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35 条记录 (耗时 0.021 秒)

    Electrical connector for opto-electronic modules
    2.
    发明授权
    Electrical connector for opto-electronic modules 有权
    光电模块用电接头

    公开(公告)号：US06802654B1

    公开(公告)日：2004-10-12

    申请号：US10119619

    申请日：2002-04-09

    申请人： Bruce C. Roberts ,  Stephen A. Gee ,  William P. Mazotti ,  Luu T. Nguyen ,  Jia Liu ,  Peter Deane ,  Ken Pham

    发明人： Bruce C. Roberts ,  Stephen A. Gee ,  William P. Mazotti ,  Luu T. Nguyen ,  Jia Liu ,  Peter Deane ,  Ken Pham

    IPC分类号： G02B636

    CPC分类号： H05K1/0219 ,  G02B6/4245 ,  G02B6/4261 ,  G02B6/4284 ,  H05K1/189 ,  H05K3/403 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/10121

    摘要： The invention comprises a connector apparatus for electrically interconnecting a chip sub-assembly to an optical sub-assembly. The apparatus includes a connector sleeve with a chip sub-assembly having at least one electrical connection arranged thereon. The connector sleeve is suitable for receiving a connector plug that includes an optical fiber optically coupled to the photonic devices of an optical sub-assembly that includes electrical connectors. The connector plug is engaged with the connector sleeve, thereby electrically interconnecting the electrical connections of the chip sub-assembly to the electrical connectors of the optical sub-assembly such that electrical signals can pass between the chip sub-assembly and a photonic device of the optical sub-assembly.

    摘要翻译： 本发明包括用于将芯片子组件电连接到光学子组件的连接器装置。 该装置包括具有芯片子组件的连接器套筒，其具有布置在其上的至少一个电连接。 连接器套筒适于接收连接器插头，该连接器插头包括光学耦合到包括电连接器的光学子组件的光子器件的光纤。 连接器插头与连接器套筒接合，由此将芯片子组件的电连接电连接到光学子组件的电连接器，使得电信号可以在芯片子组件和光子装置的光子器件之间通过 光学子组件。

    Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards
    5.
    发明授权
    Apparatus and method for electro-optical packages that facilitate the coupling of optical cables to printed circuit boards 有权
    用于电光封装的装置和方法，其有助于将光缆耦合到印刷电路板

    公开(公告)号：US06749345B1

    公开(公告)日：2004-06-15

    申请号：US10155743

    申请日：2002-05-24

    申请人： Stephen Andrew Gee ,  Luu Thanh Nguyen ,  Ken Pham ,  Jia Liu ,  William Paul Mazotti ,  Bruce Carlton Roberts ,  Peter Deane

    发明人： Stephen Andrew Gee ,  Luu Thanh Nguyen ,  Ken Pham ,  Jia Liu ,  William Paul Mazotti ,  Bruce Carlton Roberts ,  Peter Deane

    IPC分类号： G02B638

    CPC分类号： G02B6/4277 ,  G02B6/421 ,  G02B6/424 ,  G02B6/425 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/428 ,  G02B6/4292

    摘要： Electro-optical packages that embed the electronics of the packages directly to the optical cabling, provide short electrical connection paths for high performance, and that provide a robust interconnects. A first electro-optical package includes an integrated circuit and a connector sleeve configured to receive a plug-in optical assembly from the underside of the PC board. The plug-in optical assembly includes a backing piece and an opto-electric device mounted onto the backing piece. An electrical connection is provided between the opto-electric device and a contact location on the backing piece and a contact is provided between the contact location on the backing piece and the integrated circuit. With a second electro-optical package, an integrated circuit having an active surface facing in a first direction and an opto-electric device having contact points facing a second direction are provided. The integrated circuit and the opto-electric are positioned with respect to one another such that a direct electrical connection can be formed between the active surface of the integrated circuit and the contact points of the opto-electrical device.

