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1.发明授权Electrical component package comprising polymer-reinforced solder bump interconnection 失效包括聚合物增强的焊料凸块互连的电气部件封装
公开(公告)号：US5120678A
公开(公告)日：1992-06-09
申请号：US609483
申请日：1990-11-05
申请人： Kevin D. Moore , Steven C. Machuga , John W. Stafford , Kenneth Cholewczynski , Dennis B. Miller
发明人： Kevin D. Moore , Steven C. Machuga , John W. Stafford , Kenneth Cholewczynski , Dennis B. Miller
IPC分类号： H01L21/58 , H01L23/498 , H05K3/28 , H05K3/34
CPC分类号： H01L24/83 , H01L23/49816 , H01L24/29 , H05K3/284 , H05K3/3436 , H01L2224/2919 , H01L2224/48091 , H01L2224/48227 , H01L2224/8319 , H01L2224/8385 , H01L24/48 , H01L2924/00014 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15787 , H01L2924/16152 , H05K2201/09072 , H05K2201/09909 , H05K2201/10977 , Y02P70/613 , Y10T29/49144 , Y10T29/49146
摘要： An improved method is provided for assembling an integrated circuit component to a substrate by a solder bump interconnection that is reinforced by a polymer film. The component is attached to a region of the substrate by a plurality of solder bump interconnections that create a gap between the component interface and the substrate region. A polymer dam is applied to the region encircling the attached component spaced apart therefrom. A liquid polymer precursor material is applied to the region including the gap and is confined by the dam to prevent indiscriminate flow across the substrate. In one aspect of this invention, gas is vented from the gap through a passage in the substrate to enhance fill by the precursor liquid. In another aspect of this invention, the precursor liquid is injected into the gap through a passage in the substrate and spread outwardly therefrom. In any event, the precursor liquid infiltrates the gap about the solder interconnections and is cured to form a film that reinforces and protectively encapsulates the solder interconnections.
摘要翻译： 提供了一种改进的方法，用于通过由聚合物膜增强的焊料凸块互连将集成电路部件组装到衬底。 该部件通过在部件界面和基板区域之间产生间隙的多个焊料凸块互连而附着于基板的区域。 将聚合物坝施加到环绕与之间隔开的附接部件的区域。 将液体聚合物前体材料施加到包括间隙的区域，并被坝限制，以防止不加选择地流过基底。 在本发明的一个方面，气体通过衬底中的通道从间隙排出，以增强前体液体的填充。 在本发明的另一方面，前体液体通过基底中的通道注入到间隙中并从其向外扩散。 在任何情况下，前体液体渗透围绕焊料互连的间隙，并且被固化以形成加强和保护性地封装焊料互连的膜。
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2.发明授权Solder plate reflow method for forming a solder bump on a circuit trace intersection 失效用于在电路迹线交叉点形成焊料凸点的焊盘回流方法
公开(公告)号：US5160409A
公开(公告)日：1992-11-03
申请号：US740271
申请日：1991-08-05
CPC分类号： H05K3/3457 , H01L21/4853 , H05K1/111 , H05K3/3473 , H05K1/11 , H05K2201/09381 , H05K2203/042 , H05K2203/043 , H05K2203/0723 , H05K3/062 , Y02P70/611 , Y10T29/49121
摘要： A method for forming a solder-bumped circuit trace on a planar dielectric substrate includes fabricating a trace having an intersection between linear section, depositing onto the trace a uniform thin plate of solder alloy and reflowing the solder alloy to form a bump at the intersection. More particularly, the trace comprises first and second linear sections that intersect at an angle between 45 degrees and 135 degrees and have widths preferably between 50 and 150 microns. The solder plate is deposited, preferably by electroplating, at a thickness between about 10 and 25 microns. Thereafter, when the trace is heated to melt the solder layer, the solder coalesces at the intersection to form the bump.
