公开(公告)号：US20070252249A1

公开(公告)日：2007-11-01

申请号：US11740669

申请日：2007-04-26

申请人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

发明人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

IPC分类号： H01L23/495

CPC分类号： H05K3/243 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/49171 ,  H01L2224/81801 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/284 ,  H05K3/3452 ,  H05K3/382 ,  H05K2201/0989 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49222 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.

摘要翻译： 密封树脂层在焊盘电极部分的剥离的可能性降低，从而提高了电路设备的可靠性。 电路装置包括布线层，镀金层，绝缘树脂层，电路元件，导电构件和密封树脂层。 金电镀层形成在焊盘电极的布线层区域中。 该地区外面的表面粗糙。 绝缘树脂层形成为覆盖布线层，并且在形成焊盘电极的区域中具有开口。 电路元件安装在绝缘树脂层上的预定区域上。 密封树脂层形成在绝缘树脂层上，以完全覆盖电路元件和焊盘电极的开口。 用于焊盘电极的区域中的密封树脂层与镀金层和布线层接触。

公开(公告)号：US07612445B2

公开(公告)日：2009-11-03

申请号：US11740669

申请日：2007-04-26

申请人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

发明人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

IPC分类号： H01L23/48 ,  H01L23/06 ,  H01R43/00

CPC分类号： H05K3/243 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/49171 ,  H01L2224/81801 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/284 ,  H05K3/3452 ,  H05K3/382 ,  H05K2201/0989 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49222 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.

摘要翻译： 密封树脂层在焊盘电极部分的剥离的可能性降低，从而提高了电路设备的可靠性。 电路装置包括布线层，镀金层，绝缘树脂层，电路元件，导电构件和密封树脂层。 金电镀层形成在焊盘电极的布线层区域中。 该地区外面的表面粗糙。 绝缘树脂层形成为覆盖布线层，并且在形成焊盘电极的区域中具有开口。 电路元件安装在绝缘树脂层上的预定区域上。 密封树脂层形成在绝缘树脂层上，以完全覆盖电路元件和焊盘电极的开口。 用于焊盘电极的区域中的密封树脂层与镀金层和布线层接触。

公开(公告)号：US08656581B2

公开(公告)日：2014-02-25

申请号：US12563849

申请日：2009-09-21

申请人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

发明人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

IPC分类号： H05K3/36

CPC分类号： H05K3/243 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/49171 ,  H01L2224/81801 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/284 ,  H05K3/3452 ,  H05K3/382 ,  H05K2201/0989 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49222 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating a circuit apparatus includes forming a wiring layer, a conductive layer, and a first insulating layer on the wiring substrate, removing the conductive layer in an opening of the first insulating layer so as to expose the wiring layer, forming a gold plating layer on the wiring layer, removing the first insulating layer and the conductive layer, forming a second insulating layer on the wiring substrate, the second insulating layer having an opening through which the gold plating and adjacent wiring layers are exposed, and electrically connecting a circuit element to the gold plating layer.

摘要翻译： 一种制造电路装置的方法，包括在布线基板上形成布线层，导电层和第一绝缘层，去除第一绝缘层的开口中的导电层，以露出布线层，形成金 在所述布线层上除去所述第一绝缘层和所述导电层，在所述布线基板上形成第二绝缘层，所述第二绝缘层具有开金属镀层和相邻配线层露出的开口， 电路元件到镀金层。

公开(公告)号：US20070164766A1

公开(公告)日：2007-07-19

申请号：US11526875

申请日：2006-09-26

申请人： Makoto Murai ,  Ryosuke Usui ,  Yasuhiro Kohara

发明人： Makoto Murai ,  Ryosuke Usui ,  Yasuhiro Kohara

IPC分类号： G01R31/02

CPC分类号： H05K1/0206 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/19105 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/0061 ,  H05K3/383 ,  H05K3/385 ,  H05K3/4652 ,  H05K2201/068 ,  H05K2201/09054 ,  H05K2201/2072 ,  H05K2203/0315 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit device having superior mechanical strength at the interface between a circuit board and heat sink and superior efficiency for radiating heat from a circuit element to the heat sink through the circuit board. The circuit device includes the metal-based insulation board for installing the circuit element, and the heat sink, over which the insulation board is installed with a paste arranged therebetween. The insulation board has a projection arranged on the surface facing the heat sink along a peripheral portion. At least part of the projection contacts the heat sink through the paste layer.

