公开(公告)号：US20080122047A1

公开(公告)日：2008-05-29

申请号：US11973869

申请日：2007-10-10

申请人： Kenneth Allen Honer ,  Guilian Gao ,  William Walter Carlson ,  Michael Warner

发明人： Kenneth Allen Honer ,  Guilian Gao ,  William Walter Carlson ,  Michael Warner

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L24/48 ,  H01L25/105 ,  H01L27/222 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3025 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Various structures chip packages are disclosed including a magnetoresistive random access memory (“MRAM”) device and a magnetic shield structure. The magnetic shield structure may be made from material having either ferromagnetic or diamagnetic material and may be shaped and incorporated into the chip package to divert stray magnetic fields away from the MRAM device.

摘要翻译： 公开了包括磁阻随机存取存储器（“MRAM”）器件和磁屏蔽结构的各种结构芯片封装。 磁屏蔽结构可以由具有铁磁性或反磁性材料的材料制成，并且可以被成形并结合到芯片封装中以将杂散磁场转移离开MRAM器件。

公开(公告)号：US08269319B2

公开(公告)日：2012-09-18

申请号：US11973869

申请日：2007-10-10

申请人： Kenneth Allen Honer ,  Guilian Gao ,  William Walter Carlson ,  Michael Warner

发明人： Kenneth Allen Honer ,  Guilian Gao ,  William Walter Carlson ,  Michael Warner

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L24/48 ,  H01L25/105 ,  H01L27/222 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3025 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Various structures chip packages are disclosed including a magnetoresistive random access memory (“MRAM”) device and a magnetic shield structure. The magnetic shield structure may be made from material having either ferromagnetic or diamagnetic material and may be shaped and incorporated into the chip package to divert stray magnetic fields away from the MRAM device.

摘要翻译： 公开了包括磁阻随机存取存储器（“MRAM”）器件和磁屏蔽结构的各种结构芯片封装。 磁屏蔽结构可以由具有铁磁性或反磁性材料的材料制成，并且可以被成形并结合到芯片封装中以将杂散磁场转移离开MRAM器件。

公开(公告)号：US20090162975A1

公开(公告)日：2009-06-25

申请号：US12315855

申请日：2008-12-04

申请人： Kenneth Allen Honer ,  Belgacem Haba ,  David Ovrutsky ,  Charles Rosenstein ,  Guilian Gao

发明人： Kenneth Allen Honer ,  Belgacem Haba ,  David Ovrutsky ,  Charles Rosenstein ,  Guilian Gao

IPC分类号： H01L21/00

CPC分类号： H01L23/13 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/49174 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method is provided for forming a microelectronic package at a wafer level. Such method can include providing a semiconductor wafer having a surface with a pattern of electrical contacts thereon. An interposer component can be provided which has a compliant dielectric layer bonded to a conductive layer. A pattern of holes can be formed through the compliant dielectric layer and the conductive layer which corresponds to the pattern of electrical contacts. The compliant dielectric layer can be contacted with the semiconductor wafer surface so that the pattern of holes is in an aligned position with the pattern of contacts and the compliant dielectric layer and the semiconductor wafer surface then bonded in the aligned position to unite the semiconductor wafer and the interposer component to form a wafer level semiconductor package. The wafer level semiconductor package can be diced to form individual semiconductor chip packages.

摘要翻译： 提供了一种用于在晶片级形成微电子封装的方法。 这种方法可以包括提供具有其上具有电触点图案的表面的半导体晶片。 可以提供具有结合到导电层的柔性介电层的插入件部件。 可以通过柔性电介质层和对应于电接触图案的导电层形成孔的图案。 柔性电介质层可以与半导体晶片表面接触，使得孔的图案与触点图案在对准位置中，并且柔性电介质层和半导体晶片表面然后在对准位置接合以使半导体晶片和 所述插入器部件形成晶片级半导体封装。 可以对晶片级半导体封装进行切割以形成单独的半导体芯片封装。

公开(公告)号：US08053281B2

公开(公告)日：2011-11-08

申请号：US12315855

申请日：2008-12-04

申请人： Kenneth Allen Honer ,  Belgacem Haba ,  David Ovrutsky ,  Charles Rosenstein ,  Guilian Gao

发明人： Kenneth Allen Honer ,  Belgacem Haba ,  David Ovrutsky ,  Charles Rosenstein ,  Guilian Gao

