公开(公告)号：US07345881B2

公开(公告)日：2008-03-18

申请号：US11379417

申请日：2006-04-20

申请人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Eric Alan Eckberg ,  James Dorance Gerken ,  Roger Duane Hamilton ,  Maurice Francis Holahan

发明人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Eric Alan Eckberg ,  James Dorance Gerken ,  Roger Duane Hamilton ,  Maurice Francis Holahan

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L2224/16225 ,  Y10T24/44017 ,  Y10T24/44026

摘要： A load frame has an open region exposing a surface of an electronic component. A heat sink is disposed on the load frame and has a surface in thermal contact with the surface of the electronic component. A non-influencing fastener is disposed within a bore in the heat sink and threaded into the load frame for securing the heat sink to the load frame. The non-influencing fastener includes a screw with a head; a tapered ring disposed below the head of the screw and having a tapered lower peripheral surface; a sealing ring engaging the tapered lower peripheral surface of the tapered ring; and a load washer disposed between the sealing ring and the load frame. Compression of the rings by turning of the screw into the load frame causes the sealing ring to expand against the bore of the heatsink. Preferably, the sealing ring has a curved outer surface.

摘要翻译： 负载框架具有暴露电子部件的表面的开放区域。 散热器设置在负载框架上并且具有与电子部件的表面热接触的表面。 不影响的紧固件设置在散热器的孔内并且拧入负载框架中，以将散热器固定到负载框架上。 非影响性紧固件包括具有头部的螺钉; 锥形环设置在螺钉的头部下方并具有锥形的下外周表面; 与锥形环的锥形下周面接合的密封环; 以及设置在密封环和负载框架之间的负载垫圈。 通过将螺钉转入负载框架来压缩环使得密封环相对于散热器的孔膨胀。 优选地，密封环具有弯曲的外表面。

公开(公告)号：US06792375B2

公开(公告)日：2004-09-14

申请号：US10286193

申请日：2002-11-01

申请人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

发明人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

IPC分类号： G06F1900

CPC分类号： G01M5/005 ,  G01R31/046

摘要： A portable testing apparatus operable with a force applying apparatus for testing loading characteristics on an integrated circuit assembly coupled to a circuit board. Included is a housing assembly having a size and shape to simulate an integrated circuit assembly to be tested; a loading element coupled for movement relative to the housing assembly and engageable with a load detecting system for transferring forces thereto in response to forces applied by a force applying apparatus; an interposer which mates the housing assembly to a circuit board; and, a load detecting system associated with the housing assembly for providing signals representative of characteristics of loading forces applied thereto by a force applying apparatus, whereby the load delivery characteristics of a force applying apparatus can be determined. A method of testing is also provided.

摘要翻译： 一种便携式测试装置，其可与用于在耦合到电路板的集成电路组件上测试负载特性的施力装置一起操作。 包括具有尺寸和形状以模拟待测试的集成电路组件的壳体组件; 联接成用于相对于壳体组件移动的加载元件，可与负载检测系统接合，用于响应于施加力的力施加的力而向其传递力; 将外壳组件与电路板配合的插入器; 以及负载检测系统，其与壳体组件相关联，用于提供表示由施力装置施加到其上的负载力的特性的信号，由此可以确定施力装置的负载传递特性。 还提供了一种测试方法。

公开(公告)号：US06449155B1

公开(公告)日：2002-09-10

申请号：US09927056

申请日：2001-08-09

申请人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Roger Duane Hamilton ,  Danny E. Massey ,  Arvind Kumar Sinha

发明人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Roger Duane Hamilton ,  Danny E. Massey ,  Arvind Kumar Sinha

IPC分类号： H05K720

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A multichip module subassembly is disclosed which provides for a heatsink, a thermal interface, a module cap upon which a multichip module is mounted, a land grid array interposer, and an assembly cover. The module cap has shimmed load posts and adjustable brackets for precise alignment and loading of the interposer onto the module. The cover may have a springplate for precise preloading of the interposer onto the multichip module for transportation. The multichip module subassembly is easily used as a field replaceable unit.