摘要翻译： 电路装置在电路板和散热器之间的界面处具有优良的机械强度，并且具有优异的效率，用于通过电路板从电路元件散热至散热片。 电路装置包括用于安装电路元件的金属基绝缘板和安装有绝缘板的绝热板的散热器。 绝缘板具有沿着周边部分布置在面向散热器的表面上的突起。 突起的至少一部分通过膏层与散热片接触。

公开(公告)号：US07649739B2

公开(公告)日：2010-01-19

申请号：US11526875

申请日：2006-09-26

申请人： Makoto Murai ,  Ryosuke Usui ,  Yasuhiro Kohara

发明人： Makoto Murai ,  Ryosuke Usui ,  Yasuhiro Kohara

IPC分类号： H05K5/00

CPC分类号： H05K1/0206 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/19105 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/0061 ,  H05K3/383 ,  H05K3/385 ,  H05K3/4652 ,  H05K2201/068 ,  H05K2201/09054 ,  H05K2201/2072 ,  H05K2203/0315 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A circuit device having superior mechanical strength at the interface between a circuit board and heat sink and superior efficiency for radiating heat from a circuit element to the heat sink through the circuit board. The circuit device includes the metal-based insulation board for installing the circuit element, and the heat sink, over which the insulation board is installed with a paste arranged therebetween. The insulation board has a projection arranged on the surface facing the heat sink along a peripheral portion. At least part of the projection contacts the heat sink through the paste layer.

摘要翻译： 电路装置在电路板和散热器之间的界面处具有优良的机械强度，并且具有优异的效率，用于通过电路板从电路元件散热至散热片。 电路装置包括用于安装电路元件的金属基绝缘板和安装有绝缘板的绝热板的散热器。 绝缘板具有沿着周边部分布置在面向散热器的表面上的突起。 突起的至少一部分通过膏层与散热片接触。

公开(公告)号：US20100005653A1

公开(公告)日：2010-01-14

申请号：US12563849

申请日：2009-09-21

申请人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

发明人： Makoto Murai ,  Yasuhiro Kohara ,  Ryosuke Usui

IPC分类号： H05K3/10

CPC分类号： H05K3/243 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/49171 ,  H01L2224/81801 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/284 ,  H05K3/3452 ,  H05K3/382 ,  H05K2201/0989 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49222 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a gold plating layer, an insulating resin layer, a circuit element, a conductive member and sealing resin layer. The gold plating layer is formed in an wiring layer area for the pad electrode. The surface outside the area is roughened. The insulating resin layer is formed so as to cover the wiring layer and to have an opening in an area in which the pad electrode is formed. The circuit element is mounted on a predetermined area on the insulating resin layer. The sealing resin layer is formed on the insulating resin layer so as to entirely cover the circuit element and the opening for the pad electrode. The sealing resin layer, in the area for the pad electrode, is in contact with the gold plating layer and the wiring layer.

摘要翻译： 密封树脂层在焊盘电极部分的剥离的可能性降低，从而提高了电路设备的可靠性。 电路装置包括布线层，镀金层，绝缘树脂层，电路元件，导电构件和密封树脂层。 金电镀层形成在焊盘电极的布线层区域中。 该地区外面的表面粗糙。 绝缘树脂层形成为覆盖布线层，并且在形成焊盘电极的区域中具有开口。 电路元件安装在绝缘树脂层上的预定区域上。 密封树脂层形成在绝缘树脂层上，以完全覆盖电路元件和焊盘电极的开口。 用于焊盘电极的区域中的密封树脂层与镀金层和布线层接触。

公开(公告)号：US20120098137A1

公开(公告)日：2012-04-26

申请号：US13381299

申请日：2010-06-30

申请人： Ryosuke Usui ,  Yusuke Igarashi ,  Yasunori Inoue ,  Mayumi Nakasato ,  Masayuki Nagamatsu ,  Yasuhiro Kohara

发明人： Ryosuke Usui ,  Yusuke Igarashi ,  Yasunori Inoue ,  Mayumi Nakasato ,  Masayuki Nagamatsu ,  Yasuhiro Kohara

IPC分类号： H01L29/43 ,  H01L23/48 ,  H05K7/20

CPC分类号： H05K3/445 ,  H01L23/3735 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H05K1/05 ,  H05K1/053 ,  H05K1/056 ,  H05K1/185 ,  H05K2201/0195 ,  H05K2201/068 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics.

