-
公开(公告)号：US08426073B2
公开(公告)日：2013-04-23
申请号：US12720002
申请日：2010-03-09
CPC分类号： H01M8/0668 , H01M8/04097 , H01M2008/1293 , H01M2008/147 , Y02E60/526
摘要： A fuel cell system includes a fuel cell configured to generate electric power with a fuel gas and an oxygen gas fed to the fuel cell and to discharge exhaust gas including CO2 as a result of generating the electric power; a CO extraction part configured to reduce the CO2 in the exhaust gas fed to the CO extraction part to CO, the CO extraction part including a processing container fed with the exhaust gas and a CO2 adsorbing member provided in the processing container and formed of an oxide having an oxygen deficiency; and a CO recycling part configured to feed the extracted CO to the fuel cell as part of the fuel gas.
摘要翻译： 燃料电池系统包括：燃料电池，被配置为利用燃料气体和供给燃料电池的氧气产生电力，并且由于产生电力而排出包括CO 2的废气; CO提取部，被配置为将供给到CO提取部的排气中的CO 2减少为CO，CO提取部包括供给有废气的处理容器和设置在处理容器中并由氧化物形成的CO 2吸附部件 缺氧; 以及CO循环部件，被配置为将所提取的CO作为燃料气体的一部分供给到燃料电池。
-
公开(公告)号：US20120058041A1
公开(公告)日：2012-03-08
申请号：US13292247
申请日：2011-11-09
CPC分类号： C01B4/00 , B01J23/002 , C01B3/042 , Y02E60/364
摘要： A gas generator includes a processing vessel defining a processing space and holding a support body therein, an evacuation system evacuating the processing space; a metal oxide film of a perovskite structure containing oxygen defects formed on the support body, a source gas supplying port supplying a source gas containing molecules of a source compound of carbon dioxide or water into the processing space, a gas outlet port for extracting a product gas containing molecules of a product compound in which oxygen atoms are removed from said source compound, and a heating part heating the support body.
摘要翻译： 气体发生器包括限定处理空间并将支撑体保持在其中的处理容器，排空系统排空处理空间; 包含形成在支撑体上的氧缺陷的钙钛矿结构的金属氧化物膜，向处理空间供给含有二氧化碳或水源化合物的分子的源气体的源气体供给口，用于提取产物的气体出口 含有其中从所述源化合物中除去氧原子的产物化合物的分子的气体和加热所述载体的加热部分。
-
3.发明授权Superconducting tunable filter having a patch resonator pattern tuned by a variable dielectric constant top plate 有权具有由可变介电常数顶板调谐的贴片谐振器图案的超导可调滤波器公开(公告)号：US07587229B2
公开(公告)日：2009-09-08
申请号：US11727660
申请日：2007-03-27
申请人： Masatoshi Ishii , Kazunori Yamanaka , Akihiko Akasegawa , John David Baniecki , Kazuaki Kurihara , Teru Nakanishi
发明人： Masatoshi Ishii , Kazunori Yamanaka , Akihiko Akasegawa , John David Baniecki , Kazuaki Kurihara , Teru Nakanishi
CPC分类号： H01P1/20381
摘要： A superconducting tunable filter comprises a dielectric base plate; a patch-shaped resonator pattern formed of a superconducting material on the dielectric base plate; a top dielectric locally placed on the superconducting resonator pattern at a prescribed position and made of a material with an electric-field dependent permittivity; a conducting pattern formed on a top face of the top dielectric; and a bias voltage supply configured to apply a bias voltage between the conducting pattern and the superconducting resonator pattern.