IPC分类号： H01L21/00

CPC分类号： H01L23/13 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/49174 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method is provided for forming a microelectronic package at a wafer level. Such method can include providing a semiconductor wafer having a surface with a pattern of electrical contacts thereon. An interposer component can be provided which has a compliant dielectric layer bonded to a conductive layer. A pattern of holes can be formed through the compliant dielectric layer and the conductive layer which corresponds to the pattern of electrical contacts. The compliant dielectric layer can be contacted with the semiconductor wafer surface so that the pattern of holes is in an aligned position with the pattern of contacts and the compliant dielectric layer and the semiconductor wafer surface then bonded in the aligned position to unite the semiconductor wafer and the interposer component to form a wafer level semiconductor package. The wafer level semiconductor package can be diced to form individual semiconductor chip packages.

摘要翻译： 提供了一种用于在晶片级形成微电子封装的方法。 这种方法可以包括提供具有其上具有电触点图案的表面的半导体晶片。 可以提供具有结合到导电层的柔性介电层的插入件部件。 可以通过柔性电介质层和对应于电接触图案的导电层形成孔的图案。 柔性电介质层可以与半导体晶片表面接触，使得孔的图案与接触图案在对准位置中，并且柔性介电层和半导体晶片表面然后在对准位置接合以使半导体晶片和 所述插入器部件形成晶片级半导体封装。 可以对晶片级半导体封装进行切割以形成单独的半导体芯片封装。

公开(公告)号：US07763983B2

公开(公告)日：2010-07-27

申请号：US11825121

申请日：2007-07-02

申请人： Kenneth Allen Honer ,  Jae M. Park

发明人： Kenneth Allen Honer ,  Jae M. Park

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/3121 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49805 ,  H01L23/49861 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/81191 ,  H01L2224/81805 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15313 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacturing a microelectronic package. The method includes the steps of attaching at least one microelectronic element to a tape having upper terminals projecting upwardly from an upper surface of a dielectric layer, so that top surfaces of the terminals are disposed coplanar with or above a top surface of the microelectronic element after the attaching step, electrically connecting the microelectronic element to at least some of the upper terminals; and further includes the step of applying an encapsulant to cover at least a portion of the upper surface of the dielectric layer, leaving the upper terminals surfaces of the terminals exposed.

摘要翻译： 一种制造微电子封装的方法。 该方法包括以下步骤：将至少一个微电子元件附接到具有从电介质层的上表面向上突出的上端子的带，使得端子的顶表面设置为与微电子元件的顶表面共面或上方，在 所述附接步骤将所述微电子元件电连接到所述上端子中的至少一些; 并且还包括施加密封剂以覆盖电介质层的上表面的至少一部分的步骤，使端子的上端子表面露出。

公开(公告)号：US20090023249A1

公开(公告)日：2009-01-22

申请号：US12283710

申请日：2008-09-15

申请人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

发明人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

IPC分类号： H01L21/50

CPC分类号： B81B7/0006 ,  B81C1/00269 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

摘要翻译： 微电子器件包括具有前表面和后表面的芯片，前表面具有有源区域和暴露在有源区域外部的前表面处的多个触点。 该装置还包括盖在前表面上的盖。 盖具有边缘边缘，边缘中的至少一个包括一个或多个外部部分和一个或多个从外部部分横向向内延伸的凹部，触头与凹部对准并暴露在其中。

公开(公告)号：US08387531B2

公开(公告)日：2013-03-05

申请号：US12072687

申请日：2008-02-27

申请人： Kenneth Allen Honer ,  Rolfe Tyson Gustus ,  Ilyas Mohammed

发明人： Kenneth Allen Honer ,  Rolfe Tyson Gustus ,  Ilyas Mohammed

IPC分类号： F42C19/06

CPC分类号： F42C1/00 ,  F42C11/00 ,  F42C19/06 ,  H01H29/002 ,  H01H35/146

摘要： An impact switch includes a housing having a wall including at least two electrically conductive contact elements spaced apart from one another. The switch includes an inertial body having a conductive surface disposed in a tapered aperture and electrically connecting the contact elements to one another in a switch closed condition. An impact switch for rapidly firing an explosive device is provided.