    摘要翻译： 将封装的电子元件直接嵌入光缆的电光封装，为高性能提供短的电连接路径，并提供稳健的互连。 第一电光学封装包括集成电路和连接器套管，其被配置为从PC板的下侧接收插入式光学组件。 插入式光学组件包括背衬片和安装在背衬片上的光电装置。 在光电装置和背衬片上的接触位置之间提供电连接，并且在背衬片上的接触位置和集成电路之间提供触点。 通过第二电光封装，提供具有面向第一方向的有源表面的集成电路和具有面向第二方向的接触点的光电装置。 集成电路和光电相对于彼此定位，使得可以在集成电路的有源表面和光电装置的接触点之间形成直接电连接。

    Encapsulant material applicator for semiconductor wafers and method of use thereof
    6.
    发明授权
    Encapsulant material applicator for semiconductor wafers and method of use thereof 有权
    用于半导体晶片的封装材料施加器及其使用方法

    公开(公告)号：US06730170B1

    公开(公告)日：2004-05-04

    申请号：US09715358

    申请日：2000-11-17

    申请人： Ken Pham ,  Nikhil Vishwanath Kelkar ,  Vivek Kishorechand Arora

    发明人： Ken Pham ,  Nikhil Vishwanath Kelkar ,  Vivek Kishorechand Arora

    IPC分类号： B05C300

    CPC分类号： H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An encapsulant applicator comprising a flexor formed of a resilient material and a substantially rigid blade is described. The blade is attached to the flexor in a way that during a smoothing process, a force applied through the flexor is distributed across the second edge of the blade. Another aspect of the invention pertains to a system for forming a substantially uniform layer of material on a surface of a semiconductor wafer. The system of the present invention includes a stencil, an applicator and a conveyor device. The stencil is placed over the surface of the wafer so that an opening in the stencil exposes a portion of the surface of the wafer. The conveyor device is connected to the flexor so that during the smoothing process, the conveyor device moves the applicator across the opening of the stencil. Yet another aspect of the invention pertains to a method for applying a substantially uniform layer of flowable material to a surface of a semiconductor wafer using the applicator as described.

    摘要翻译： 描述了包括由弹性材料形成的屈肌和基本上刚性的刀片的密封剂涂抹器。 刀片以一种在平滑过程中连接到屈肌的方式，通过屈肌施加的力分布在叶片的第二边缘上。 本发明的另一方面涉及一种用于在半导体晶片的表面上形成基本均匀的材料层的系统。 本发明的系统包括模版，涂抹器和输送装置。 模板放置在晶片的表面上，使得模板中的开口暴露晶片表面的一部分。 传送装置连接到屈肌，使得在平滑过程期间，输送装置将涂抹器移动穿过模板的开口。 本发明的另一方面涉及一种使用所述的施用器将基本均匀的可流动材料层施加到半导体晶片的表面的方法。

    Optoelectronic package with dam structure to provide fiber standoff
    7.
    发明授权
    Optoelectronic package with dam structure to provide fiber standoff 有权
    具有大坝结构的光电封装提供光纤隔离

    公开(公告)号：US06655854B1

    公开(公告)日：2003-12-02

    申请号：US09922357

    申请日：2001-08-03

    申请人： Luu Thanh Nguyen ,  Ken Pham ,  Peter Deane ,  William Paul Mazotti ,  Bruce Carlton Roberts

    发明人： Luu Thanh Nguyen ,  Ken Pham ,  Peter Deane ,  William Paul Mazotti ,  Bruce Carlton Roberts

    IPC分类号： G02B636

    CPC分类号： G02B6/4231 ,  G02B6/4202 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An optoelectronic component is described that includes a photonic device carried by a base substrate. A dam structure is formed on the base substrate by dispensing and hardening a precise amount of a flowable material. The dam structure is sized to define a desired standoff between an optical fiber and an active facet on the photonic device. In embodiments where the photonic device is wire bonded to the base substrate, it may be desirable to provide a reverse wire bond in order to permit the optical fiber to be placed closer to the photonic device. In some embodiments, the base substrate takes the form of a flexible material having electrically conductive traces thereon that are electrically connected to the photonic device. An optical component support block may be provided to support the flex material. In some implementations, a semiconductor die may be directly soldered to the traces on the flexible material.

    摘要翻译： 描述了包括由基底衬底承载的光子器件的光电子部件。 通过分配和硬化精确量的可流动材料，在基底基板上形成坝结构。 大坝结构的尺寸设计成在光子器件上限定光纤和活性刻面之间的期望间隔。 在其中光子器件被引线键合到基底衬底的实施例中，可能需要提供反向引线键合以允许光纤被放置得更靠近光子器件。 在一些实施例中，基底衬底采用柔性材料的形式，其上具有与光子器件电连接的导电迹线。 可以提供光学部件支撑块以支撑柔性材料。 在一些实施方案中，半导体管芯可以直接焊接到柔性材料上的迹线上。