/02 , H01L33/60 , H01L23/00 , H01L33/62 , C08K3/22 , C08K9/06 , H01L33/40
CPC分类号： C09J9/02 , C08K3/08 , C08K3/22 , C08K3/24 , C08K7/08 , C08K9/06 , C08K2003/0831 , C08K2003/2241 , C08K2003/2296 , C09J11/04 , H01L24/06 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L33/405 , H01L33/60 , H01L33/62 , H01L2224/0401 , H01L2224/13339 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/29339 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2224/83385 , H01L2224/83855 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01081 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/10157 , H01L2924/12041 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A light-reflective anisotropic conductive adhesive and light-emitting device capable of maintaining luminous efficiency of a light-emitting element and preventing the occurrence of a crack to obtain conduction reliability are provided. The light-reflective anisotropic conductive adhesive contains a thermosetting resin composite, conductive particles, and a light-reflective acicular insulating particles. These light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group including titanium oxide, zinc oxide, and titanate.
摘要翻译： 提供了能够保持发光元件的发光效率并防止发生裂纹以获得导通可靠性的光反射各向异性导电粘合剂和发光装置。 光反射各向异性导电粘合剂含有热固性树脂复合物，导电颗粒和光反射针状绝缘颗粒。 这些光反射针状绝缘粒子是选自氧化钛，氧化锌，钛酸盐中的至少一种的无机粒子。
-
4.发明申请公开(公告)号：US20130264602A1
公开(公告)日：2013-10-10
申请号：US13995033
申请日：2012-02-23
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , C09J9/02 , H01L24/29 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/294 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81903 , H01L2224/83851 , H01L2224/9211 , H01L2924/00014 , H01L2924/01029 , H01L2924/07811 , H01L2924/12041 , H01L2924/181 , H01L2924/3512 , H01L2924/00 , H01L2924/00015 , H01L2924/00012 , H01L2924/05341 , H01L2924/05432 , H01L2224/81 , H01L2224/83 , H01L2224/05599
摘要： A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board contains a thermosetting resin composition, conductive particles, light-reflective needle-shaped insulating particles, and light-reflective spherical insulating particles. Each of the amount of the light-reflective needle-shaped insulating particles and the amount of the light-reflective spherical insulating particles in the thermosetting resin composition is 1 to 50 percent by volume based on the volume of the thermosetting resin composition, and the mixing ratio (V/V) of the light-reflective spherical insulating particles to the light-reflective needle-shaped insulating particles is 1:1 to 10. The light-reflective needle-shaped insulating particles are titanium oxide whiskers, zinc oxide whiskers, titanate whiskers, aluminum borate whiskers, or wollastonite.
摘要翻译： 用于发光元件与布线基板的各向异性导电连接的光反射各向异性导电粘合剂包含热固性树脂组合物，导电颗粒，反光针状绝缘颗粒和光反射球形绝缘颗粒。 热固性树脂组合物中的光反射性针状绝缘粒子的量和光反射球形绝缘粒子的量相对于热固性树脂组合物的体积为1〜50体积％，混合 光反射球形绝缘粒子与光反射性针状绝缘粒子的比例（V / V）为1:1〜10。光反射针状绝缘粒子为氧化钛晶须，氧化锌晶须，钛酸盐 晶须，硼酸铝晶须或硅灰石。
-
公开(公告)号：US20130092310A1
公开(公告)日：2013-04-18
申请号：US13805553
申请日：2011-09-12
CPC分类号： H01L24/29 , B32B7/12 , B32B27/08 , B32B27/281 , B32B27/283 , B32B27/304 , B32B27/32 , B32B27/36 , B32B2307/306 , B32B2307/416 , B32B2307/536 , B32B2457/00 , C08L27/06 , C08L67/00 , C08L79/08 , C08L83/04 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/95 , H01L25/0753 , H01L33/005 , H01L33/48 , H01L33/60 , H01L33/62 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29387 , H01L2224/2939 , H01L2224/294 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75315 , H01L2224/75317 , H01L2224/7532 , H01L2224/7598 , H01L2224/75985 , H01L2224/81001 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81444 , H01L2224/83192 , H01L2224/83203 , H01L2224/8385 , H01L2224/83851 , H01L2224/83907 , H01L2224/9205 , H01L2224/9211 , H01L2224/92143 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2933/0033 , H01L2933/0066 , Y10T156/10 , Y10T428/24967 , Y10T428/31544 , Y10T428/31663 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/3512
摘要： A buffer film for multi-chip packaging which does not cause out of alignment during multi-chip packaging and ensures favorable connection reliability has a structure in which a heat-resistant resin layer having a linear expansion coefficient of 80 ppm/° C. or less and a flexible resin layer made of a resin material having a Shore A hardness according to JIS K6253 of 10 to 80 are laminated. A multi-chip module can be produced by aligning a plurality of chip devices on a substrate through an adhesive to perform temporary adhesion, disposing the buffer film for multi-chip packaging between the chip devices and a bonding head so that the heat-resistant resin layer is on a chip device side, and connecting the plurality of chip devices with the substrate by applying heat and pressure to the chip devices toward the substrate with the bonding head.