摘要翻译： 超导可调谐滤波器包括电介质基板; 由电介质基板上的超导材料形成的片状谐振器图案; 局部放置在超导谐振器图案上的指定位置的由电场相关的介电常数材料制成的顶部电介质; 形成在顶部电介质的顶面上的导电图案; 以及偏置电压源，被配置为在所述导电图案和所述超导谐振器图案之间施加偏置电压。
-
4.发明授权Thin-film capacitor and method for fabricating the same, electronic device and circuit board 有权薄膜电容器及其制造方法，电子器件和电路板公开(公告)号：US07456078B2
公开(公告)日：2008-11-25
申请号：US11393910
申请日：2006-03-31
IPC分类号： H01L21/20
CPC分类号： H01L23/5223 , H01G4/33 , H01L23/3114 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L28/55 , H01L28/65 , H01L2224/0231 , H01L2224/0401 , H01L2224/05155 , H01L2224/05552 , H01L2224/0557 , H01L2224/0603 , H01L2224/06102 , H01L2224/1147 , H01L2224/13022 , H01L2224/13023 , H01L2224/13025 , H01L2224/131 , H01L2224/14 , H01L2224/16 , H01L2224/16225 , H01L2224/2518 , H01L2224/32225 , H01L2224/73204 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/19103 , H01L2924/30105 , H01L2924/30107 , H05K1/0231 , H05K1/162 , H05K1/185 , H05K2201/0179 , H05K2201/09481 , H05K2201/10712 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： The thin-film capacitor comprises a capacitor part 20 formed over a base substrate 10 and including a first capacitor electrode 14, a capacitor dielectric film 16 formed over the first capacitor electrode 14, and a second capacitor electrode 18 formed over the capacitor dielectric film 16; leading-out electrodes 26a, 26b lead from the first capacitor electrode 14 or the second capacitor electrode 18 and formed of a conducting barrier film which prevents the diffusion of hydrogen or water; and outside connection electrodes 34a, 34b for connecting to outside and connected to the leading-out electrodes 26a, 26b.
摘要翻译： 薄膜电容器包括形成在基底基板10上并包括第一电容器电极14，形成在第一电容器电极14上的电容器电介质膜16的电容器部分20和形成在电容器电介质膜16上的第二电容器电极18 ; 引出电极26a，26b从第一电容器电极14或第二电容器电极18引出，并由阻止氢或水扩散的导电阻挡膜形成; 以及用于连接到外部并连接到引出电极26a，26b的外部连接电极34a，34b。
-
公开(公告)号：US20100233796A1
公开(公告)日：2010-09-16
申请号：US12720002
申请日：2010-03-09
CPC分类号： H01M8/0668 , H01M8/04097 , H01M2008/1293 , H01M2008/147 , Y02E60/526
摘要： A fuel cell system includes a fuel cell configured to generate electric power with a fuel gas and an oxygen gas fed to the fuel cell and to discharge exhaust gas including CO2 as a result of generating the electric power; a CO extraction part configured to reduce the CO2 in the exhaust gas fed to the CO extraction part to CO, the CO extraction part including a processing container fed with the exhaust gas and a CO2 adsorbing member provided in the processing container and formed of an oxide having an oxygen deficiency; and a CO recycling part configured to feed the extracted CO to the fuel cell as part of the fuel gas.
摘要翻译： 燃料电池系统包括：燃料电池，被配置为利用燃料气体和供给燃料电池的氧气产生电力，并且由于产生电力而排出包括CO 2的废气; CO提取部，被配置为将供给到CO提取部的排气中的CO 2减少为CO，CO提取部包括供给有废气的处理容器和设置在处理容器中并由氧化物形成的CO 2吸附部 缺氧; 以及CO循环部件，被配置为将所提取的CO作为燃料气体的一部分供给到燃料电池。
-
公开(公告)号：US08313726B2
公开(公告)日：2012-11-20
申请号：US13292247
申请日：2011-11-09
CPC分类号： C01B4/00 , B01J23/002 , C01B3/042 , Y02E60/364
摘要： A gas generator includes a processing vessel defining a processing space and holding a support body therein, an evacuation system evacuating the processing space; a metal oxide film of a perovskite structure containing oxygen defects formed on the support body, a source gas supplying port supplying a source gas containing molecules of a source compound of carbon dioxide or water into the processing space, a gas outlet port for extracting a product gas containing molecules of a product compound in which oxygen atoms are removed from said source compound, and a heating part heating the support body.
