公开(公告)号：US5153986A

公开(公告)日：1992-10-13

申请号：US731598

申请日：1991-07-17

申请人： John M. Brauer ,  Frederick R. Christie ,  William H. Lawrence ,  Ashit A. Mehta ,  Jonathan D. Reid ,  William J. Summa

发明人： John M. Brauer ,  Frederick R. Christie ,  William H. Lawrence ,  Ashit A. Mehta ,  Jonathan D. Reid ,  William J. Summa

IPC分类号： C08G61/02 ,  C23C14/12 ,  H01L23/14 ,  H05K1/05 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44

CPC分类号： H05K3/445 ,  H01L23/142 ,  H05K1/056 ,  H01L2924/0002 ,  H05K2201/0179 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2203/135 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4076 ,  H05K3/426 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Disclosed is a method of fabricating a multilayer electronic circuit package. The multilayer circuit package has at least one layer that is a circuitized, polymer encapsulated metal core. According to the method of the invention a metal foil is provided for the metal core of the layer. This metal core foil may be provided as a single unit or in a continuous, roll to roll, process. The vias and through holes are drilled, etched, or punched through the metal foil. An adhesion promoter is then applied to the perforate metal foil for subsequent adhesion of polymer to the foil. The dielectric polymer is then applied to the perforate metal foil core by vapor depositing, chemical vapor depositing, spraying or electrophoretically depositing, a thermally processable dielectric polymer or precursor thereof onto exposed surfaces of the perforate metal foil including the walls of the through holes and vias. The dielectric polymer or precursor thereof is then thermally processed to form a conformal dielectric, polymeric coating on surfaces of the perforate metal foil, including the interior surfaces of the vias and through holes. This dielectric, polymeric coating may then be circuitized, and coated with an adhesive for lamination to the next adjacent layer. After lamination, one or more chips are attached to the completed package.

公开(公告)号：US5250347A

公开(公告)日：1993-10-05

申请号：US848772

申请日：1992-03-10

申请人： Ashit A. Mehta ,  Tyan M. Niu ,  Lee P. Springer ,  William J. Summa ,  Lee P. Wilding

发明人： Ashit A. Mehta ,  Tyan M. Niu ,  Lee P. Springer ,  William J. Summa ,  Lee P. Wilding

IPC分类号： C08L27/12 ,  C08L79/04 ,  H01L21/48 ,  H01L23/14 ,  H05K1/03 ,  B32B3/00

CPC分类号： H01L21/4803 ,  H01L23/145 ,  H05K1/0373 ,  H01L2924/0002 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/0212 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31504

摘要： Disclosed are filled poly(triazine) resin dielectrics and microelectronic circuit packages incorporating them. In the filled poly (triazine) dielectric composites, dispersed thermoplastic polymeric fillers are used to reduce the brittleness and increase the ductility of the triazine polymer, while preserving the low dielectric constant of the triazine host matrix-based composite.

公开(公告)号：US5206074A

公开(公告)日：1993-04-27

申请号：US657795

申请日：1991-02-20

申请人： Charles R. Davis ,  Ashit A. Mehta ,  Konstantinos Papathomas ,  Lee P. Springer ,  William J. Summa ,  David W. Wang

发明人： Charles R. Davis ,  Ashit A. Mehta ,  Konstantinos Papathomas ,  Lee P. Springer ,  William J. Summa ,  David W. Wang

IPC分类号： C07D303/12 ,  C09J4/00 ,  H05K1/03

CPC分类号： C08G59/4014 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B27/34 ,  B32B7/12 ,  C08L63/00 ,  C08L79/08 ,  H05K1/034 ,  Y10S428/901 ,  Y10T428/24917

摘要： Disclosed is a polymeric product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Also disclosed is an organic polymeric dielectric composite of organic polymeric films, as polyimide films, dispersed in and reinforcing the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Further disclosed is an electronic circuit package that is adapted to receive at least one microelectronic circuit chip, with at least one layer having a substrate of an organic polymeric dielectric composite of organic polymeric films and the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane.

