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    Multi-stacked memory package
    4.
    发明授权
    Multi-stacked memory package 有权
    多堆叠内存包

    公开(公告)号：US06683377B1

    公开(公告)日：2004-01-27

    申请号：US09583183

    申请日：2000-05-30

    申请人： Il Kwon Shim ,  Vincent DiCaprio

    发明人： Il Kwon Shim ,  Vincent DiCaprio

    IPC分类号： H01L2334

    CPC分类号： H01L25/0657 ,  H01L23/5387 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00

    摘要： A multiple chip package and method of making the package allow multiple same size or different size chips to be stacked over each other, thereby creating a thin profile multi-chip package. Chips are attached to one surface of a continuous flexible substrate. The substrate has a metallization layer, which is electrically connected to the chips, such as via bond wires attached to center bond pads of the chips and to bond fingers on the metallization layer. Interconnections, such as solder balls, are attached to the other surface of the substrate and only at the portion opposite to the first chip. The substrate is folded to bring the first chip toward a second chip, which are then attached, such as with an insulative adhesive spacer. If any additional chips remain on the substrate, the substrate is folded to sequentially bring each additional chip toward the surface of the substrate opposite to the preceding chip and is secured thereto.

    摘要翻译： 制造封装的多芯片封装和方法允许多个相同尺寸或​​不同尺寸的芯片彼此堆叠，从而形成薄型多芯片封装。 芯片连接到连续柔性基板的一个表面。 衬底具有电连接到芯片的金属化层，例如连接到芯片的中心接合焊盘的通孔接合线，并且在金属化层上粘合指状物。 诸如焊球之类的互连连接到衬底的另一表面，并且仅在与第一芯片相对的部分处。 将基板折叠以将第一芯片朝向第二芯片，然后将其连接，例如用绝缘粘合剂间隔件。 如果在基板上剩余另外的芯片，则将基板折叠成顺序地使每个附加芯片朝向与先前芯片相对的基板的表面并固定到其上。

    Method of making an integrated circuit package using a batch step for curing a die attachment film and a tool system for performing the method
    10.
    发明授权
    Method of making an integrated circuit package using a batch step for curing a die attachment film and a tool system for performing the method 有权
    使用用于固化模具附着膜的批量步骤制造集成电路封装的方法和用于执行该方法的工具系统

    公开(公告)号：US06517656B1

    公开(公告)日：2003-02-11

    申请号：US09412889

    申请日：1999-10-05

    申请人： Vincent DiCaprio

    发明人： Vincent DiCaprio

    IPC分类号： B32B3120

    CPC分类号： H01L24/83 ,  H01L24/75 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00

    摘要： Methods of making packages for integrated circuit devices, and in particular for attaching a plurality of integrated circuit die to a substrate strip, are disclosed. The substrate includes a plurality of die mounting sites. A B-staged epoxy film is on each site. An exemplary method includes placing an integrated circuit die on the adhesive film of each site. After a plurality of integrated circuit die are individually placed on the substrate, the adhesive films of a plurality of sites are cured simultaneously in a batch process. The curing permanently attaches the die to the substrate. Subsequently, the die are wire bonded to their respective substrate sites and encapsulated. The encapsulated substrate is cut to form individual packages. A tool system for performing the die attachment process includes a head for picking up a die and placing the die on an adhesive film on the substrate strip, and a pair of opposing plates capable of pressing together and applying pressure and heat to a plurality of sites simultaneously so as to cure the adhesive film of the plurality of sites.

    摘要翻译： 公开了用于集成电路器件的封装的方法，特别是用于将多个集成电路管芯附着到衬底条上的方法。 基板包括多个模具安装位置。 每个站点都有一个B级环氧膜。 一种示例性方法包括将集成电路管芯放置在每个部位的粘合膜上。 在将多个集成电路芯片分别放置在基板上之后，多个部位的粘合膜在批处理中同时固化。 固化将模具永久地附着到基底上。 随后，管芯被引线键合到它们各自的衬底部位并封装。 封装的衬底被切割以形成单独的封装。 用于执行模具附接工艺的工具系统包括用于拾取模具并将模具放置在衬底条上的粘合剂膜上的头部，以及一对能够压在一起并向多个部位施加压力和热量的相对板 同时固化多个部位的粘合膜。