摘要翻译： 气体发生器包括限定处理空间并将支撑体保持在其中的处理容器，排空系统排空处理空间; 包含形成在支撑体上的氧缺陷的钙钛矿结构的金属氧化物膜，向处理空间供给含有二氧化碳或水源化合物的分子的源气体的源气体供给口，用于提取产物的气体出口 含有其中从所述源化合物中除去氧原子的产物化合物的分子的气体和加热所述载体的加热部分。
-
7.发明申请PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT BOARD FABRICATION METHOD 有权电镀方法，半导体器件制造方法和电路板制造方法公开(公告)号：US20110168564A1
公开(公告)日：2011-07-14
申请号：US13043854
申请日：2011-03-09
IPC分类号： C25D7/12
CPC分类号： H01L24/91 , H01L21/4846 , H01L21/4857 , H01L21/486 , H01L21/76801 , H01L21/7687 , H01L21/76873 , H01L21/76874 , H01L21/76885 , H01L23/5283 , H01L23/5389 , H01L24/11 , H01L24/19 , H01L24/45 , H01L24/48 , H01L24/82 , H01L2224/02333 , H01L2224/0401 , H01L2224/04105 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05644 , H01L2224/05655 , H01L2224/1134 , H01L2224/12105 , H01L2224/13144 , H01L2224/13147 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48132 , H01L2224/73267 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01046 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/381 , H05K3/4602 , H05K3/4661 , H05K2201/0209 , H05K2201/086 , H05K2201/09509 , H05K2203/0195 , H05K2203/0228 , H01L2224/13099 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The plating method comprises the step of forming a resin layer 10 over a substrate 16; the step of cutting the surface part of the resin layer 10 with a cutting tool 12; the step of forming a seed layer 36 on the resin layer 10 by electroless plating; and the step of forming a plating film 44 on the seed layer 36 by electroplating. Suitable roughness can be give to the surface of the resin layer 10, whereby the adhesion between the seed layer 36 and the resin layer 10 can be sufficiently ensured. Excessively deep pores are not formed in the surface of the resin layer 10 as are by desmearing treatment, whereby a micronized pattern of a photoresist film 40 can be formed on the resin layer 10. Thus, interconnections 44, etc. can be formed over the resin layer 10 at a narrow pitch with high reliability ensured.
摘要翻译： 电镀方法包括在基板16上形成树脂层10的步骤; 用切割工具12切割树脂层10的表面部分的步骤; 通过无电解电镀在树脂层10上形成种子层36的步骤; 以及通过电镀在种子层36上形成电镀膜44的步骤。 可以赋予树脂层10的表面适当的粗糙度，由此能够充分确保种子层36与树脂层10之间的粘附性。 在树脂层10的表面没有形成过度的深孔，如通过去污处理，从而可以在树脂层10上形成光致抗蚀剂膜40的微粉化图案。因此，可以在 确保了高可靠性的窄间距树脂层10。
-
公开(公告)号：US07832069B2
公开(公告)日：2010-11-16
申请号：US11790732
申请日：2007-04-27
IPC分类号： H01G7/00
CPC分类号： H01L27/0805 , H01L21/76877 , H01L24/11 , H01L28/40 , H01L2224/06102 , H01L2224/1147 , H01L2224/13023 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/43 , Y10T29/435 , Y10T29/49126 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156
摘要： A capacitor device includes a capacitor Q constituted by a lower electrode (12) formed on a substrate (10), a dielectric film (14), and an upper electrode (16); an insulating film (18) covering the capacitor Q; a first contact hole (18a) formed in the insulating film (18) on a connection portion (16a) of the upper electrode (16); an electrode pad (20) for preventing a diffusion of solder, formed in the first contact hole (18a); and a solder bump (22) electrically connected to the electrode pad (20), and the upper electrode (16) has a protrusion portion (16a) protruding from the dielectric film (14), and is connected to the first contact hole (18a) on the protrusion portion (16a).
摘要翻译： 电容器装置包括由形成在基板（10）上的下电极（12），电介质膜（14）和上电极（16）构成的电容器Q; 覆盖电容器Q的绝缘膜（18）; 形成在所述上电极（16）的连接部（16a）上的绝缘膜（18）中的第一接触孔（18a） 用于防止形成在第一接触孔（18a）中的焊料扩散的电极焊盘（20）; 和与电极焊盘（20）电连接的焊料凸块（22），上部电极（16）具有从电介质膜（14）突出的突出部（16a），与第一接触孔 ）突出部（16a）。
-
9.发明申请PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT BOARD FABRICATION METHOD 有权电镀方法，半导体器件制造方法和电路板制造方法公开(公告)号：US20100112775A1
公开(公告)日：2010-05-06
申请号：US12684570
申请日：2010-01-08
IPC分类号： H01L21/02 , H01L21/768
CPC分类号： H01L24/91 , H01L21/4846 , H01L21/4857 , H01L21/486 , H01L21/76801 , H01L21/7687 , H01L21/76873 , H01L21/76874 , H01L21/76885 , H01L23/5283 , H01L23/5389 , H01L24/11 , H01L24/19 , H01L24/45 , H01L24/48 , H01L24/82 , H01L2224/02333 , H01L2224/0401 , H01L2224/04105 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05644 , H01L2224/05655 , H01L2224/1134 , H01L2224/12105 , H01L2224/13144 , H01L2224/13147 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48132 , H01L2224/73267 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01046 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/381 , H05K3/4602 , H05K3/4661 , H05K2201/0209 , H05K2201/086 , H05K2201/09509 , H05K2203/0195 , H05K2203/0228 , H01L2224/13099 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The plating method comprises the step of forming a resin layer 10 over a substrate 16; the step of cutting the surface part of the resin layer 10 with a cutting tool 12; the step of forming a seed layer 36 on the resin layer 10 by electroless plating; and the step of forming a plating film 44 on the seed layer 36 by electroplating. Suitable roughness can be give to the surface of the resin layer 10, whereby the adhesion between the seed layer 36 and the resin layer 10 can be sufficiently ensured. Excessively deep pores are not formed in the surface of the resin layer 10, as are by desmearing treatment, whereby a micronized pattern of a photoresist film 40 can be formed on the resin layer 10. Thus, interconnections 44, etc. can be formed over the resin layer 10 at a narrow pitch with high reliability ensured.
