公开(公告)号：US20100155653A1

公开(公告)日：2010-06-24

申请号：US12714174

申请日：2010-02-26

申请人： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

发明人： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

IPC分类号： C09K5/00 ,  H01B1/22

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08K9/04 ,  C09J183/04 ,  H05K3/321

摘要： A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

摘要翻译： 通过机械化学反应用氧化抑制剂对银基粉末进行表面处理。 制备银基粉末的方法包括使用氧化抑制剂的有机溶液作为润滑剂，向银基粉末施加机械能，并用所述氧化抑制剂对银基粉末进行表面处理 的机械化学反应。

公开(公告)号：US07074849B2

公开(公告)日：2006-07-11

申请号：US10822888

申请日：2004-04-13

申请人： Kazumi Nakayoshi ,  Katsutoshi Mine ,  Rikako Tazawa

发明人： Kazumi Nakayoshi ,  Katsutoshi Mine ,  Rikako Tazawa

IPC分类号： B05D3/02 ,  C08K9/06 ,  C08L83/05 ,  C08L83/06 ,  C08L83/07

CPC分类号： H01B1/22 ,  C08G77/045 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K3/08 ,  C08K9/06 ,  C08L83/04 ,  C08L83/00 ,  C08L2666/54

摘要： The electrical properties, particularly contact resistance and volume resistivity, of materials prepared by curing organosiloxane compositions containing finely divided silver as the electroconductive filler are improved by treating the silver particles with an organosilicon compound prior to incorporating the particles into the organosiloxane composition.

公开(公告)号：US20060047043A1

公开(公告)日：2006-03-02

申请号：US10536669

申请日：2003-11-17

申请人： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

发明人： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

IPC分类号： C08K3/22

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08K9/04 ,  C09J183/04 ,  H05K3/321

摘要： A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

摘要翻译： 通过机械化学反应用氧化抑制剂对银基粉末进行表面处理。 制备银基粉末的方法包括使用氧化抑制剂的有机溶液作为润滑剂，向银基粉末施加机械能，并用所述氧化抑制剂对银基粉末进行表面处理 的机械化学反应。

公开(公告)号：US5036024A

公开(公告)日：1991-07-30

申请号：US580054

申请日：1990-09-10

申请人： Katsutoshi Mine ,  Akemi Kogo ,  Kimio Yamakawa ,  Kazumi Nakayoshi

发明人： Katsutoshi Mine ,  Akemi Kogo ,  Kimio Yamakawa ,  Kazumi Nakayoshi

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3135 ,  H01L25/0652 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1301 ,  H01L2924/181 ,  Y10T29/49121

摘要： Semiconductor devices which comprise a semiconductor chip, electrically conductive materials for connections to external leads, and encapsulated by a sealing resin has a surface and a portion of the electrically conductive material covered with a hardened silicone layer whose surface is exposed to ultraviolet radiation and the irradiation processed surface adheres to and is unified with the sealing resin. The sealing resin does not break easily when the device is exposed to heat cycles, thermal shock, repeated interruptions in current flow, and long periods of time at high temperature or low temperature. Such devices also exhibit excellent properties of moisture resistance, corrosion resistance and stress relaxation.

公开(公告)号：US20050118845A1

公开(公告)日：2005-06-02

申请号：US10496558

申请日：2002-11-21

申请人： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

发明人： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

IPC分类号： C09J7/00 ,  C09J9/02 ,  C09J121/00 ,  C09J183/04 ,  H01B5/16 ,  H01B13/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01R11/01 ,  H05K3/32 ,  H01R4/58

CPC分类号： H01L24/83 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2483/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/29 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/0107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes. A semiconductor device characterized by the electrical connection of the terminals of a semiconductor chip to the interconnect pads of an interconnect substrate by the aforementioned anisotropically electroconductive adhesive film.

摘要翻译： 各向异性导电粘合剂膜的特征在于含有穿过粘合剂膜的厚度并在包含电绝缘弹性体的粘合剂膜的平面中绝缘的导电弹性体，并且导电弹性体和电绝缘弹性体都具有弹性模量 在150℃下不大于100MPa。 制造各向异性导电粘合膜的方法的特征在于，在包括电绝缘弹性体的粘合剂膜的厚度上形成通孔，然后用导电弹性体组合物填充通孔，并且固化导电弹性体组合物以形成导电弹性体 填充通孔。 一种半导体器件，其特征在于通过上述各向异性导电粘合剂膜将半导体芯片的端子与互连衬底的互连焊盘电连接。

公开(公告)号：US06518204B2

公开(公告)日：2003-02-11

申请号：US10094231

申请日：2002-03-07

申请人： Kimio Yamakawa ,  Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Junji Nakanishi ,  Tomoko Kato ,  Minoru Isshiki ,  Katsutoshi Mine

发明人： Kimio Yamakawa ,  Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Junji Nakanishi ,  Tomoko Kato ,  Minoru Isshiki ,  Katsutoshi Mine

IPC分类号： H01L2131

CPC分类号： H01L23/3135 ,  C08F283/12 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  H01L23/293 ,  H01L2224/48091 ,  H01L2924/1301 ,  H01L2924/19041 ,  C08F230/08 ,  H01L2924/00014 ,  H01L2924/00

摘要： A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule {alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)}; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition.

