公开(公告)号：US06215182B1

公开(公告)日：2001-04-10

申请号：US09531232

申请日：2000-03-20

申请人： Kaname Ozawa ,  Hayato Okuda ,  Ryuji Nomoto ,  Yuji Akashi ,  Katsuro Hiraiwa

发明人： Kaname Ozawa ,  Hayato Okuda ,  Ryuji Nomoto ,  Yuji Akashi ,  Katsuro Hiraiwa

IPC分类号： H01L2334

CPC分类号： H01L24/85 ,  H01L23/3128 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48479 ,  H01L2224/48799 ,  H01L2224/4903 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85009 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device includes the first through third semiconductor devices which are stacked on a substrate and the first through third wires for connecting the semiconductor elements and the substrate. The first wires serve to connect electrodes of the first semiconductor element positioned uppermost and electrodes of the second semiconductor element. The second wires serve to connect the electrodes of the second semiconductor element and electrodes of the third semiconductor element. The third wires serve to connect the electrodes of the third semiconductor element and bonding pads of the substrate. Between the first wires and the electrodes of the second semiconductor element and between the second wires and the electrodes of the third semiconductor element, stud bumps are provided so as to form space therebetween, thereby avoiding short-circuits therebetween.

摘要翻译： 半导体器件包括层叠在基板上的第一至第三半导体器件以及用于连接半导体元件和基板的第一至第三布线。 第一导线用于连接位于最上面的第一半导体元件的电极和第二半导体元件的电极。 第二导线用于连接第二半导体元件的电极和第三半导体元件的电极。 第三导线用于连接第三半导体元件的电极和基板的焊盘。 在第一导线与第二半导体元件的电极之间以及第二导线与第三半导体元件的电极之间，设置柱形凸块，以在它们之间形成空间，从而避免它们之间的短路。

公开(公告)号：US06621169B2

公开(公告)日：2003-09-16

申请号：US09940625

申请日：2001-08-29

申请人： Katsuhito Kikuma ,  Mitsutaka Ikeda ,  Yoshihiro Tsukidate ,  Yuji Akashi ,  Kaname Ozawa ,  Akira Takashima ,  Tadashi Uno ,  Takao Nishimura ,  Fumihiko Ando ,  Hiroshi Onodera ,  Hayato Okuda

发明人： Katsuhito Kikuma ,  Mitsutaka Ikeda ,  Yoshihiro Tsukidate ,  Yuji Akashi ,  Kaname Ozawa ,  Akira Takashima ,  Tadashi Uno ,  Takao Nishimura ,  Fumihiko Ando ,  Hiroshi Onodera ,  Hayato Okuda

IPC分类号： H01L2358

CPC分类号： H01L25/0652 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.

公开(公告)号：US06316838B1

公开(公告)日：2001-11-13

申请号：US09531231

申请日：2000-03-20

申请人： Kaname Ozawa ,  Hayato Okuda ,  Tetsuya Hiraoka ,  Mitsutaka Sato ,  Yuji Akashi ,  Akira Okada ,  Masahiko Harayama

发明人： Kaname Ozawa ,  Hayato Okuda ,  Tetsuya Hiraoka ,  Mitsutaka Sato ,  Yuji Akashi ,  Akira Okada ,  Masahiko Harayama

IPC分类号： H01L2348

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2224/48471 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2224/05599 ,  H01L2224/4554

摘要： A semiconductor device includes a substrate provided with a plurality of leads, a face-down semiconductor element provided on one surface of the substrate, a first stacked semiconductor element and a second stacked semiconductor element provided on another surface of the substrate and connected to the substrate by wires, and an extended wiring mechanism for connecting electrodes of the face-down semiconductor element and electrodes of the first and second semiconductor elements. The connected electrodes are equi-electrodes whose electrical characteristics are equal.

摘要翻译： 半导体器件包括设置有多个引线的衬底，设置在衬底的一个表面上的面向下半导体元件，设置在衬底的另一个表面上并连接到衬底的第一堆叠半导体元件和第二堆叠半导体元件 以及用于连接面朝下半导体元件的电极和第一和第二半导体元件的电极的延长布线机构。 连接的电极是电特性相等的等电极。

公开(公告)号：US06777799B2

公开(公告)日：2004-08-17

申请号：US10623490

申请日：2003-07-22

申请人： Katsuhito Kikuma ,  Mitsutaka Ikeda ,  Yoshihiro Tsukidate ,  Yuji Akashi ,  Kaname Ozawa ,  Akira Takashima ,  Takao Nishimura

发明人： Katsuhito Kikuma ,  Mitsutaka Ikeda ,  Yoshihiro Tsukidate ,  Yuji Akashi ,  Kaname Ozawa ,  Akira Takashima ,  Takao Nishimura

IPC分类号： H01L2302

CPC分类号： H01L25/0652 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.

