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1.发明授权Fabrication of phosphor dots and application of phosphor dots to arrays of lighting elements 有权荧光点的制造和荧光点应用于照明元件的阵列公开(公告)号：US08445308B2
公开(公告)日：2013-05-21
申请号：US13273313
申请日：2011-10-14
IPC分类号： H01L21/00
CPC分类号： H01L33/505 , H01L33/507 , H01L2933/0041
摘要： In accordance with certain embodiments, arrays of phosphor dots are formed and associated with arrays of light-emitting elements to form lighting systems.
摘要翻译： 根据某些实施例，形成荧光点阵列并与发光元件阵列相关联以形成照明系统。
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2.发明申请FABRICATION OF PHOSPHOR DOTS AND APPLICATION OF PHOSPHOR DOTS TO ARRAYS OF LIGHTING ELEMENTS 有权磷光体的制造和磷光体应用于照明元件的阵列公开(公告)号：US20120094406A1
公开(公告)日：2012-04-19
申请号：US13273313
申请日：2011-10-14
IPC分类号： H01L33/50
CPC分类号： H01L33/505 , H01L33/507 , H01L2933/0041
摘要： In accordance with certain embodiments, arrays of phosphor dots are formed and associated with arrays of light-emitting elements to form lighting systems.
摘要翻译： 根据某些实施例，形成荧光点阵列并与发光元件阵列相关联以形成照明系统。
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公开(公告)号：US11950337B2
公开(公告)日：2024-04-02
申请号：US16750030
申请日：2020-01-23
IPC分类号： F21S4/22 , F21S2/00 , F21V21/14 , F21V23/02 , F21V23/06 , H05B45/10 , H05B45/40 , H05B45/44 , H05B45/46 , H05K1/00 , F21V21/005 , F21V23/00 , F21Y105/10 , F21Y105/12 , F21Y115/10
CPC分类号： H05B45/40 , F21S2/00 , F21S4/22 , F21V21/14 , F21V23/02 , F21V23/06 , H05B45/10 , H05B45/44 , H05B45/46 , H05K1/00 , F21V21/005 , F21V23/005 , F21Y2105/10 , F21Y2105/12 , F21Y2115/10 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2224/73204 , H01L2224/16225 , H01L2224/32225 , H01L2924/00
摘要： In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
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公开(公告)号：US10746358B1
公开(公告)日：2020-08-18
申请号：US16455863
申请日：2019-06-28
IPC分类号： F21V23/00 , F21S2/00 , F21V23/06 , E04B1/86 , F21Y105/18 , F21Y115/10 , F21Y105/16
摘要： In accordance with various embodiments, lighting systems features one or more inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels may feature one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals. One or more of the light panels may include sound-absorbing material therebelow and may define one or more apertures that reveal the sound-absorbing material.
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公开(公告)号：US10578259B2
公开(公告)日：2020-03-03
申请号：US15349465
申请日：2016-11-11
IPC分类号： F21V1/00 , F21S4/22 , H05B33/08 , F21S2/00 , F21V21/14 , H05K1/00 , F21V23/00 , F21V23/02 , F21V23/06 , F21Y105/12 , F21Y105/10 , F21Y115/10 , F21V21/005 , F21Y101/00
摘要： In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
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公开(公告)号：US09000663B2
公开(公告)日：2015-04-07
申请号：US14185229
申请日：2014-02-20
IPC分类号： H01L33/50 , H01L33/52 , H01L27/15 , H01L23/495
CPC分类号： H01L33/505 , H01L23/495 , H01L27/15 , H01L27/156 , H01L33/32 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/07811 , H01L2924/00014 , H01L2924/00
摘要： In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.
摘要翻译： 根据某些实施例，至少部分围绕发光管芯的荧光体元件成形为影响色温发散。
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公开(公告)号：US08884534B2
公开(公告)日：2014-11-11
申请号：US14195175
申请日：2014-03-03
CPC分类号： F21S4/22 , F21S2/00 , F21V21/005 , F21V21/14 , F21V23/003 , F21V23/005 , F21V23/02 , F21V23/06 , F21Y2101/00 , F21Y2105/10 , F21Y2105/12 , F21Y2115/10 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H05B33/08 , H05B33/0821 , H05B33/0824 , H05B33/0827 , H05B33/0845 , H05K1/00 , H01L2924/00
摘要： In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
摘要翻译： 根据某些实施例，照明系统包括一个或多个灯片，每个灯片包括多个发光元件串，控制元件和用于向发光元件和控制元件供电的电力导体。
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公开(公告)号：US20140264409A1
公开(公告)日：2014-09-18
申请号：US13828498
申请日：2013-03-14
IPC分类号： H01L33/50
CPC分类号： H01L33/505 , H01L23/495 , H01L27/15 , H01L27/156 , H01L33/32 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/07811 , H01L2924/00014 , H01L2924/00
摘要： In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.
摘要翻译： 根据某些实施例，至少部分围绕发光管芯的荧光体元件成形为影响色温发散。
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公开(公告)号：US08704448B2
公开(公告)日：2014-04-22
申请号：US13970027
申请日：2013-08-19
CPC分类号： F21S4/22 , F21S2/00 , F21V21/005 , F21V21/14 , F21V23/003 , F21V23/005 , F21V23/02 , F21V23/06 , F21Y2101/00 , F21Y2105/10 , F21Y2105/12 , F21Y2115/10 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H05B33/08 , H05B33/0821 , H05B33/0824 , H05B33/0827 , H05B33/0845 , H05K1/00 , H01L2924/00
摘要： In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
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公开(公告)号：US08680567B2
公开(公告)日：2014-03-25
申请号：US14014998
申请日：2013-08-30
CPC分类号： F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
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