摘要翻译： 在平面介质基板上形成焊料凸起的电路迹线的方法包括制造在线性部分之间具有交点的迹线，在迹线上沉积均匀的焊料合金薄板并回流焊料合金以在交叉点处形成凸块。 更具体地，迹线包括以45度和135度之间的角度相交并且具有优选地在50和150微米之间的宽度的第一和第二线性部分。 焊料板优选通过电镀沉积在约10至25微米之间的厚度。 此后，当加热痕迹以熔化焊料层时，焊料在相交处聚结形成凸块。
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公开(公告)号：US5194137A
公开(公告)日：1993-03-16
申请号：US740272
申请日：1991-08-05
CPC分类号： B23K1/0016 , H05K3/3473 , H05K1/11 , H05K2203/042 , H05K2203/043
摘要： A method for forming a solder-bumped terminal on a planar dielectric substrate utilizes a terminal of a particular configuration and comprises depositing onto the terminal a thin plate of solder alloy and reflowing the solder alloy to form a bump. The terminal configuration includes an enlarged terminal pad connected to a relatively narrow linear runner section. Preferably, the runner section width is between about 50 and 150 microns, whereas the pad width is between about 1.2 and 2.0 times the runner section width. The terminal is initially fabricated to include a metal layer adjacent the substrate formed, for example, of copper and a thin, outer plate composed of the solder alloy. The solder plate is deposited in a uniform thickness to both the terminal pad and the adjacent runner section. The terminal is then heated to melt the solder plate, whereupon the molten solder is drawn from the runner onto the enlarged pad to form a bump. In a preferred embodiment, a solder plate between about 10 and 25 microns is electrodeposited onto the terminal and reflowed to form a bump having a height between 60 and 80 microns.
摘要翻译： 在平面电介质基板上形成焊料凸起端子的方法利用特定结构的端子，并且包括在端子上沉积焊料合金薄板并回流焊料合金以形成凸块。 端子配置包括连接到相对窄的线性流道部分的放大的端子焊盘。 优选地，流道截面宽度在约50至150微米之间，而垫宽度在流道截面宽度的约1.2和2.0倍之间。 端子最初被制造成包括邻近由例如铜形成的衬底的金属层和由焊料合金组成的薄的外部板。 焊接板以均匀的厚度沉积到端子焊盘和相邻的流道部分。 然后将端子加热以熔化焊料板，然后将熔融的焊料从流道拉出到扩大的焊盘上以形成凸块。 在优选实施例中，约10至25微米之间的焊料电极电沉积到端子上并回流以形成高度在60至80微米之间的凸起。
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公开(公告)号：US5217597A
公开(公告)日：1993-06-08
申请号：US678418
申请日：1991-04-01
申请人： Kevin D. Moore , John W. Stafford , Mauro Walker
发明人： Kevin D. Moore , John W. Stafford , Mauro Walker
CPC分类号： H01L24/12 , H01L21/4853 , H01L24/11 , H05K3/3473 , H01L2224/11334 , H01L2224/13099 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H05K2201/10734 , H05K2203/0338 , H05K2203/043 , H05K2203/0726
摘要： A method for forming a plurality of solder bumps on an electronic component substrate utilizes a transfer plate to electrodeposit solder deposits and subsequently reflow the deposits onto the substrate. The plate comprises discrete pad electrodes formed of a ceramic material that is suitably electrically conductive to permit electroplating of the solder alloy, but is not wet by the molten solder to permit reflow onto the substrate. A preferred electrode material is an indium oxide compound. The solder deposits are plated onto the electrodes, and the transfer plate is superposed on the substrate such that the bumps rest upon bond pads on the substrate. The assembly is heated and cooled to melt and resolidify the solder alloy, whereupon the solder bonds to the substrate pads to form the bumps.
