公开(公告)号：US06316838B1

公开(公告)日：2001-11-13

申请号：US09531231

申请日：2000-03-20

申请人： Kaname Ozawa ,  Hayato Okuda ,  Tetsuya Hiraoka ,  Mitsutaka Sato ,  Yuji Akashi ,  Akira Okada ,  Masahiko Harayama

发明人： Kaname Ozawa ,  Hayato Okuda ,  Tetsuya Hiraoka ,  Mitsutaka Sato ,  Yuji Akashi ,  Akira Okada ,  Masahiko Harayama

IPC分类号： H01L2348

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2224/48471 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2224/05599 ,  H01L2224/4554

摘要： A semiconductor device includes a substrate provided with a plurality of leads, a face-down semiconductor element provided on one surface of the substrate, a first stacked semiconductor element and a second stacked semiconductor element provided on another surface of the substrate and connected to the substrate by wires, and an extended wiring mechanism for connecting electrodes of the face-down semiconductor element and electrodes of the first and second semiconductor elements. The connected electrodes are equi-electrodes whose electrical characteristics are equal.

摘要翻译： 半导体器件包括设置有多个引线的衬底，设置在衬底的一个表面上的面向下半导体元件，设置在衬底的另一个表面上并连接到衬底的第一堆叠半导体元件和第二堆叠半导体元件 以及用于连接面朝下半导体元件的电极和第一和第二半导体元件的电极的延长布线机构。 连接的电极是电特性相等的等电极。

公开(公告)号：US06621169B2

公开(公告)日：2003-09-16

申请号：US09940625

申请日：2001-08-29

申请人： Katsuhito Kikuma ,  Mitsutaka Ikeda ,  Yoshihiro Tsukidate ,  Yuji Akashi ,  Kaname Ozawa ,  Akira Takashima ,  Tadashi Uno ,  Takao Nishimura ,  Fumihiko Ando ,  Hiroshi Onodera ,  Hayato Okuda

发明人： Katsuhito Kikuma ,  Mitsutaka Ikeda ,  Yoshihiro Tsukidate ,  Yuji Akashi ,  Kaname Ozawa ,  Akira Takashima ,  Tadashi Uno ,  Takao Nishimura ,  Fumihiko Ando ,  Hiroshi Onodera ,  Hayato Okuda

IPC分类号： H01L2358

CPC分类号： H01L25/0652 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.

公开(公告)号：US06215182B1

公开(公告)日：2001-04-10

申请号：US09531232

申请日：2000-03-20

申请人： Kaname Ozawa ,  Hayato Okuda ,  Ryuji Nomoto ,  Yuji Akashi ,  Katsuro Hiraiwa

发明人： Kaname Ozawa ,  Hayato Okuda ,  Ryuji Nomoto ,  Yuji Akashi ,  Katsuro Hiraiwa

IPC分类号： H01L2334

CPC分类号： H01L24/85 ,  H01L23/3128 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48479 ,  H01L2224/48799 ,  H01L2224/4903 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85009 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device includes the first through third semiconductor devices which are stacked on a substrate and the first through third wires for connecting the semiconductor elements and the substrate. The first wires serve to connect electrodes of the first semiconductor element positioned uppermost and electrodes of the second semiconductor element. The second wires serve to connect the electrodes of the second semiconductor element and electrodes of the third semiconductor element. The third wires serve to connect the electrodes of the third semiconductor element and bonding pads of the substrate. Between the first wires and the electrodes of the second semiconductor element and between the second wires and the electrodes of the third semiconductor element, stud bumps are provided so as to form space therebetween, thereby avoiding short-circuits therebetween.

摘要翻译： 半导体器件包括层叠在基板上的第一至第三半导体器件以及用于连接半导体元件和基板的第一至第三布线。 第一导线用于连接位于最上面的第一半导体元件的电极和第二半导体元件的电极。 第二导线用于连接第二半导体元件的电极和第三半导体元件的电极。 第三导线用于连接第三半导体元件的电极和基板的焊盘。 在第一导线与第二半导体元件的电极之间以及第二导线与第三半导体元件的电极之间，设置柱形凸块，以在它们之间形成空间，从而避免它们之间的短路。

公开(公告)号：US09319128B2

公开(公告)日：2016-04-19

申请号：US14388670

申请日：2013-03-18

申请人： Kazushi Yamamoto ,  Yutaka Ozaki ,  Hayato Okuda

发明人： Kazushi Yamamoto ,  Yutaka Ozaki ,  Hayato Okuda

IPC分类号： H04B7/185 ,  H04N19/146

CPC分类号： H04B7/18508 ,  H04B7/18543 ,  H04N19/146

摘要： A helicopter-mounted communication apparatus encodes video data at a compression rate based on a percentage of time a transmission beam is blocked by rotor blades. When a number of video packets is less than a specified number, the helicopter-mounted communication apparatus inserts null packets to keep a packet rate constant, then deletes the null packets and attaches additional information to another packet indicating the number of deleted null packets, and after buffering modulates and transmits a signal toward a communication satellite at transmittable-time points. A terrestrial station communication apparatus receives and demodulates the transmitted signal via the communication satellite, generating a packet stream, and based on the additional information included in the generated packet stream, inserts null packets in the packet stream and buffers the packet stream, thereby keeping the packet rate constant, and then separates the video packets from the packet stream and decodes the separated video packets.