摘要翻译： 公开了二缩水甘油基双酚对二烷基苯和二氰基二苯基六氟异丙烷的聚合物。 还公开了分散在二缩水甘油基双酚对二烷基苯和二氰基二苯基六氟异丙苯的有机聚合物粘合反应产物中的有机聚合物膜作为聚酰亚胺膜的有机聚合物电介质复合材料。 还公开了一种电子电路封装，其适于接收至少一个微电子电路芯片，其中至少一层具有有机聚合物膜的有机聚合物电介质复合材料的基底和二缩水甘油基双酚对苯二甲酸的有机聚合物粘合反应产物， 二苯基苯和二氰基二苯基六氟异丙苯。

公开(公告)号：US5319244A

公开(公告)日：1994-06-07

申请号：US806410

申请日：1991-12-13

申请人： Konstantinos I. Papathomas ,  David W. Wang ,  William J. Summa ,  Ashit A. Mehta

发明人： Konstantinos I. Papathomas ,  David W. Wang ,  William J. Summa ,  Ashit A. Mehta

IPC分类号： H01L23/12 ,  B32B7/12 ,  C09D179/04 ,  H01B3/30 ,  H01L23/14 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  B32B3/00

CPC分类号： H01B3/303 ,  B32B7/12 ,  C09D179/04 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T428/24917

摘要： Disclosed are thin film triazine adhesives on organic carriers, method for making them and microelectronic circuit packages incorporating them. The circuit package has a substrate made up of organic, dielectric, polymeric sheets. At least one pair of the polymeric sheets face each other and are adhesively joined together by a triazine polymer.

摘要翻译： 公开了有机载体上的薄膜三嗪粘合剂，其制备方法和结合它们的微电子电路封装。 电路封装具有由有机，电介质，聚合物片构成的衬底。 至少一对聚合物片彼此面对并通过三嗪聚合物粘合在一起。

公开(公告)号：US5126192A

公开(公告)日：1992-06-30

申请号：US470453

申请日：1990-01-26

申请人： Leroy N. Chellis ,  Robert M. Japp ,  William J. Summa ,  William J. Rudik ,  David W. Wang

发明人： Leroy N. Chellis ,  Robert M. Japp ,  William J. Summa ,  William J. Rudik ,  David W. Wang

IPC分类号： B32B5/00 ,  C08J5/24 ,  C08K7/24 ,  H05K1/03 ,  H05K3/46

CPC分类号： C08J5/24 ,  C08K7/24 ,  H05K1/0373 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0254 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/2982 ,  Y10T428/31663

摘要： A flame retardant, low dielectric constant, controlled coefficient of thermal expansion, low cost prepreg material which includes randomly distributed silane coated hollow microspheres has been prepared by standard impregnation and lamination techniques. Laminates made of this prepreg can be drilled cleanly for through holes and can be used as a substrate for surface mounted devices.

公开(公告)号：US5103293A

公开(公告)日：1992-04-07

申请号：US623823

申请日：1990-12-07

申请人： Edward J. Bonafino ,  Richard W. Carpenter ,  Peter J. Lueck ,  William J. Summa ,  David W. Wang

发明人： Edward J. Bonafino ,  Richard W. Carpenter ,  Peter J. Lueck ,  William J. Summa ,  David W. Wang

IPC分类号： H01L23/14 ,  H05K1/03 ,  H05K3/46

CPC分类号： H05K1/036 ,  H01L23/145 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K3/4626

摘要： Disclosed are an electronic package and electronic package module. The module has a dielectric core with surface circuitization on at least one surface. The dielectric core is a composite having a thermoplastic layer interposed between two separate layers of thermoset adhesive, as epoxy dicyanate adhesive. The thermoplastic layer is preferably a polyimide. The adhesive is preferably an epoxy or dicyanate adhesive, for example a homogeneous film of thermoset resin, or a fiber reinforced thermoset resin, such as a polytetrafluorethylene reinforced epoxy or a glass fiber reinforced adhesive. The use of a thermoplastic polyimide layer interposed between adhesive layers provides a core that is particularly amenable to manufacture as a thin core.

公开(公告)号：US4659425A

公开(公告)日：1987-04-21

申请号：US825562

申请日：1986-02-03

申请人： Eugene A. Eggers ,  William J. Summa

发明人： Eugene A. Eggers ,  William J. Summa

IPC分类号： B32B15/08 ,  B32B37/00 ,  B32B38/08 ,  C08J5/24 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  B44C1/22 ,  B32B31/08

CPC分类号： B32B38/08 ,  B32B37/1027 ,  H05K3/022 ,  B32B2038/0076 ,  B32B2457/08 ,  H05K1/0366 ,  H05K2203/068 ,  H05K2203/1121 ,  H05K2203/1545

摘要： A continuous method for the manufacture of a circuit board wherein a coating of a solvent-free thermosetting resin is applied to the surface of a metal foil. The resin coated foil is advanced into contact with a reinforcing cloth sheet layer to form a foil/cloth assembly. The assembly is continuously conveyed between a pair of endless belts revolving in opposite directions with mutually facing surfaces, the belts being heated to the curing temperature of the resin whereby the belts are pressed against the assembly to continuously compact the assembly and cure the resin to form a composite product which can then be circuitized from a printed circuit board.