公开(公告)号：US5173765A

公开(公告)日：1992-12-22

申请号：US619842

申请日：1990-11-29

申请人： Kazumi Nakayoshi ,  Katsutoshi Mine

发明人： Kazumi Nakayoshi ,  Katsutoshi Mine

IPC分类号： C09J183/05 ,  C08L83/07 ,  C09J9/02 ,  C09J11/04 ,  C09J183/00 ,  C09J183/07 ,  H01B1/12 ,  H01L21/60 ,  H01L23/495 ,  H01R4/04

CPC分类号： H01L24/83 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05624 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85447 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/181 ,  Y10T428/31663

摘要： A conductive adhesive for bonding semiconductor pellets to tabs is made from a conductive addition reaction-curing silicone rubber composition which contains.ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure.gtoreq.10 mmHg at 200.degree. C. The conductive adhesive can contain a metal micropowder such as gold, silver, nickel or copper.

公开(公告)号：US5145931A

公开(公告)日：1992-09-08

申请号：US604843

申请日：1990-10-26

申请人： Kazumi Nakayoshi ,  Katsutoshi Mine

发明人： Kazumi Nakayoshi ,  Katsutoshi Mine

IPC分类号： H01L21/52 ,  C08G77/34 ,  C08L83/07 ,  C09J183/00 ,  C09J183/04 ,  C09J183/05 ,  C09J183/07

CPC分类号： C08G77/34 ,  C09J183/04 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/15747

摘要： An adhesive for bonding a semiconductor pellet to an attachment site where the adhesive is an addition reaction-curing silicone rubber composition which contain .ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure .gtoreq.10 mmHg at 200.degree. C.

公开(公告)号：US06797772B2

公开(公告)日：2004-09-28

申请号：US10052760

申请日：2002-01-18

申请人： Kazumi Nakayoshi ,  Katsutoshi Mine ,  Rikako Tazawa

发明人： Kazumi Nakayoshi ,  Katsutoshi Mine ,  Rikako Tazawa

IPC分类号： C08K906

CPC分类号： H01B1/22 ,  C08G77/045 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K3/08 ,  C08K9/06 ,  C08L83/04 ,  C08L83/00 ,  C08L2666/54

摘要： A composition comprises the product obtained by homogeneously blending: (A) 100 parts by weight of a polyorganosiloxane containing at least two alkenyl radicals per molecule, (B) an organohydrogensiloxane containing at least two silicon-bonded hydrogen atoms per molecule in a quantity sufficient to provide from 0.5 to 3 silicon-bonded hydrogen atoms per alkenyl radical of (A), (C) from 50-2000 parts by weight of silver particles pre-treated with an organosilicon compound selected from the group consisting of (i) alkoxy group(s)-containing silanes and (ii) organosiloxanes, (D) a platinum catalyst, (E) up to 20 weight percent based on the weight of (A) of an organosilicon compound containing at least one silicon-bonded alkoxy group per molecule, and (F) from 0.001 to 5 parts by weight per 100 parts by weight of (A) of a cure inhibitor.

摘要翻译： 组合物包括通过均匀共混获得的产物：（A）每分子100重量份含有至少两个烯基的聚有机硅氧烷，（B）每分子含有至少两个与硅键合的氢原子的有机氢硅氧烷，其量足够 对（A），（C）的每个烯基基团提供0.5至3个硅键合的氢原子，从50-2000重量份的预先用有机硅化合物处理的银粒子，所述有机硅化合物选自（i）烷氧基（ s）的硅烷和（ii）有机硅氧烷，（D）铂催化剂，（E）至多20重量％，基于每分子含有至少一个与硅键合的烷氧基的有机硅化合物的重量比（A） 和（F）0.001至5重量份/ 100重量份的（A）固化抑制剂。

公开(公告)号：US6039831A

公开(公告)日：2000-03-21

申请号：US231949

申请日：1999-01-15

申请人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

发明人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

IPC分类号： C08J3/24 ,  C08K3/08 ,  C08L83/04 ,  C08L83/06 ,  C08L83/07 ,  C09J183/04 ,  C09J183/06 ,  C09J183/07 ,  B32B31/28

CPC分类号： C08L83/04 ,  C08L83/06 ,  C09J183/04 ,  C09J183/06 ,  C08G77/12 ,  C08G77/20 ,  H01L2224/48091 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/3025

摘要： A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group containing organopolysiloxane such that when the compositon is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the compositon, both before and during the hydrosilyation reaction, is minimized.A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.A semiconductor device manufactured by this method which has improved reliability.

摘要翻译： 含有含有有机聚硅氧烷的丙烯酸官能团的氢化硅烷化固化型导电硅氧烷弹性体组合物，使得当将组合物用于将半导体芯片粘附到基底上，然后用高能量束照射组合物时，组合物的暴露外围固化成 在水解反应之前和期间，来自组合物的低分子量硅氧烷物质的迁移的程度最小化。 一种制造半导体器件的方法，其具有改进的可靠性，其中通过该组合物将半导体芯片粘合到基板，封装等时，与半导体芯片或引线框架的引线接合性降低，并且在 半导体芯片，基板，封装或引线框架和密封树脂可以被抑制。 通过该方法制造的具有提高的可靠性的半导体器件。