公开(公告)号：US4838562A

公开(公告)日：1989-06-13

申请号：US164016

申请日：1988-03-04

申请人： Yuji Akashi

发明人： Yuji Akashi

IPC分类号： B23B31/10 ,  B23B31/16

CPC分类号： B23B31/16275 ,  Y10T279/18 ,  Y10T279/1986

摘要： In chucking, a workpiece is clamped while drawn to the chuck body for positive contact of the workpiece to stoppers, whereby a degree of machining accuracy is remarkably improved.

摘要翻译： 在夹紧时，工件被夹持在卡盘主体上，用于工件与塞子的正接触，从而显着提高了加工精度。

公开(公告)号：US20060108677A1

公开(公告)日：2006-05-25

申请号：US11261174

申请日：2005-10-28

申请人： Mitsutaka Ikeda ,  Katsuhito Kikuma ,  Sachiko Nogami ,  Yuji Akashi

发明人： Mitsutaka Ikeda ,  Katsuhito Kikuma ,  Sachiko Nogami ,  Yuji Akashi

IPC分类号： H01L23/02 ,  H01L21/50

CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L23/3128 ,  H01L24/29 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/85051 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A lower chip is fixed to a surface of an interposer by flip-chip bonding with an under fill acting as an adhesive applied to the surface. A lifted pad having a height of approximately 10 μm is provided on the surface of the interposer. A bonding wire connects the lifted pad and a bonding pad provided on a surface of an upper chip. A stick-out portion of the under fill at the time of fixing the lower chip to the interposer is dammed by the lifted portion of the lifted pad. This prevents the stick-out portion of the under fill from covering the top of the lifted pad.

摘要翻译： 下部芯片通过与作为施加到表面的粘合剂的底部填充物的倒装芯片粘结固定到插入件的表面。 在插入件的表面上设置高度约为10um的提升垫。 接合线连接提升的焊盘和设置在上部芯片的表面上的接合焊盘。 在将下芯片固定到插入件时，下填充物的伸出部分被提升垫的提升部分阻挡。 这防止了下填充物的伸出部分覆盖提升垫的顶部。

公开(公告)号：US06818999B2

公开(公告)日：2004-11-16

申请号：US10339678

申请日：2003-01-10

申请人： Katsuhito Kikuma ,  Yuji Akashi ,  Takeshi Ikuta

发明人： Katsuhito Kikuma ,  Yuji Akashi ,  Takeshi Ikuta

IPC分类号： H01L2348

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device of MCP structure, in which multiple semiconductor chips are provided in a single package and a method of manufacturing the same, that prevents damage of semiconductor chip that does not require burn-in and ensures the initial reliability of the semiconductor chip that requires the burn-in, are provided. The method has the steps of resin sealing and packaging the semiconductor chip that requires the burn-in and performing the burn-in to such packaged semiconductor chip; and mounting the semiconductor chip evaluated to be non-defective in the burn-in to the substrate along with the semiconductor chip not requiring the burn-in.

摘要翻译： 一种MCP结构的半导体器件，其中在单个封装中提供多个半导体芯片及其制造方法，其防止不需要老化的半导体芯片的损坏，并确保需要半导体芯片的初始可靠性 提供老化。 该方法具有树脂密封和封装需要老化并对这种封装的半导体芯片进行老化的半导体芯片; 以及将不进行老化的半导体芯片与在老化中被评估为无缺陷的半导体芯片一起安装到基板。

公开(公告)号：US6111312A

公开(公告)日：2000-08-29

申请号：US324167

申请日：1999-06-02

申请人： Yosuke Hirumuta ,  Yuji Akashi ,  Susumu Kida

发明人： Yosuke Hirumuta ,  Yuji Akashi ,  Susumu Kida

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L23/49555 ,  H01L23/3107 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01067 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K3/3426

摘要： A semiconductor device is provided. This semiconductor device includes a resin package, a semiconductor chip, and leads consisting of inner leads and outer leads. The rear surface of the semiconductor chip and the inner leads are situated substantially on the same plane. The resin package is provided with notches on its mounting surface. The outer leads are bent inward along the exterior of the resin package and pulled around to the mounting surface, so that the edges of the outer leads are engaged with the notches.

摘要翻译： 提供半导体器件。 该半导体器件包括树脂封装，半导体芯片和由内引线和外引线组成的引线。 半导体芯片的后表面和内引线基本上位于同一平面上。 树脂封装在其安装表面上设有凹口。 外引线沿着树脂封装的外部向内弯曲并被拉到安装表面，使得外引线的边缘与凹口接合。