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1.发明授权Electrodeposited precious metal finishes having wear resistant particles therein 有权在其中具有耐磨颗粒的电沉积贵金属饰面公开(公告)号：US06274254B1
公开(公告)日：2001-08-14
申请号：US09379553
申请日：1999-08-23
IPC分类号： C25D1500
CPC分类号： H05K3/244 , C25D3/567 , C25D3/62 , C25D15/02 , H01R13/03 , Y10S428/929 , Y10S428/935 , Y10T428/12875 , Y10T428/12889
摘要： An electrical connector comprises connector contacts having a metal base and a surface finish layer over the base, the surface finish layer being a composite of an electroplated precious metal composition and wear resistant particles dispersed therein. In the preferred embodiment, the precious metal layer is a PdCo alloy and the wear resistant particles are sub-micron sized lubricating particles, e.g. polytetrafluoroethylene particles and a flash coat of gold is provided over the composite layer.
摘要翻译： 电连接器包括具有金属基底和在基底上的表面光洁度层的连接器触点，表面光洁度层是电镀的贵金属组合物和分散在其中的耐磨颗粒的复合物。 在优选的实施方案中，贵金属层是PdCo合金，耐磨颗粒是亚微米级的润滑颗粒，例如， 在复合层上提供聚四氟乙烯颗粒和闪光涂层金。
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公开(公告)号：US6090263A
公开(公告)日：2000-07-18
申请号：US133124
申请日：1998-08-12
CPC分类号： H01L21/4821 , C25D3/12 , C25D5/12 , H01L23/49582 , H01L2924/0002 , Y10S428/929 , Y10S428/935 , Y10T428/12 , Y10T428/12389 , Y10T428/12875 , Y10T428/12889 , Y10T428/12896 , Y10T428/1291 , Y10T428/12937
摘要： A process for depositing a conformable nickel coating on a lead frame is disclosed. The metal lead frame substrate is copper, copper alloy, or nickel alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least about 82 degrees with a bend radius of about 100 .mu.m to about 300 .mu.m. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 .mu.m. The conformable nickel coating is formed using an electroplating bath containing nickel as a nickel complex, a nickel salt, a buffer and a fluorochemical wetting agent.
摘要翻译： 公开了一种用于在引线框架上沉积一致的镍涂层的工艺。 金属引线框架基板是铜，铜合金或镍合金。 引线框架基板涂覆有适形的镍涂层，当引线框架弯曲至少约82度的角度，弯曲半径约为100微米至约300微米时，该涂层是抗裂纹的。 当这种弯曲产生的变形深度不超过约5微米时，裂纹不会出现在本发明的适形镍涂层的厚度上。 使用包含镍作为镍络合物，镍盐，缓冲剂和含氟润湿剂的电镀浴形成适形的镍涂层。
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公开(公告)号：US06452258B1
公开(公告)日：2002-09-17
申请号：US09707042
申请日：2000-11-06
申请人： Joseph Anthony Abys , Alan Blair , Chonglun Fan , Chen Xu , Jimmy Chun Wah Kwok
发明人： Joseph Anthony Abys , Alan Blair , Chonglun Fan , Chen Xu , Jimmy Chun Wah Kwok
IPC分类号： H01L23495
CPC分类号： H01L23/49582 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/48464 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48739 , H01L2224/48744 , H01L2224/48764 , H01L2224/73265 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In accordance with the invention, a packaged electronic device comprises at least one electronic device and leads sealed within a protective package. The leads comprise a conductive metal substrate having a composite metal finish with a total thickness of 1000 Å or less. The finish comprises, in succession from the substrate, 25-750 Å of palladium alloy and 5-250 Å of wirebondable and solderable material. The substrate is advantageously nickel-plated copper alloy or Fe—Ni alloy. The content of palladium in the palladium alloy coating can range from 10-95 weight percent. This finish meets requirements of wirebonding and solderability at a thickness surprisingly lower than previously used packaging finishes.
摘要翻译： 根据本发明，封装的电子设备包括至少一个电子设备和密封在保护性封装内的引线。 引线包括具有总厚度为或以下的复合金属光洁度的导电金属基板。 最终包括25-750埃钯合金和5-250埃的可焊接和可焊接材料。 该衬底有利地为镀镍铜合金或Fe-Ni合金。 钯合金涂层中钯的含量可以为10-95重量％。 这完成符合引线键合和可焊性的要求，其厚度令人惊讶地低于以前使用的封装表面。
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4.发明授权公开(公告)号：US06335107B1
公开(公告)日：2002-01-01
申请号：US09404059
申请日：1999-09-23
申请人： Joseph Anthony Abys , Chonglun Fan
发明人： Joseph Anthony Abys , Chonglun Fan
IPC分类号： B32B1501
CPC分类号： C25D5/10 , B32B15/01 , B32B15/013 , B32B15/015 , B32B15/018 , H01L23/49582 , H01L2924/0002 , H01R13/03 , Y10S428/901 , Y10S428/926 , Y10S428/929 , Y10T428/12875 , Y10T428/12889 , Y10T428/1291 , Y10T428/12931 , Y10T428/12937 , Y10T428/12944 , Y10T428/12951 , H01L2924/00
摘要： In accordance with the invention, a metal substrate is coated with a multilayer surface finish comprising, in succession, an amorphous metal underlayer, a corrosion-resistent metal middle layer and one or more outer layers of precious metal. In an exemplary embodiment the metal substrate comprises copper alloy, the amorphous metal underlayer is Ni—P, the middle layer is nickel and the outer layer is palladium. The resulting structure is particularly useful as an electrical connector.
