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    Wafer suction method, wafer suction stage, and wafer suction system
    4.
    发明授权
    Wafer suction method, wafer suction stage, and wafer suction system 有权
    晶圆抽吸法，晶片吸附台和晶片抽吸系统

    公开(公告)号：US09312160B2

    公开(公告)日：2016-04-12

    申请号：US13617354

    申请日：2012-09-14

    申请人： Hajime Akiyama ,  Akira Okada ,  Kinya Yamashita

    发明人： Hajime Akiyama ,  Akira Okada ,  Kinya Yamashita

    IPC分类号： B25B11/00 ,  H01L21/677 ,  H01L21/683 ,  H01L21/687

    CPC分类号： H01L21/67748 ,  H01L21/6838 ,  H01L21/68707 ,  Y10T29/49998

    摘要： A method of attaching a wafer by suction, includes a step of mounting a wafer on a right arm and a left arm of a transfer jig, moving the transfer jig toward a wafer suction stage in such a manner that a facing right arm surface of the right arm slides along and in contact with a first side surface of the wafer suction stage and a facing left arm surface of the left arm slides along and in contact with a second side surface of the wafer suction stage until the wafer comes to lie directly above a mounting surface of the wafer suction stage, mounting the wafer on the mounting surface by moving the transfer jig downward toward the wafer suction stage while maintaining the contacts, and attaching the wafer to the mounting surface by suction.

    摘要翻译： 通过抽吸附着晶片的方法包括将晶片安装在转移夹具的右臂和左臂上的步骤，将转移夹具朝向晶片吸入台移动，使得所述转子夹具的相对的右臂表面 右臂与晶片吸入台的第一侧表面滑动并与其接触，并且左臂的面向的左臂表面沿晶片吸入台的第二侧表面滑动并与其接触，直到晶片直接位于上方 晶片吸入台的安装面，通过在保持接触的同时将转移夹具向下移动到晶片吸入台，将晶片安装在安装面上，并通过抽吸将晶片安装在安装面上。

    Gastric antacid
    5.
    发明授权
    Gastric antacid 有权
    胃酸

    公开(公告)号：US08216608B2

    公开(公告)日：2012-07-10

    申请号：US12086691

    申请日：2007-12-14

    申请人： Akira Okada ,  Keiko Katsuki

    发明人： Akira Okada ,  Keiko Katsuki

    IPC分类号： A61K9/20 ,  A61K33/30 ,  A61K33/00

    CPC分类号： A61K33/30 ,  A61K9/0053 ,  A61K9/143 ,  A61K33/06 ,  A61K33/08 ,  A61K33/10 ,  C01F7/004 ,  C01F7/005 ,  C01P2002/22 ,  Y10S514/819 ,  Y10S514/925 ,  Y10S514/926

    摘要： A novel particulate composite hydrotalcite which offers antacidic effect comparable to that of a particulate hydrotalcite so far used as a gastric antacid and, further, offers excellent stomach inner wall protection effect. A particulate composite hydrotalcite represented by the following formula (1), (MgaZnb)1-xAlx(OH)2(An−)x/n.mH2O  (1) wherein An− is CO32−, SO42− or Cl−, n is 1 or 2, and x, a, b and m are values that satisfy the following conditions, 0.18≦x≦0.4, 0.5≦a

    摘要翻译： 一种新型的复合水滑石颗粒，其提供与目前用作胃酸解的颗粒状水滑石相当的抗酸作用，并且还提供优异的胃内壁保护作用。 由下式（1），（MgaZnb）1-xAlx（OH）2（An-）x / n.mH2O（1）表示的颗粒状复合水滑石，其中An-为CO32-，SO42-或Cl-，n为 1或2，x，a，b和m是满足以下条件的值：0.18＆nlE; x＆nlE; 0.4,0.5＆amp; nlE; a <1,0 n; 0.5,0＆amp; nlE; m <1， 使用颗粒状复合水滑石作为有效成分。 当用作胃酸抗酸剂时，复合水滑石颗粒可抑制肠胃粘膜的损伤。

    Built-in capacitor type power feed device to power pins of electrical component
    6.
    发明授权
    Built-in capacitor type power feed device to power pins of electrical component 有权
    内置电容式供电装置，用于为电气元件供电