摘要翻译： 用于在电子元件基板上形成多个焊料凸块的方法利用转印板来电沉积焊料沉积物并随后将沉积物回流到基底上。 该板包括由陶瓷材料形成的分立焊盘电极，其适当地导电以允许电焊合金的电镀，但不被熔融焊料湿润以允许回流到衬底上。 优选的电极材料是氧化铟化合物。 将焊料沉积物电镀到电极上，并且将转印板叠置在基板上，使得凸块抵靠在基板上的接合焊盘上。 将组件加热并冷却以熔化并重新固化焊料合金，于是焊料与衬底焊盘接合以形成凸块。
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公开(公告)号：US5650640A
公开(公告)日：1997-07-22
申请号：US417360
申请日：1995-04-05
IPC分类号： H05B33/06 , H01L23/28 , H01L27/32 , H01L51/50 , H05B33/12 , H01L27/15 , H01L33/00 , H01L23/48
CPC分类号： H01L27/3288 , H01L51/5012 , H01L51/524 , H01L51/5243 , H01L51/5253 , H01L2224/48091 , H01L2224/48464 , H01L2924/12044 , H01L2924/15311
摘要： An integrated electro-optical package including an electronic circuit mounted on a substrate, first and second groups of leads extending from the circuit through a sealing area and each lead having an end exposed in a first area, transparent conductive strips positioned in the first area and each strip contacting the exposed end of a lead in the first group, an electroluminescent medium positioned on each of the strips and defining LEDs, metallic strips positioned over the electroluminescent medium as a second electrode for each of the LEDs, each metallic strip being in contact with an exposed end of an electrical lead in the second group of leads, and a hermetic seal positioned in sealing contact with the sealing area and hermetically sealing the first area.
摘要翻译： 一种集成电光学封装，包括安装在基板上的电子电路，从电路通过密封区域延伸的第一和第二组引线，每个引线具有暴露在第一区域中的端部，位于第一区域中的透明导电条带， 每个条带接触第一组中的引线的暴露端，定位在每个条上并定义LED的电致发光介质，位于电致发光介质上方的金属条作为每个LED的第二电极，每个金属条接触 在第二组引线中具有电引线的暴露端，以及与密封区域密封接触并密封第一区域的气密密封件。
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公开(公告)号：US4752109A
公开(公告)日：1988-06-21
申请号：US902997
申请日：1986-09-02
CPC分类号： G02B6/4248 , G02B6/4204 , G02B6/4225 , G02B6/4207 , G02B6/4238 , H01S5/02248 , H01S5/02272 , H01S5/02284 , H01S5/02415 , Y10S257/93
摘要： An optoelectronics package 1 comprising, an optical bench 12 along which is defined an optical axis 43, a semiconductor laser 21 along the optical axis 43, a lens 27 focused on the laser 21 and transmitting optical emission from the laser 21 along the optical axis 43, an optical fiber 45 having an optical face 48 aligned with the optical axis 43, and the fiber 45 is secured to the optical bench 12 with a column load applied on the fiber 45.
摘要翻译： 一种光电子封装1，包括：光学台座12，沿光轴43限定光学台座12;沿着光轴43的半导体激光器21;聚焦在激光器21上的透镜27，并沿着光轴43透射来自激光器21的光发射 ，具有与光轴43对准的光学面48的光纤45和光纤45以施加在光纤45上的列负载固定到光学台架12。
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公开(公告)号：US5905750A
公开(公告)日：1999-05-18
申请号：US731424
申请日：1996-10-15
申请人： Michael S. Lebby , Wenbin Jiang , John W. Stafford
发明人： Michael S. Lebby , Wenbin Jiang , John W. Stafford
CPC分类号： H01S5/02296 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L24/73 , H01L2924/181 , H01S5/02228 , H01S5/02244 , H01S5/02276 , H01S5/0683 , H01S5/183
摘要： A semiconductor laser package including a laser chip mounted to an uppermost surface of a leadframe, and a molded structure at least partially encapsulating the laser chip. The laser chip composed of a vertical cavity surface emitting laser and an optional photodetector. The vertical cavity surface emitting laser generating an emission along a path. The molded structure including an optical element positioned a specific distance from an emission aperture of the vertical cavity surface emitting laser. The laser chip and the optical element mounted in precise z-axis alignment from the emission aperture of the vertical cavity surface emitting laser utilizing the uppermost surface of the leadframe as a dimensional reference point.
