摘要:
Disclosed are a method and apparatus for feature-based stereo matching. A method for stereo matching of a reference image and at least one comparative image captured by at least two cameras from different points of view using a computer device includes collecting the reference image and the at least one comparative image, extracting feature points from the reference image, tracking points corresponding to the feature points in the at least one comparative image using an optical flow technique, and generating a depth map according to correspondence-point tracking results.
摘要:
A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.
摘要:
Disclosed are an apparatus and a method for sensing pressure using an optical waveguide sensor. The apparatus for sensing pressure using an optical waveguide sensor, includes: a light source radiating light; an optical waveguide panel emitting some of the radiated light outside through a plurality of light transmitting regions previously formed, and changing an amount of totally reflected light according to pressure applied to at least one of the plurality of light transmitting regions; a detector detecting the amount of light; and an analyzer determining intensity and a location of the pressure according to the detected amount of light.
摘要:
Disclosed is a light emitting device module. The light emitting device module includes a first lead frame and a second lead frame electrically separated from each other, a light emitting device electrically connected to the first lead frame and the second lead frame, the light emitting device includes a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer, a dam disposed at the peripheral area of the light emitting device, a resin layer surrounding the light emitting device and disposed at the inner area of the dam, and a reflective member disposed at the peripheral area of the dam and including an inclined plane formed on at least one side surface thereof.
摘要:
A light emitting device is provided. The light emitting device comprises a substrate, a first lead frame and a second lead frame on the substrate, a first light emitting diode, a heat conductor on the substrate, and a heat transfer pad. The first light emitting diode on the first lead frame is electrically connected to the first lead frame and the second lead frame. The heat conductor is electrically separated from the first lead frame. The heat transfer pad contacts the first lead frame and the heat conductor thermally to connect the first lead frame to the heat conductor.
摘要:
A lighting device is provided. The lighting device comprises a first substrate and a plurality of second substrates. The plurality of second substrates are separately and electrically connected to the first substrate and comprise a light emitting device.
摘要:
A backlight assembly includes: a light emitting unit having a plurality of unit LEDs formed in a matrix, each of the unit LEDs having a red LED, a green LED, and a blue LED; a plurality of bottom reflectors disposed under the respective unit LEDs; and a plurality of side reflectors disposed around the respective unit LEDs.
摘要:
There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increase.
摘要:
A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
摘要:
The present invention discloses a light emitting package, comprising: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a gold layer on the electrical circuit layer; a wire electrically connected between the light emitting device and the gold layer; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a bottom surface of the screen member is positioned higher than the light emitting device, and wherein an entire uppermost surface of the screen member is in contact with the lens.