摘要翻译： 公开了一种多芯片模块子组件，其提供散热器，热接口，安装多芯片模块的模块盖，平台栅格阵列插入件和组件盖。 模块盖已经垫上了负载柱和可调节支架，用于将插入件精确对准和加载到模块上。 盖可以具有用于将插入件精确地预加载到多芯片模块上用于运输的弹簧板。 多芯片模块子组件可轻松用作现场可更换单元。

公开(公告)号：US06385044B1

公开(公告)日：2002-05-07

申请号：US09917446

申请日：2001-07-27

申请人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Roger Duane Hamilton ,  Danny E. Massey ,  Arvind Kumar Sinha

发明人： John Lee Colbert ,  John Saunders Corbin, Jr. ,  Roger Duane Hamilton ,  Danny E. Massey ,  Arvind Kumar Sinha

IPC分类号： H05K720

CPC分类号： H01L23/427 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus and method are disclosed to provide heat pipe cooling for semiconductor chips mounted on a module. Each chip is provided its own heat pipe for cooling. A piston on the end of each heat pipe is loaded against each chip with a predetermined force without the need for counting turns of a screw or use of torque measurement tools. Each heat pipe draws heat away from the chip it is loaded against, carrying the heat to a heat sink for dissipation into the ambient. A large multichip module can be loaded against a land grid array interposer with uniform loading of the interposer. This interposer loading is accomplished independently of the loading of the heat pipes against the chips.

摘要翻译： 公开了一种为安装在模块上的半导体芯片提供热管冷却的装置和方法。 每个芯片都设有自己的热管用于冷却。 每个热管的端部上的活塞以预定的力加载到每个芯片上，而不需要计数螺杆的转数或使用扭矩测量工具。 每个热管将热量从其被加载的芯片上吸走，将热量传递到散热器以耗散到环境中。 一个大的多芯片模块可以被加载到具有均匀的插入器负载的焊盘栅格阵列插入器上。 该插入器负载独立于热管对芯片的负载而完成。

公开(公告)号：US07425822B2

公开(公告)日：2008-09-16

申请号：US11747216

申请日：2007-05-10

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US5808236A

公开(公告)日：1998-09-15

申请号：US827745

申请日：1997-04-10

申请人： Johnny Roy Brezina ,  John Saunders Corbin, Jr. ,  Howard Victor Mahaney, Jr. ,  James Robert Taylor

发明人： Johnny Roy Brezina ,  John Saunders Corbin, Jr. ,  Howard Victor Mahaney, Jr. ,  James Robert Taylor

IPC分类号： H01L23/40 ,  H01L23/26

CPC分类号： H01L23/4093 ,  H01L2924/0002

摘要： An apparatus and method therefore mount an array of different heatsinks to a closely packed array of data processing elements utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the corners where the devices are attached to the printed circuit board.

摘要翻译： 因此，装置和方法将不同散热器的阵列安装到在数据处理系统内使用的数据处理元件的紧密排列的阵列。 该装置包括在底部具有多个孔的金属框架，以允许接近将提供散热器的装置的顶部。 金属框架具有允许访问下面的数据处理元件的顶部的多个孔。 金属框架用作用于多个散热器的容纳车辆，并且还将其中设备附接到印刷电路板的拐角的特别脆弱的附近的印刷电路板提供刚性。

公开(公告)号：US5675889A

公开(公告)日：1997-10-14

申请号：US474343

申请日：1995-06-07

申请人： John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  John Saunders Corbin, Jr. ,  Karl Grant Hoebener ,  David P. Watson

发明人： John Acocella ,  Donald Ray Banks ,  Joseph Angelo Benenati ,  Thomas Caulfield ,  John Saunders Corbin, Jr. ,  Karl Grant Hoebener ,  David P. Watson

IPC分类号： B23K1/00 ,  H01L21/48 ,  H01L23/488 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H05K3/42

CPC分类号： B23K1/0008 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  H05K3/3452 ,  H05K3/42 ,  H05K3/429 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144

摘要： Two substrates are produced each with a planar, mirror-image matrix of metal contacts in a surface wiring layer. The substrates are positioned with the matrices in parallel confrontation which defines pairs of confronting contacts. A metal ball is positioned between each pair of contacts with a respective volume of joining material between the ball and each of the two respective contacts. The volumes of joining material are simultaneously melted to allow surface tension to align the substrates and to accurately center the balls between each respective pairs of contacts in a plane defines by the matrix of balls.

摘要翻译： 制造两个基板，每个基板在表面布线层中具有金属触点的平面的镜像矩阵。 衬底被定位成与平行对置的矩阵定义成对的面对的接触。 金属球被定位在每对触点之间，在球与两个相应的触头中的每一个之间具有相应体积的接合材料。 同时熔化接合材料的体积以允许表面张力对准衬底并且在由球的矩阵限定的平面中的每个相应的触头对之间精确地定位球。

公开(公告)号：US07466155B2

公开(公告)日：2008-12-16

申请号：US11747204

申请日：2007-05-10

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US07453279B2

公开(公告)日：2008-11-18

申请号：US11747197

申请日：2007-05-10

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US07352200B2

公开(公告)日：2008-04-01

申请号：US11033935

申请日：2005-01-12

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.