摘要翻译： 直升机安装的通信设备基于传输光束被转子叶片阻挡的时间百分比，以压缩率对视频数据进行编码。 当多个视频数据包小于指定数量时，直升机安装的通信装置插入空分组以保持分组速率恒定，然后删除空分组，并将附加信息附加到指示删除的空分组数量的另一分组，以及 在可传输时间点之后缓冲调制并向通信卫星发送信号。 地面站通信装置经由通信卫星接收并解调所发送的信号，产生分组流，并且基于包括在生成的分组流中的附加信息，在分组流中插入空分组并缓冲分组流，从而保持 分组速率常数，然后将视频分组与分组流分离并解码分离的视频分组。

公开(公告)号：US20150055549A1

公开(公告)日：2015-02-26

申请号：US14388670

申请日：2013-03-18

申请人： Kazushi Yamamoto ,  Yutaka Ozaki ,  Hayato Okuda

发明人： Kazushi Yamamoto ,  Yutaka Ozaki ,  Hayato Okuda

IPC分类号： H04B7/185 ,  H04N19/146

CPC分类号： H04B7/18508 ,  H04B7/18543 ,  H04N19/146

摘要： A helicopter-mounted communication apparatus encodes video data at a compression rate based on a percentage of time a transmission beam is blocked by rotor blades. When a number of video packets is less than a specified number, the helicopter-mounted communication apparatus inserts null packets to keep a packet rate constant, then deletes the null packets and attaches additional information to another packet indicating the number of deleted null packets, and after buffering modulates and transmits a signal toward a communication satellite at transmittable-time points. A terrestrial station communication apparatus receives and demodulates the transmitted signal via the communication satellite, generating a packet stream, and based on the additional information included in the generated packet stream, inserts null packets in the packet stream and buffers the packet stream, thereby keeping the packet rate constant, and then separates the video packets from the packet stream and decodes the separated video packets.

摘要翻译： 直升机安装的通信设备基于传输光束被转子叶片阻挡的时间百分比，以压缩率对视频数据进行编码。 当多个视频数据包小于指定数量时，直升机安装的通信装置插入空分组以保持分组速率恒定，然后删除空分组，并将附加信息附加到指示删除的空分组数量的另一分组，以及 在可传输时间点之后缓冲调制并向通信卫星发送信号。 地面站通信装置经由通信卫星接收并解调所发送的信号，产生分组流，并且基于包括在生成的分组流中的附加信息，在分组流中插入空分组并缓冲分组流，从而保持 分组速率常数，然后将视频分组与分组流分离并解码分离的视频分组。

公开(公告)号：US20080122503A1

公开(公告)日：2008-05-29

申请号：US11945573

申请日：2007-11-27

申请人： Hayato Okuda ,  Hiroyuki Matsuo

发明人： Hayato Okuda ,  Hiroyuki Matsuo

IPC分类号： H03L7/00

CPC分类号： H03L7/0814 ,  G06F1/10 ,  G06F1/12 ,  H03L7/07 ,  H04J3/0688 ,  H04J3/0691

摘要： An apparatus includes plural combinations of a clock supplier and a clock supply destination supplied with a clock from the clock supplier. The clock supply destination includes a return route through which the clock supply destination returns a clock to a corresponding clock supplier. The clock supplier includes a variable delay unit that adds a delay to the clock to be supplied to a corresponding clock supply destination; a comparison-reference-clock supply unit that supplies a comparison reference clock having the same phase as that of a comparison reference clock supplied from other clock supplier; a phase comparator that compares the phase of a return clock returned from a corresponding clock supply destination with that of the comparison reference clock; and a phase-difference control unit that controls the delay, so that the phases of the return clock and the comparison reference clock coincide with each other, based on the comparison result.

摘要翻译： 一种装置包括时钟供应器和时钟供给目的地的多个组合，所述时钟供应器和时钟供应目的地被提供有来自时钟供应商的时 时钟供给目的地包括一个返回路径，时钟供给目的地通过该返回路由向相应的时钟供应器返回时钟。 时钟供应器包括一个可变延迟单元，该延迟单元向要提供给相应时钟供应目的地的时钟增加一个延迟; 比较参考时钟提供单元，其提供与从其他时钟供应器提供的比较参考时钟相同相位的比较基准时钟; 比较从相应的时钟供给目的地返回的返回时钟的相位与比较参考时钟的相位相位的相位比较器; 以及相位差控制单元，其基于比较结果来控制延迟，使得返回时钟和比较基准时钟的相位彼此一致。