摘要翻译： 用于多芯片封装的缓冲膜在多芯片封装期间不会导致对准并且确保良好的连接可靠性具有这样的结构，其中线膨胀系数为80ppm /℃或更低的耐热树脂层 并且层压由具有根据JIS K6253的肖氏A硬度为10至80的树脂材料制成的柔性树脂层。 可以通过粘合剂对基板上的多个芯片装置进行临时粘合，在芯片装置之间设置用于多芯片封装的缓冲膜和接合头，从而制造多芯片模块，使得耐热树脂 层位于芯片器件侧，并且通过利用接合头向衬底施加热和压力来将多个芯片器件与衬底连接。
-
6.发明授权公开(公告)号：US08852462B2
公开(公告)日：2014-10-07
申请号：US13805238
申请日：2012-03-14
IPC分类号： H01B1/00 , C08L83/00 , H01L33/62 , H01L33/60 , H01B3/00 , C08G77/38 , C09J183/06 , H01B1/22 , H01L33/46 , C09J9/02 , C08K5/09 , C08G77/12 , C08K3/22 , C08K5/00
CPC分类号： H01L33/46 , C08G77/12 , C08G77/38 , C08K5/0025 , C08K5/09 , C08K2003/2241 , C08K2003/2296 , C09J9/02 , C09J183/06 , H01B1/22 , H01B3/00 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/07811 , H01L2924/00 , H01L2924/00014
摘要： A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition containing a silicone resin and a curing agent, conductive particles and light-reflective insulating particles. The light-reflective insulating particle is at least one kind of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, silicon oxide, and aluminum oxide. The silicone resin is a glycidyloxyalkyl-alicyclic alkyl-modified organopolysiloxane.
摘要翻译： 用于发光元件与布线基板的各向异性导电连接的光反射各向异性导电粘合剂包括含有有机硅树脂和固化剂的热固性树脂组合物，导电颗粒和光反射绝缘颗粒。 光反射绝缘粒子是选自氧化钛，氮化硼，氧化锌，氧化硅，氧化铝中的至少一种无机粒子。 有机硅树脂是缩水甘油氧基烷基 - 脂环族烷基改性的有机聚硅氧烷。
-
公开(公告)号：US08710662B2
公开(公告)日：2014-04-29
申请号：US13516005
申请日：2011-05-27
申请人： Hideaki Umakoshi , Hidetsugu Namiki , Akira Ishigami , Masaharu Aoki , Shiyuki Kanisawa , Yoshihisa Shinya
发明人： Hideaki Umakoshi , Hidetsugu Namiki , Akira Ishigami , Masaharu Aoki , Shiyuki Kanisawa , Yoshihisa Shinya
IPC分类号： H01L23/48
CPC分类号： H01L24/29 , C08G59/687 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/60 , H01L33/62 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/29101 , H01L2224/2929 , H01L2224/29339 , H01L2224/29386 , H01L2224/29444 , H01L2224/2949 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/81444 , H01L2224/83192 , H01L2224/83203 , H01L2224/8359 , H01L2224/836 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/83664 , H01L2224/83687 , H01L2224/83744 , H01L2224/83755 , H01L2224/83851 , H01L2224/83862 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2224/29298 , H01L2924/00 , H01L2924/053 , H01L2924/00012 , H01L2924/05432 , H01L2224/29318 , H01L2224/29366 , H01L2924/05341 , H01L2924/049
摘要： A light-reflective anisotropic conductive paste is used as an anisotropic conductive paste when a light-emitting device is produced by flip-chip mounting a light-emitting element such as a light-emitting diode element (LED) on a wiring board. The light-reflective anisotropic conductive paste includes light-reflective insulating particles, in order to improve light emission efficiency without providing, in the LED, a light-reflecting layer that causes an increase in manufacturing cost. With the light-reflective anisotropic conductive paste, a reduction in bonding strength of the light-emitting element to the wiring board in a high-temperature environment can be suppressed, and a reduction in conduction reliability after a TCT can also be suppressed. In the light-reflective anisotropic conductive paste, conductive particles and the light-reflective insulating particles are dispersed in a thermosetting resin composition. The thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent.
摘要翻译： 当通过在布线板上安装诸如发光二极管元件（LED）的发光元件倒装芯片来制造发光器件时，使用光反射各向异性导电膏作为各向异性导电膏。 光反射各向异性导电浆料包括光反射绝缘颗粒，以便在LED中不提供导致制造成本增加的光反射层而提高发光效率。 通过使用光反射性各向异性导电膏，可以抑制发光元件在高温环境下对配线基板的接合强度的降低，并且还可以抑制TCT之后的导通可靠性的降低。 在光反射各向异性导电膏中，导电粒子和光反射绝缘粒子分散在热固性树脂组合物中。 热固性树脂组合物含有环氧化合物和热催化剂型固化剂。
-
公开(公告)号：US20130087825A1
公开(公告)日：2013-04-11
申请号：US13805238
申请日：2012-03-14
CPC分类号： H01L33/46 , C08G77/12 , C08G77/38 , C08K5/0025 , C08K5/09 , C08K2003/2241 , C08K2003/2296 , C09J9/02 , C09J183/06 , H01B1/22 , H01B3/00 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/07811 , H01L2924/00 , H01L2924/00014
摘要： A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition containing a silicone resin and a curing agent, conductive particles and light-reflective insulating particles. The light-reflective insulating particle is at least one kind of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, silicon oxide, and aluminum oxide. The silicone resin is a glycidyloxyalkyl-alicyclic alkyl-modified organopolysiloxane.