摘要翻译： 一种用于制造电路板的连续方法，其中将无溶剂的热固性树脂的涂层施加到金属箔的表面。 将树脂涂布的箔推进成与增强布层层接触以形成箔/布组件。 组件在相对方向的相反方向旋转的一对循环带之间连续输送，带被加热到树脂的固化温度，由此将带压靠在组件上以连续地压紧组件并使树脂固化形成 然后可以从印刷电路板电路化的复合产品。

公开(公告)号：US5015719A

公开(公告)日：1991-05-14

申请号：US380195

申请日：1989-07-14

申请人： Kostas I. Papathomas ,  William J. Summa ,  David W. Wang

发明人： Kostas I. Papathomas ,  William J. Summa ,  David W. Wang

IPC分类号： C07C261/02 ,  H05K1/03

CPC分类号： C08L63/00 ,  H05K1/034 ,  Y10T428/30 ,  Y10T428/31551

摘要： Dicyanato diphenyl fluorinated alkane resin precursor compositions are modified by the addition of minor predetermined amounts of aromatic diepoxides having high epoxide equivalent weights in order to reduce the curing temperature of prepregs and laminates, such as circuit boards, while retaining low dielectric constants, heat stability and high flame retardance.

摘要翻译： 通过添加少量预定量的具有高环氧当量重量的芳族二环氧化物来改性二氰基二苯基氟化烷烃树脂前体组合物，以便降低预浸料和层压材料如电路板的固化温度，同时保持低介电常数，热稳定性和 高阻燃性

公开(公告)号：US5378306A

公开(公告)日：1995-01-03

申请号：US192736

申请日：1994-02-07

申请人： Michael J. Cibulsky ,  Konstantinos I. Papathomas ,  William J. Summa ,  David W. Wang ,  Patrick R. Zippetelli

发明人： Michael J. Cibulsky ,  Konstantinos I. Papathomas ,  William J. Summa ,  David W. Wang ,  Patrick R. Zippetelli

IPC分类号： H05K1/03 ,  H05K3/00 ,  B44C1/22 ,  C23F1/00

CPC分类号： H05K3/4691 ,  H05K1/0366 ,  H05K2201/0355 ,  H05K2203/308 ,  Y10S428/901 ,  Y10T428/24851 ,  Y10T428/2486 ,  Y10T428/24917 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T428/31721

摘要： A rigid-flexible circuit board is fabricated by providing a core having a dielectric substrate and conductive layer thereon. A sub-composite comprising a polyimide and rigid dielectric substrate adjacent the conductive layer and in both the rigid and flexible segments of the board is provided. A release layer corresponding to the flexible segment of the board is provided. A rigid bonding layer is provided at rigid segments of the board but not at the flexible segments. A composite is formed by providing a second conductive layer adjacent the rigid bonding layer. The composite is laminated. Portions of the second conductive layer corresponding to the flexible segment and release layer are removed.

摘要翻译： 通过在其上提供具有电介质基板和导电层的芯体来制造刚性柔性电路板。 提供了包括邻近导电层并且在板的刚性和柔性段中的聚酰亚胺和刚性电介质基板的亚复合材料。 提供了对应于板的柔性段的释放层。 刚性粘合层设置在板的刚性部分，但不在柔性部分。 通过提供邻近刚性粘合层的第二导电层形成复合材料。 复合材料层压。 除去对应于柔性段和释放层的第二导电层的部分。

公开(公告)号：US4697923A

公开(公告)日：1987-10-06

申请号：US843566

申请日：1986-03-25

申请人： Gerald W. Jones ,  W. Robert Pratt ,  William J. Summa

发明人： Gerald W. Jones ,  W. Robert Pratt ,  William J. Summa

IPC分类号： G01N21/88 ,  G01N21/956 ,  H05K1/00 ,  H05K1/02 ,  H05K3/46

CPC分类号： G01N21/8803 ,  H05K1/0269 ,  G01N2021/95638 ,  G01N21/6447 ,  H05K2203/161 ,  H05K3/4676

摘要： A method is disclosed for the visual inspection of electrical circuitry deposited in the layers of a multilayer printed circuit board wherein the dielectric layers of the multilayer board are prepared using a clear, light transparent thermosetting resin having incorporated therein a dye which is permeable to visible light but which absorbs light in the 320-440 nm region.The electrical circuitry in the board can be easily traced by an observer upon illumination of the board by visible light.

摘要翻译： 公开了一种用于目视检查沉积在多层印刷电路板的层中的电路的方法，其中使用透明的透光热固性树脂制备多层板的电介质层，其中掺入了可渗透可见光的染料 但吸收了320-440 nm区域的光。 当通过可见光照射电路板时，电路板中的电路可以很容易地被观察者跟踪。