公开(公告)号：US07800421B2

公开(公告)日：2010-09-21

申请号：US11945573

申请日：2007-11-27

申请人： Hayato Okuda ,  Hiroyuki Matsuo

发明人： Hayato Okuda ,  Hiroyuki Matsuo

IPC分类号： H03L7/06

CPC分类号： H03L7/0814 ,  G06F1/10 ,  G06F1/12 ,  H03L7/07 ,  H04J3/0688 ,  H04J3/0691

摘要： An apparatus includes plural combinations of a clock supplier and a clock supply destination supplied with a clock from the clock supplier. The clock supply destination includes a return route through which the clock supply destination returns a clock to a corresponding clock supplier. The clock supplier includes a variable delay unit that adds a delay to the clock to be supplied to a corresponding clock supply destination; a comparison-reference-clock supply unit that supplies a comparison reference clock having the same phase as that of a comparison reference clock supplied from other clock supplier; a phase comparator that compares the phase of a return clock returned from a corresponding clock supply destination with that of the comparison reference clock; and a phase-difference control unit that controls the delay, so that the phases of the return clock and the comparison reference clock coincide with each other, based on the comparison result.

摘要翻译： 一种装置包括时钟供应器和时钟供给目的地的多个组合，所述时钟供应器和时钟供应目的地被提供有来自时钟供应商的时钟。 时钟供给目的地包括一个返回路径，时钟供给目的地通过该返回路由向相应的时钟供应器返回时钟。 时钟供应器包括一个可变延迟单元，该延迟单元向要提供给相应时钟供应目的地的时钟增加一个延迟; 比较参考时钟提供单元，其提供与从其他时钟供应器提供的比较参考时钟相同相位的比较基准时钟; 比较从相应的时钟供给目的地返回的返回时钟的相位与比较参考时钟的相位相位的相位比较器; 以及相位差控制单元，其基于比较结果来控制延迟，使得返回时钟和比较基准时钟的相位彼此一致。

公开(公告)号：US5865496A

公开(公告)日：1999-02-02

申请号：US725948

申请日：1996-10-07

申请人： Seiji Odan ,  Hayato Okuda ,  Kuniaki Ishigami

发明人： Seiji Odan ,  Hayato Okuda ,  Kuniaki Ishigami

IPC分类号： B60J5/00 ,  B60J5/04 ,  B60R21/04

CPC分类号： B60J5/0425 ,  B60J5/0451 ,  B60R21/0428

摘要： A door structure of a motor vehicle has an inner panel and an outer panel. The door structure includes an impact load absorber member, provided at an outer panel side of the door, for absorbing and reducing a side collision impact load acting on a passenger by contact with the passenger. An opening is provided in the inner panel for allowing at least one portion of the impact load absorber member to enter. An passenger is compartment of the vehicle during a side collision. A supporting device is provided in the door for supporting the impact load absorber member.

摘要翻译： 机动车辆的门结构具有内板和外板。 门结构包括设置在门的外板侧的冲击负载吸收器构件，用于通过与乘客接触来吸收和减少作用在乘客上的侧面碰撞冲击负荷。 在内板中设有开口，用于允许冲击负载吸收件的至少一部分进入。 乘客在侧面碰撞期间是车辆的舱室。 支撑装置设置在门中，用于支撑冲击载荷吸收件。

公开(公告)号：US20150117303A1

公开(公告)日：2015-04-30

申请号：US14388033

申请日：2013-03-18

申请人： Kazushi Yamamoto ,  Yutaka Ozaki ,  Hayato Okuda

发明人： Kazushi Yamamoto ,  Yutaka Ozaki ,  Hayato Okuda

IPC分类号： H04W28/04 ,  H04B7/185

CPC分类号： H04W28/04 ,  H04B7/18508 ,  H04B7/18515

摘要： A helicopter satellite communication system in which a terrestrial station communication apparatus communicates with a helicopter-mounted communication apparatus via a communication satellite. The terrestrial station communication apparatus includes: an encoder that performs error-correcting encoding of target transmission information; a packet interleaver that divides the encoded information into a plurality of packets and rearranges the packets; and a transmitter that transmits the rearranged packets to the helicopter-mounted communication apparatus. The helicopter-mounted communication apparatus includes: a receiver that receives the packets that are transmitted from the terrestrial station communication apparatus: a packet de-interleaver that rearranges the received packets in the original order; and a decoder that, by decoding the rearranged packets, restores the information that is lost due to the rotor blades of the helicopter.

摘要翻译： 一种直升机卫星通信系统，其中地面站通信装置经由通信卫星与直升机安装的通信装置进行通信。 地面站通信装置包括：对目标发送信息进行纠错编码的编码器; 分组交织器，其将编码信息划分为多个分组并重新排列分组; 以及将重排的分组发送到直升机安装的通信装置的发射机。 直升机通信装置包括：接收从地面站通信装置发送的分组的接收机：以原始顺序重新排列接收的分组的分组去交织器; 以及解码器，通过解码重新排列的分组，恢复由于直升机的转子叶片而丢失的信息。