Structures for reducing operating voltage in a semiconductor device
    2.
    发明授权
    Structures for reducing operating voltage in a semiconductor device 失效
    用于降低半导体器件中的工作电压的结构

    公开(公告)号:US07473941B2

    公开(公告)日:2009-01-06

    申请号:US11203917

    申请日:2005-08-15

    IPC分类号: H01L33/00

    CPC分类号: H01S5/305

    摘要: A light-emitting device comprises an active region configured to generate light in response to injected charge, and an n-type material layer and a p-type material layer, wherein at least one of the n-type material layer and the p-type material layer is doped with at least two dopants, at least one of the dopants having an ionization energy higher than the ionization energy level of the other dopant.

    摘要翻译: 发光装置包括响应于注入的电荷而被配置为产生光的有源区,以及n型材料层和p型材料层,其中n型材料层和p型材料层中的至少一种 材料层掺杂有至少两种掺杂剂,所述掺杂剂中的至少一种具有高于另一种掺杂剂的电离能级的电离能。

    Transfer chamber metrology for improved device yield
    8.
    发明授权
    Transfer chamber metrology for improved device yield 有权
    转移室计量,提高装置产量

    公开(公告)号:US09076827B2

    公开(公告)日:2015-07-07

    申请号:US13230573

    申请日:2011-09-12

    摘要: Apparatus and method for control of epitaxial growth parameters, for example during manufacture of light emitting diodes (LEDs). Embodiments include PL measurement of a group III-V film following growth while a substrate at an elevated temperature is in a transfer chamber of a multi-chamber cluster tool. In other embodiments, a film thickness measurement, a contactless resistivity measurement, and a particle and/or roughness measure is performed while the substrate is disposed in the transfer chamber. One or more of the measurements performed in the transfer chamber are temperature corrected to room temperature by estimating the elevated temperature based on emission from a GaN base layer disposed below the group III-V film. In other embodiments, temperature correction is based on an absorbance band edge of the GaN base layer determined from collected white light reflectance spectra. Temperature corrected metrology is then used to control growth processes.

    摘要翻译: 用于控制外延生长参数的设备和方法,例如在制造发光二极管(LED)期间。 实施例包括生长后的III-V族薄膜的PL测量,而在高温下的基底处于多腔聚集工具的转移室中。 在其它实施例中,在衬底设置在传送室中的同时,执行膜厚度测量,非接触电阻率测量以及颗粒和/或粗糙度测量。 通过基于从设置在III-V族III膜以下的GaN基底层的发射来估计升高的温度,在传送室中执行的一个或多个测量值被温度校正到室温。 在其他实施例中,温度校正基于由所收集的白光反射光谱确定的GaN基底层的吸收带边缘。 然后使用温度校正计量来控制生长过程。

    METHOD AND SYSTEM FOR PLANAR REGROWTH IN GAN ELECTRONIC DEVICES

    公开(公告)号:US20130292686A1

    公开(公告)日:2013-11-07

    申请号:US13465812

    申请日:2012-05-07

    摘要: A vertical JFET includes a III-nitride substrate and a III-nitride epitaxial layer of a first conductivity type coupled to the III-nitride substrate. The first III-nitride epitaxial layer has a first dopant concentration. The vertical JFET also includes a III-nitride epitaxial structure coupled to the first III-nitride epitaxial layer. The III-nitride epitaxial structure includes a set of channels of the first conductivity type and having a second dopant concentration, a set of sources of the first conductivity type, having a third dopant concentration greater than the first dopant concentration, and each characterized by a contact surface, and a set of regrown gates interspersed between the set of channels. An upper surface of the set of regrown gates is substantially coplanar with the contact surfaces of the set of sources.