摘要翻译： 根据本发明，金属基底被涂覆有多层表面光洁度，其包括无定形金属底层，耐腐蚀金属中间层和一个或多个贵金属外层。 在一个示例性实施例中，金属基底包括铜合金，非晶金属底层是Ni-P，中间层是镍，外层是钯。 所得结构作为电连接器特别有用。
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5.发明授权Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings 失效钯表面涂层适用于引线键合和用于形成钯表面涂层的工艺
公开(公告)号：US6139977A
公开(公告)日：2000-10-31
申请号：US95237
申请日：1998-06-10
申请人： Joseph Anthony Abys , Alan Blair , Chonglun Fan
发明人： Joseph Anthony Abys , Alan Blair , Chonglun Fan
IPC分类号： H01L23/50 , C23C28/00 , C23C28/02 , C25D3/50 , C25D3/52 , C25D5/12 , H01L21/48 , H01L21/607 , H01L23/495 , B32B15/00 , C25D5/10
CPC分类号： H01L24/85 , C23C28/023 , C25D3/52 , C25D5/12 , H01L21/4821 , H01L23/49534 , H01L23/49579 , H01L23/49582 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48664 , H01L2224/48764 , H01L2224/78301 , H01L2224/85181 , H01L2224/85205 , H01L2224/85464 , H01L2224/859 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/15747 , Y10S428/926 , Y10S428/935
摘要： A surface finish which provides improved wirebonding performance for integrated circuit packages is disclosed. The surface finish which is formed on a substrate includes a palladium layer and one or more material layers. The one or more material layers are interposed between the substrate and the palladium layer. The palladium layer has a hardness that is less than about 500 (KHN.sub.50) while at least one material layer has a hardness that is less than about 250 (KHN.sub.50).
摘要翻译： 公开了一种为集成电路封装提供改进的引线键合性能的表面光洁度。 形成在基板上的表面光洁度包括钯层和一个或多个材料层。 一个或多个材料层插入在基底和钯层之间。 钯层的硬度小于约500（KHN50），而至少一种材料层的硬度小于约250（KHN50）。
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6.发明授权Conformable nickel coating and process for coating an article with a conformable nickel coating 有权合适的镍涂层和用适合的镍涂层涂覆物品的方法公开(公告)号：US06399220B1
公开(公告)日：2002-06-04
申请号：US09533001
申请日：2000-03-22
IPC分类号： B32B1501
CPC分类号： H01L21/4821 , C25D3/12 , C25D5/12 , H01L23/49582 , H01L2924/0002 , Y10S428/929 , Y10S428/935 , Y10T428/12 , Y10T428/12389 , Y10T428/12875 , Y10T428/12889 , Y10T428/12896 , Y10T428/1291 , Y10T428/12937 , H01L2924/00
摘要： The present invention is directed to a lead frame in which the metal lead frame substrate is copper, copper alloy, or iron alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least about 82 degrees with a bend radius of about 100 &mgr;m to about 300 &mgr;m. Bending the lead frame in this manner causes surface deformations in the lead frame substrate. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 &mgr;m.
摘要翻译： 本发明涉及一种引线框架，其中金属引线框架基板是铜，铜合金或铁合金。 引线框架基板涂覆有适形的镍涂层，当引线框弯曲至至少约82度的角度，弯曲半径为约100μm至约300μm时，该涂层是抗裂纹的。 以这种方式弯曲引线框架引起引线框架基板中的表面变形。 当由该弯曲引起的变形深度不超过约5μm时，裂纹不会穿过本发明的适形镍涂层的厚度。
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7.发明授权Conformable nickel coating and process for coating an article with a conformable nickel coating 失效合适的镍涂层和用适合的镍涂层涂覆物品的方法
公开(公告)号：US5916696A
公开(公告)日：1999-06-29
申请号：US660628
申请日：1996-06-06
CPC分类号： H01L21/4821 , C25D3/12 , C25D5/12 , H01L23/49582 , H01L2924/0002 , Y10S428/929 , Y10S428/935 , Y10T428/12 , Y10T428/12389 , Y10T428/12875 , Y10T428/12889 , Y10T428/12896 , Y10T428/1291 , Y10T428/12937
摘要： The present invention is directed to a lead frame in which the metal lead frame substrate is copper, copper alloy, or nickel alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least 82 degrees with a bend radius of about 150 .mu.m to about 300 .mu.m. Bending the lead frame in this manner causes surface deformations in the lead frame substrate. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 .mu.m.