    公开(公告)号：US07580268B2

    公开(公告)日：2009-08-25

    申请号：US11316862

    申请日：2005-12-27

    申请人： Takehide Miyazaki ,  Hirofumi Imabayashi ,  Katsumi Kanasaki ,  Akira Okada

    发明人： Takehide Miyazaki ,  Hirofumi Imabayashi ,  Katsumi Kanasaki ,  Akira Okada

    IPC分类号： H05K7/00

    CPC分类号： H05K1/0263 ,  H05K1/0231 ,  H05K1/111 ,  H05K1/112 ,  H05K1/162 ,  H05K2201/0367 ,  H05K2201/09054 ,  H05K2201/09309 ,  H05K2201/10272 ,  H05K2201/10734

    摘要： A built-in capacitor type power feed device for an electrical component which solves the problems of the reduction in the noise margin of the power supply system accompanying the lower drive voltages of electrical components and the noise between the power supply and ground accompanying simultaneous switching waveforms, provided with a power supply for supplying power, a printed circuit board including a signal line pattern, a power bar having conductive projections provided in shapes and at positions corresponding to the shapes and positions of electrodes of the electrical component and provided outside of the printed circuit board, a ground bar provided outside of the printed circuit board, and a high dielectric layer provided at a part corresponding to the electrical component between the power bar and the ground bar, power from the power supply being fed to electrodes of the electrical component through the power bar and the ground bar.

    摘要翻译： 一种内置电容式电气元件供电装置，其解决了随着电气元件的较低驱动电压和电源与地面之间的噪声伴随着同时开关波形而降低电源系统的噪声容限的问题 设置有用于供电的电源，包括信号线图案的印刷电路板，具有形状的导电突起的电源杆和与电气部件的电极的形状和位置相对应的位置，并设置在印刷的外部 电路板，设置在印刷电路板外部的接地棒，以及设置在与功率棒和接地棒之间的电气部件相对应的部分的高介电层，来自电源的电力被馈送到电气部件的电极 通过电源杆和接地棒。

    Semiconductor device for fingerprint recognition
    7.
    发明申请
    Semiconductor device for fingerprint recognition 有权
    用于指纹识别的半导体器件

    公开(公告)号：US20090184408A1

    公开(公告)日：2009-07-23

    申请号：US12382532

    申请日：2009-03-18

    申请人： Akira Okada ,  Mitsuru Sato

    发明人： Akira Okada ,  Mitsuru Sato

    IPC分类号： H01L23/00 ,  H01L23/48

    CPC分类号： G06K9/0002 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/05599

    摘要： A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability.The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.

    摘要翻译： 公开了对静电容量原理执行指纹识别的半导体器件。 跨越半导体芯片的指纹识别区域的手指提供了正确的指纹识别操作，并提高了可靠性。 半导体器件包括具有执行指纹识别的传感器单元的半导体芯片和具有形成在与传感器单元对应的位置的开口的基板。 将半导体芯片倒装贴合到基板上，使得传感器单元对应于开口，除了开口的形成位置之外，在半导体芯片和基板之间设置有未填充材料。

    Allocating communication bandwidth for executing Web applications
    9.
    发明申请
    Allocating communication bandwidth for executing Web applications 审中-公开
    分配用于执行Web应用程序的通信带宽

    公开(公告)号：US20060168081A1

    公开(公告)日：2006-07-27

    申请号：US11253343

    申请日：2005-10-19

    申请人： Akira Okada

    发明人： Akira Okada

    IPC分类号： G06F15/16

    CPC分类号： H04L67/325 ,  G06F9/50 ,  H04L67/02 ,  H04L67/327

    摘要： In a system for serving a remote office by Web applications provided by a server, higher communication bandwidth is dynamically allocated to applications that require rapid execution by utilizing idle bandwidth. The server may have a priority management table for managing priorities for data transmission, a user management table for managing the number of users of each Web application, and an application executing section for allocating bandwidth on the basis of the priorities and the number of users of each of the Web applications.

    摘要翻译： 在由服务器提供的Web应用程序为远程办公室服务的系统中，通过利用空闲带宽，将更高的通信带宽动态分配给需要快速执行的应用程序。 服务器可以具有用于管理数据传输的优先级的优先级管理表，用于管理每个Web应用的用户数的用户管理表，以及用于根据优先级和用户数量分配带宽的应用执行部 每个Web应用程序。