摘要翻译： 冲击开关包括具有包括彼此间隔开的至少两个导电接触元件的壁的壳体。 开关包括具有设置在锥形孔中的导电表面并且在开关闭合状态下将接触元件彼此电连接的惯性体。 提供了用于快速点燃爆炸装置的冲击开关。

公开(公告)号：US07566853B2

公开(公告)日：2009-07-28

申请号：US11317207

申请日：2005-12-23

申请人： David B. Tuckerman ,  Kenneth Allen Honer ,  Bruce M. McWilliams ,  Nicholas J. Colella ,  Charles Liam Goudge

发明人： David B. Tuckerman ,  Kenneth Allen Honer ,  Bruce M. McWilliams ,  Nicholas J. Colella ,  Charles Liam Goudge

IPC分类号： H01L27/00

CPC分类号： H04N5/2257 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14632 ,  H01L2924/0002 ,  H04N5/3415 ,  H04N9/045 ,  H04N9/09 ,  H01L2924/00

摘要： Image sensors are provided having a plurality of photodetectors in a detector layer Optionally, an optically transparent substrate is provided for a rear-illuminated sensor architecture. The photodetectors may be arranged in three or more arrays. Typically, each array is contiguous and is associated with light of a different color and/or wavelength. In addition, the arrays may be coplanar, or, in the alternative, located at increasing distances from a light-receiving surface in an at least partially nonoverlapping manner. Also provided are image sensor packages.

摘要翻译： 提供了在检测器层中具有多个光电检测器的图像传感器。可选地，为背照式传感器架构提供光学透明基板。 光电检测器可以被布置成三个或更多个阵列。 通常，每个阵列是连续的并且与不同颜色和/或波长的光相关联。 此外，阵列可以是共面的，或者在替代方案中，以至少部分不重叠的方式位于与光接收表面增加的距离处。 还提供了图像传感器封装。

公开(公告)号：US20080277775A1

公开(公告)日：2008-11-13

申请号：US11803006

申请日：2007-05-11

申请人： Kenneth Allen Honer ,  Philip Damberg

发明人： Kenneth Allen Honer ,  Philip Damberg

IPC分类号： H01L23/02 ,  H01L21/52 ,  H05K7/00 ,  H05K3/00

CPC分类号： H01L21/768 ,  H01L21/56 ,  H01L23/055 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2924/0002 ,  Y10T29/49165 ,  H01L2924/00

摘要： A microelectronic package including a dielectric layer having top and bottom surfaces, the dielectric layer having terminals exposed at the bottom surface; a metallic wall bonded to the dielectric layer and projecting upwardly from the top surface of the dielectric layer and surrounding a region of the top surface; a metallic lid bonded to the wall and extending over the region of the top surface so that the lid, the wall and the dielectric layer cooperatively define an enclosed space; and a microelectronic element disposed within the space and electrically connected to the terminals.

摘要翻译： 一种微电子封装，包括具有顶表面和底表面的电介质层，所述电介质层具有在底表面处露出的端子; 金属壁结合到电介质层并从电介质层的顶表面向上突出并围绕顶表面的区域; 金属盖结合到壁上并在顶表面的区域上延伸，使得盖，壁和介电层协作地限定封闭空间; 以及设置在所述空间内并电连接到所述端子的微电子元件。

公开(公告)号：US20080246136A1

公开(公告)日：2008-10-09

申请号：US12072508

申请日：2008-02-26

申请人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

发明人： Belgacem Haba ,  Kenneth Allen Honer ,  David B. Tuckerman ,  Vage Oganesian

IPC分类号： H01L23/48 ,  H01L21/58

CPC分类号： H01L23/3128 ,  H01L23/481 ,  H01L24/10 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14683 ,  H01L29/0657 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H04N5/2257 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic unit is provided in which front and rear surfaces of a semiconductor element may define a thin region which has a first thickness and a thicker region having a thickness at least about twice the first thickness. A semiconductor device may be present at the front surface, with a plurality of first conductive contacts at the front surface connected to the device. A plurality of conductive vias may extend from the rear surface through the thin region of the semiconductor element to the first conductive contacts. A plurality of second conductive contacts can be exposed at an exterior of the semiconductor element. A plurality of conductive traces may connect the second conductive contacts to the conductive vias.

摘要翻译： 提供了一种微电子单元，其中半导体元件的前表面和后表面可以限定具有第一厚度的薄区域和具有至少大约第二厚度的两倍的厚度的较厚区域。 半导体器件可以存在于前表面处，在前表面处连接有多个第一导电触点以连接到器件。 多个导电通孔可以从后表面延伸穿过半导体元件的薄区域到第一导电触点。 多个第二导电触头可以在半导体元件的外部暴露。 多个导电迹线可以将第二导电触点连接到导电通孔。