摘要翻译： 本发明涉及一种引线框架，其中金属引线框架基板是铜，铜合金或镍合金。 引线框架基板上涂有一层适应性的镍涂层，当引线框弯曲到至少82度的角度，弯曲半径约为150微米至约300微米时，该涂层是抗裂纹的。 以这种方式弯曲引线框架引起引线框架基板中的表面变形。 当这种弯曲产生的变形深度不超过约5微米时，裂纹不会出现在本发明的适形镍涂层的厚度上。
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公开(公告)号：US20060024430A1
公开(公告)日：2006-02-02
申请号：US10902398
申请日：2004-07-29
申请人： Yung-Herng Yau , Thomas Richardson , Joseph Abys , Karl Wengenroth , Anthony Fiore , Chen Xu , Chonglun Fan , John Fudala
发明人： Yung-Herng Yau , Thomas Richardson , Joseph Abys , Karl Wengenroth , Anthony Fiore , Chen Xu , Chonglun Fan , John Fudala
CPC分类号： H05K1/09 , C09D1/00 , C23C18/16 , C23C18/1614 , C23C18/1616 , C23C18/1633 , C23C18/1683 , C23C18/1687 , C23C18/42 , C23C18/44 , C23C18/54 , C23C22/06 , C23C22/58 , C25D3/46 , C25D3/56 , C25D3/64 , H05K3/244 , H05K3/422 , H05K2203/0257 , H05K2203/073 , Y10S205/916
摘要： Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
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9.发明申请Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components 审中-公开保持电子元件锡表面的可焊性和抑制晶须生长公开(公告)号：US20080261071A1
公开(公告)日：2008-10-23
申请号：US10597374
申请日：2005-01-21
申请人： Chen Xu , Yun Zhang , Chonglun Fan , Oscar Khaselev , Joseph A. Abys , Eric Walch , Marlies Kleinfeld , Hans Ullrich Eckert
发明人： Chen Xu , Yun Zhang , Chonglun Fan , Oscar Khaselev , Joseph A. Abys , Eric Walch , Marlies Kleinfeld , Hans Ullrich Eckert
CPC分类号： H01L23/49582 , C25D5/12 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2924/00014 , H01L2924/01327 , H01L2924/15747 , H01L2924/19041 , H01R4/02 , H01R13/03 , H05K3/3426 , H05K2201/10909 , Y02P70/613 , Y10T428/12722 , H01L2224/45099 , H01L2924/00
摘要： A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.
摘要翻译： 一种减少电子部件的金属特征的方法，用于减少锡涂层中的晶须形成和保持锡涂层的可焊性。 锡涂层具有内部拉伸应力，厚度在约0.5μm至约4.0μm之间。 在锡涂层下面有一个镍基层。
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公开(公告)号：US20050268991A1
公开(公告)日：2005-12-08
申请号：US10860678
申请日：2004-06-03
申请人： Chonglun Fan , Joseph Abys , Chen Xu , Edward Kudrak , Vincent Paneccasio , Igor Zavarine , Christian Rietmann
发明人： Chonglun Fan , Joseph Abys , Chen Xu , Edward Kudrak , Vincent Paneccasio , Igor Zavarine , Christian Rietmann
IPC分类号： C23C22/06 , C23C22/74 , C23C22/82 , C23C22/83 , C23F11/167 , C04B9/02 , C25D3/32 , B05D1/36 , B05D7/00 , B05D1/18
CPC分类号： C23F11/1676 , C23C22/06 , C23C22/74 , C23C22/82 , H01L23/49582 , H01L24/48 , H01L24/49 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01078 , H01L2924/01084 , H01L2924/181 , H05K3/282 , H05K3/3426 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method for enhancing corrosion resistance of a tin-based surface on a workpiece involving contacting the tin-based surface with a composition comprising a phosphonic acid compound and water to form a phosphorus-based film over the tin-based coating thereby inhibiting corrosion of the tin-based surface. Phosphonic acid containing compositions having a concentration up to about 30 vol. % of an organic solvent, and water.
摘要翻译： 一种用于提高工件上锡基表面的耐腐蚀性的方法，包括使锡基表面与包含膦酸化合物和水的组合物接触以在锡基涂层上形成磷基膜，从而抑制锡基表面的腐蚀 锡基表面。 含有膦酸的组合物，其浓度高达约30vol。 ％的有机溶剂和水。
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