摘要翻译： 用于发光元件与布线基板的各向异性导电连接的光反射各向异性导电粘合剂包括含有有机硅树脂和固化剂的热固性树脂组合物，导电颗粒和光反射绝缘颗粒。 光反射绝缘粒子是选自氧化钛，氮化硼，氧化锌，氧化硅，氧化铝中的至少一种无机粒子。 有机硅树脂是缩水甘油氧基烷基 - 脂环族烷基改性的有机聚硅氧烷。
-
9.发明申请公开(公告)号：US20130049054A1
公开(公告)日：2013-02-28
申请号：US13640784
申请日：2011-04-13
CPC分类号： C09J9/02 , C08K3/08 , C08K3/22 , C08K3/24 , C08K7/08 , C08K9/06 , C08K2003/0831 , C08K2003/2241 , C08K2003/2296 , C09J11/04 , H01L24/06 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L33/405 , H01L33/60 , H01L33/62 , H01L2224/0401 , H01L2224/13339 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/29339 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2224/83385 , H01L2224/83855 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01081 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/10157 , H01L2924/12041 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A light-reflective anisotropic conductive adhesive and light-emitting device capable of maintaining luminous efficiency of a light-emitting element and preventing the occurrence of a crack to obtain conduction reliability are provided. The light-reflective anisotropic conductive adhesive contains a thermosetting resin composite, conductive particles, and a light-reflective acicular insulating particles. These light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group including titanium oxide, zinc oxide, and titanate.
摘要翻译： 提供了能够保持发光元件的发光效率并防止发生裂纹以获得导通可靠性的光反射各向异性导电粘合剂和发光装置。 光反射各向异性导电粘合剂含有热固性树脂复合物，导电颗粒和光反射针状绝缘颗粒。 这些光反射针状绝缘粒子是选自氧化钛，氧化锌，钛酸盐中的至少一种的无机粒子。
-
公开(公告)号：US20120248495A1
公开(公告)日：2012-10-04
申请号：US13516005
申请日：2011-05-27
申请人： Hideaki Umakoshi , Hidetsugu Namiki , Akira Ishigami , Masaharu Aoki , Shiyuki Kanisawa , Yoshihisa Shinya
发明人： Hideaki Umakoshi , Hidetsugu Namiki , Akira Ishigami , Masaharu Aoki , Shiyuki Kanisawa , Yoshihisa Shinya
CPC分类号： H01L24/29 , C08G59/687 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/60 , H01L33/62 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/29101 , H01L2224/2929 , H01L2224/29339 , H01L2224/29386 , H01L2224/29444 , H01L2224/2949 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/81444 , H01L2224/83192 , H01L2224/83203 , H01L2224/8359 , H01L2224/836 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/83664 , H01L2224/83687 , H01L2224/83744 , H01L2224/83755 , H01L2224/83851 , H01L2224/83862 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2224/29298 , H01L2924/00 , H01L2924/053 , H01L2924/00012 , H01L2924/05432 , H01L2224/29318 , H01L2224/29366 , H01L2924/05341 , H01L2924/049
摘要： A light-reflective anisotropic conductive paste is used as an anisotropic conductive paste when a light-emitting device is produced by flip-chip mounting a light-emitting element such as a light-emitting diode element (LED) on a wiring board. The light-reflective anisotropic conductive paste includes light-reflective insulating particles, in order to improve light emission efficiency without providing, in the LED, a light-reflecting layer that causes an increase in manufacturing cost. With the light-reflective anisotropic conductive paste, a reduction in bonding strength of the light-emitting element to the wiring board in a high-temperature environment can be suppressed, and a reduction in conduction reliability after a TCT can also be suppressed. In the light-reflective anisotropic conductive paste, conductive particles and the light-reflective insulating particles are dispersed in a thermosetting resin composition. The thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent.
摘要翻译： 当通过在布线板上安装诸如发光二极管元件（LED）的发光元件倒装芯片来制造发光器件时，使用光反射各向异性导电膏作为各向异性导电膏。 光反射各向异性导电浆料包括光反射绝缘颗粒，以便在LED中不提供导致制造成本增加的光反射层而提高发光效率。 通过使用光反射性各向异性导电膏，可以抑制发光元件在高温环境下对配线基板的接合强度的降低，并且还可以抑制TCT之后的导通可靠性的降低。 在光反射各向异性导电膏中，导电粒子和光反射绝缘粒子分散在热固性树脂组合物中。 热固性树脂组合物含有环氧化合物和热催化剂型固化剂。
-
-
-
-
-
-
-
-
-
搜索结果
19 条记录 (耗时 0.028 秒)