摘要翻译： 电镀方法包括在基板16上形成树脂层10的步骤; 用切割工具12切割树脂层10的表面部分的步骤; 通过无电解电镀在树脂层10上形成种子层36的步骤; 以及通过电镀在种子层36上形成电镀膜44的步骤。 可以赋予树脂层10的表面适当的粗糙度，由此能够充分确保种子层36与树脂层10之间的粘附性。 树脂层10的表面上也不会形成过度的深孔，如通过干燥处理，可以在树脂层10上形成光致抗蚀剂膜40的微细化图案。因此，可以形成互连44等 能够确保高可靠性的窄间距的树脂层10。
-
10.发明授权Plating method, semiconductor device fabrication method and circuit board fabrication method 有权电镀方法，半导体器件制造方法和电路板制造方法公开(公告)号：US07670940B2
公开(公告)日：2010-03-02
申请号：US11250399
申请日：2005-10-17
IPC分类号： H01L21/76
CPC分类号： H01L24/91 , H01L21/4846 , H01L21/4857 , H01L21/486 , H01L21/76801 , H01L21/7687 , H01L21/76873 , H01L21/76874 , H01L21/76885 , H01L23/5283 , H01L23/5389 , H01L24/11 , H01L24/19 , H01L24/45 , H01L24/48 , H01L24/82 , H01L2224/02333 , H01L2224/0401 , H01L2224/04105 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05644 , H01L2224/05655 , H01L2224/1134 , H01L2224/12105 , H01L2224/13144 , H01L2224/13147 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48132 , H01L2224/73267 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01046 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/381 , H05K3/4602 , H05K3/4661 , H05K2201/0209 , H05K2201/086 , H05K2201/09509 , H05K2203/0195 , H05K2203/0228 , H01L2224/13099 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The plating method comprises the step of forming a resin layer 10 over a substrate 16; the step of cutting the surface part of the resin layer 10 with a cutting tool 12; the step of forming a seed layer 36 on the resin layer 10 by electroless plating; and the step of forming a plating film 44 on the seed layer 36 by electroplating. Suitable roughness can be give to the surface of the resin layer 10, whereby the adhesion between the seed layer 36 and the resin layer 10 can be sufficiently ensured. Excessively deep pores are not formed in the surface of the resin layer 10, as are by desmearing treatment, whereby a micronized pattern of a photoresist film 40 can be formed on the resin layer 10. Thus, interconnections 44, etc. can be formed over the resin layer 10 at a narrow pitch with high reliability ensured.
摘要翻译： 电镀方法包括在基板16上形成树脂层10的步骤; 用切割工具12切割树脂层10的表面部分的步骤; 通过无电解电镀在树脂层10上形成种子层36的步骤; 以及通过电镀在种子层36上形成电镀膜44的步骤。 可以赋予树脂层10的表面适当的粗糙度，由此能够充分确保种子层36与树脂层10之间的粘附性。 树脂层10的表面上也不会形成过度的深孔，如通过干燥处理，可以在树脂层10上形成光致抗蚀剂膜40的微细化图案。因此，可以形成互连44等 能够确保高可靠性的窄间距的树脂层10。
-
-
-
-
-
-
-
-
-
搜索结果
51 条记录 (耗时 0.028 秒)