摘要翻译： 传统的印刷电路板具有热辐射特性差的问题，并且用于改善热辐射特性的金属芯印刷电路板具有刚性低和弯曲倾向的问题。 金属的延展性可能受到阻碍，金属受到保护; 通过覆盖由金属作为主要材料构成的金属芯的正面和背面的大部分整个面积与第一陶瓷膜和阻碍上述金属芯的延展性的第二陶瓷膜; 并用绝缘树脂膜覆盖每个陶瓷膜，以覆盖这些陶瓷的脆性。

公开(公告)号：US07737368B2

公开(公告)日：2010-06-15

申请号：US11536317

申请日：2006-09-28

申请人： Yasuhiro Kohara ,  Ryosuke Usui ,  Noriaki Kojima

发明人： Yasuhiro Kohara ,  Ryosuke Usui ,  Noriaki Kojima

IPC分类号： H05K1/11

CPC分类号： H05K3/42 ,  H05K1/0366 ,  H05K3/002 ,  H05K3/0055 ,  H05K3/4602 ,  H05K2201/029 ,  H05K2201/0959 ,  Y10S428/901 ,  Y10T428/24917

摘要： A circuit board includes: a plurality of wiring layers; an insulating layer which insulates the plurality of wiring layers, the insulating layer containing a fibrous filler and a resin; and a conductor part formed on a sidewall of a via piercing through the insulating layer. The fibrous filler protrudes from the sidewall and is covered with the conductor part, with a length greater than the thickness of the conductor layer.

摘要翻译： 电路板包括：多个布线层; 绝缘层，其使所述多个布线层绝缘，所述绝缘层包含纤维填料和树脂; 以及形成在穿过绝缘层的通孔的侧壁上的导体部分。 纤维填料从侧壁突出并被导体部分覆盖，其长度大于导体层的厚度。

公开(公告)号：US20080236879A1

公开(公告)日：2008-10-02

申请号：US12058040

申请日：2008-03-28

申请人： Yasuhiro Kohara ,  Kiyoshi Shibata ,  Masayuki Nagamatsu ,  Ryosuke Usui ,  Toshiya Shimizu

发明人： Yasuhiro Kohara ,  Kiyoshi Shibata ,  Masayuki Nagamatsu ,  Ryosuke Usui ,  Toshiya Shimizu

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K3/383 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/564 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/056 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/09727 ,  H05K2201/09772 ,  H05K2201/0989 ,  H05K2203/0307 ,  H05K2203/0361 ,  H05K2203/049 ,  H05K2203/0542 ,  H05K2203/0723 ,  H05K2203/1152 ,  H05K2203/1476 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.

摘要翻译： 提供了一种具有增强的抗湿性的电路板和制造该电路板的方法，以及电路装置和该电路装置的制造方法。 本发明的电路板包括：基板; 在基板的主表面上形成的布线; 覆盖除了作为连接器的区域的布线的覆盖层; 形成在基板的底面上的背面电极; 以及形成为穿透基板的通孔电极，从而连接布线和背面电极。 在该电路基板的各配线的表面上，基板周边的凸部的宽度比基板的中央部的凸部的宽度大。 利用这种结构，可以提高热循环负载下的布线与覆盖层之间的粘附可靠性。

公开(公告)号：US20080061437A1

公开(公告)日：2008-03-13

申请号：US11847933

申请日：2007-08-30

申请人： Yasuhiro Kohara ,  Ryosuke Usui ,  Takeshi Nakamura ,  Yusuke Igarashi

发明人： Yasuhiro Kohara ,  Ryosuke Usui ,  Takeshi Nakamura ,  Yusuke Igarashi

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A technology is provided for a packaging board adapted to mount a device capable of improving handleability and securing connection reliability. The packaging board includes: a pad electrode formed on a substrate; an insulating layer covering the substrate, having an opening at least in part in an area over the pad electrode; and a joint layer formed on the pad electrode inside the opening. The surface of the joint layer is lower than the top lip of the opening.

摘要翻译： 提供了一种用于适于安装能够改善可操作性并确保连接可靠性的装置的包装板的技术。 包装板包括：形成在基板上的焊盘电极; 覆盖所述基板的绝缘层，至少部分地具有在所述焊盘电极上的区域中的开口; 以及形成在开口内的焊盘电极上的接合层。 接合层的表面低于开口的上唇。