摘要翻译： 一种半导体激光器封装，包括安装在引线框架的最上表面的激光芯片，以及至少部分地封装激光芯片的模制结构。 激光芯片由垂直腔表面发射激光器和可选的光电检测器组成。 垂直腔表面发射激光器沿着路径产生发射。 模制结构包括位于与垂直腔表面发射激光器的发射孔相距特定距离的光学元件。 激光芯片和光学元件以垂直腔表面发射激光器的发射孔径以准确的z轴对准安装，利用引线框架的最上表面作为尺寸参考点。
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公开(公告)号：US5689279A
公开(公告)日：1997-11-18
申请号：US415286
申请日：1995-04-03
申请人： Ronald J. Nelson , John W. Stafford
发明人： Ronald J. Nelson , John W. Stafford
CPC分类号： G09F9/33 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/09701
摘要： An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the chip. A window frame substrate having a central opening therethrough coextensive with the real image generated by the chip and mounting pads, bump bonded to the pads on the chip. A plurality of driver circuits connected to the light emitting devices through terminals on the window frame substrate. A lens mounted to the substrate over the opening and on a side opposite the chip to magnify the real image and produce an easily viewable virtual image.
摘要翻译： 一种集成的电光学封装，包括形成有大量发光器件阵列的半导体芯片，并配合以产生完整的真实图像。 发光器件被定位成行和列并且连接到与芯片的外边缘相邻的焊盘。 一种窗框基板，其具有与由芯片和安装焊盘产生的实像共同延伸的中心开口，凸块接合到芯片上的焊盘。 多个驱动电路通过窗框基板上的端子连接到发光器件。 透镜在开口上和与芯片相对的一侧安装到基板，以放大实际图像并产生容易观看的虚像。
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公开(公告)号：US4762395A
公开(公告)日：1988-08-09
申请号：US150481
申请日：1988-01-29
IPC分类号： G02B7/02
CPC分类号： G02B7/026
摘要： A lens assembly 26 includes, a lens 27, an optical diaphragm 29 as a convex curved leaf spring, a pedestal 30 spacing the diaphragm 29 from the lens 27, and a holder for mounting the lens assembly 26 in desired position.
摘要翻译： 透镜组件26包括透镜27，作为凸弯曲板簧的光学膜29，将隔膜29与透镜27间隔开的基座30和用于将透镜组件26安装在期望位置的保持器。
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公开(公告)号：US07125176B1
公开(公告)日：2006-10-24
申请号：US10674374
申请日：2003-09-30
申请人： John W. Stafford , George G. Grouch , Irka Zazulak
发明人： John W. Stafford , George G. Grouch , Irka Zazulak
CPC分类号： G02B6/4246 , G02B6/4214 , G02B6/423 , H05K1/0274 , H05K1/056 , H05K3/4641 , H05K2201/068 , H05K2201/09745
摘要： High speed high data interconnect apparatus includes a stiffening plate with optical fiber mounting groove defined on a surface thereof. The apparatus further includes a length of optical fiber mounted in the groove on the surface of the stiffening plate in a longitudinally extending direction generally parallel to the surface of the stiffening plate. A reflecting surface is positioned adjacent one, or both, of the opposed ends of the optical fiber to direct light at an angle of approximately ninety degrees to the optical path. A printed circuit board laminate is used to encase the stiffening plate and the optical fiber and includes a light via for the passage of light reflected by the reflecting surface. Bond pads are formed on a surface of the printed circuit board laminate adjacent the light via for the electrical connection of a light element, e.g. a VCSEL or photodiode, in communication with the light via.
摘要翻译： 高速高数据互连装置包括在其表面上限定有光纤安装槽的加强板。 该装置还包括一段长度的光纤，其沿纵向延伸的方向安装在加强板的表面上的凹槽中，该方向大致平行于加强板的表面。 反射表面邻近光纤的相对端的一个或两个定位，以将光以与光路近似九十度的角度引导。 印刷电路板层叠体用于包围加强板和光纤，并且包括用于使由反射表面反射的光通过的光通孔。 接合焊盘形成在邻近光通孔的印刷电路板层压体的表面上，用于光元件的电连接，例如， 与光通孔连通的VCSEL或光电二极管。
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