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    Position detector and mount therefor for a centrifugal analyzer
    1.
    发明授权
    Position detector and mount therefor for a centrifugal analyzer 失效
    位置检测器，并安装在离心分析仪上

    公开(公告)号：US4695164A

    公开(公告)日：1987-09-22

    申请号：US779520

    申请日：1985-09-24

    申请人： Maury Zivitz ,  Eric Ko ,  Mark Eslick

    发明人： Maury Zivitz ,  Eric Ko ,  Mark Eslick

    IPC分类号： B04B5/02 ,  G01D5/347 ,  G01N21/01 ,  G01N21/07 ,  G01N21/90 ,  G01N1/10

    CPC分类号： G01D5/347 ,  G01N21/07

    摘要： A relative position detector has a photodetector arrangement for providing light and responding to the intensity of the light when reflected thereto. A member such as a cylindrical pin having a surface reflective of the light, convex to the photodetector arrangement, and movable relative thereto reflectively sweeps the light across the photodetector arrangement for responding thereto to produce a continuously-curving response indicating with its peak the position detected. The continuously-curving response can be differentiated in a peak detector for even more precise position detection. A mount which may be used for the photodetector arrangement has a support member and a member having a lower coefficient of thermal expansion slidably supported thereon, except for one fixed point.

    摘要翻译： 相对位置检测器具有用于提供光并响应于其反射时的光的强度的光电检测器装置。 具有反射光的表面的诸如圆柱形销的构件，对于光电检测器装置凸起并且可相对于其反射地反射地扫过光束以穿过光电检测器布置以对其进行响应以产生连续弯曲的响应，其指示其峰值检测到位置 。 可以在峰值检测器中区分连续弯曲的响应以进行更精确的位置检测。 可以用于光电检测器装置的安装件具有支撑构件和除了一个固定点之外可滑动地支撑在其上的具有较低热膨胀系数的构件。

    Multi-chip integrated circuit package structure for central pad chip
    3.
    发明授权
    Multi-chip integrated circuit package structure for central pad chip 有权
    多芯片集成电路封装结构，用于中心焊盘芯片

    公开(公告)号：US06265763B1

    公开(公告)日：2001-07-24

    申请号：US09524944

    申请日：2000-03-14

    申请人： Jui-Meng Jao ,  Eric Ko ,  Vicky Liu

    发明人： Jui-Meng Jao ,  Eric Ko ,  Vicky Liu

    IPC分类号： H01L23495

    CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4911 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A multi-chip IC package for central pad chips is proposed, which can be used to pack one peripheral-pad IC chip and at least one central-pad IC chip therein. The multi-chip IC package includes a specially-designed lead frame having a central die pad and a lead portion separated from the central die pad by a gap. The central-pad IC chip is partly attached to the lead portion of the lead frame and partly attached to the central die pad of the lead frame such that the central pads on the central-pad IC chip can be aligned with the gap of lead frame so as to allow bonding wires electrically connecting the central-pad IC chip with the lead portion of the lead frame to pass therethrough. The characterized package allows the bonding wires applied to the central-pad IC chip to be short in length so as to retain IC performance and save manufacture cost, making this multi-chip IC package structure more advantageous to use than the prior art.

    摘要翻译： 提出了一种用于中心焊盘芯片的多芯片IC封装，其可用于在其中封装一个外围焊盘IC芯片和至少一个中心焊盘IC芯片。 多芯片IC封装包括一个特别设计的引线框架，其具有中央管芯焊盘和引线部分，该引线部分通过间隙与中心管芯焊盘分离。 中心焊盘IC芯片部分地附接到引线框架的引线部分并且部分地附接到引线框架的中心管芯焊盘，使得中心焊盘IC芯片上的中心焊盘可以与引线框架的间隙对准 以使得将中心焊盘IC芯片与引线框架的引线部分电连接的接合线通过。 特征在于的封装允许施加到中心焊盘IC芯片的接合线的长度短，从而保持IC性能并节省制造成本，使得该多芯片IC封装结构比现有技术更有利。

    Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same
    4.
    发明授权
    Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same 失效
    球栅阵列集成电路封装具有嵌入式散热结构及其制造方法

    公开(公告)号：US06282094B1

    公开(公告)日：2001-08-28

    申请号：US09545996

    申请日：2000-04-10

    申请人： Randy H. Y. Lo ,  Jeng Yuan Lai ,  Eric Ko ,  Tzong-Da Ho

    发明人： Randy H. Y. Lo ,  Jeng Yuan Lai ,  Eric Ko ,  Tzong-Da Ho

    IPC分类号： H05K720

    CPC分类号： H01L23/3677 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/49149 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

    摘要： A BGA (Ball-Grid Array) IC package with an unembedded type of heat-dissipation structure is proposed. The unembedded type of heat-dissipation structure is characterized in that a plurality of thermally-conductive vias are formed in the substrate and extending from the die-attachment area to the back side of the substrate; and further, a plurality of thermally-conductive balls are bonded to the thermally-conductive vias on the back side of the substrate. Moreover, a thermally-conductive layer is formed over a thermally-conductive area on the back side of the substrate on which the thermally-conductive balls are mounted for the purpose of increasing the exposed area of the overall heat-dissipation structure to the atmosphere. This allows the IC-produced heat during operation to be conducted through the thermally-conductive vias, the thermally-conductive balls, and the thermally-conductive layer to be dissipated the atmosphere. The unembedded manner of integration requires no openings to be formed in the substrate that would otherwise allow ambient moisture to enter into the inside of the package body as in the case of the prior art, and also allows the heat-dissipation structure to be more easily integrated to the package configuration. Due to these benefits, the BGA IC package can be manufactured through a more simplified and cost-effective process, while nevertheless providing a high heat-dissipation efficiency.

    摘要翻译： 提出了一种具有非嵌入式散​​热结构的BGA（球栅阵列）IC封装。 未嵌入式的散热结构的特征在于，在基板中形成多个导热通孔，并且从管芯附着区域延伸到基板的背面; 此外，多个导热球接合到基板的背面上的导热通孔。 此外，为了增加整个散热结构对大气的暴露面积，在其上安装有导热球的基板的背面上的导热区域上形成导热层。 这允许在操作期间产生的IC产生的热量通过导热通孔，导热球和导热层传导以消散大气。 未嵌入的集成方式不需要在基板中形成开口，否则将使现有技术的情况下环境湿气进入包装体的内部，并且还允许散热结构更容易 集成到包配置。 由于这些优点，BGA IC封装可以通过更简化和成本有效的工艺制造，同时仍然提供高散热效率。

    Universal lead frame type of quad flat non-lead package of semiconductor
    5.
    发明授权
    Universal lead frame type of quad flat non-lead package of semiconductor 有权
    通用引线框架型四边形非导线封装半导体

    公开(公告)号：US06246111B1

    公开(公告)日：2001-06-12

    申请号：US09490726

    申请日：2000-01-25

    申请人： Chien-Ping Huang ,  Eric Ko

    发明人： Chien-Ping Huang ,  Eric Ko

    IPC分类号： H01L23495

    CPC分类号： H01L24/49 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/4334 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49112 ,  H01L2224/49171 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： An universal lead frame type of Quad Flat Non-Lead package of semiconductor comprises a chip, a plurality of leads, a heat sink, and a molding compound. The leads are disposed at the periphery of the chip. The chip has its back surface bonded to the top surface of the heat sink, and the periphery of the top surface of the heat sink has a plurality of projections. The bonding portion at the periphery on the bottom surface of the heat sink is bonded to the top surface of the leads. The protruded portion at the center of the bottom surface of the heat sink is disposed in the opening region such that the bottom surface of the heat sink and the bottom surface of the leads are coplaner. The bonding pads of the chip are electrically connected to the top surface of the leads by a plurality of bonding wires. The molding compound encapsulates the chip, the heat sink, the top surface of the leads, and the bonding wires while exposes the protruded portion of the heat sink.

    摘要翻译： 四通道非导体半导体封装的通用引线框架包括芯片，多个引线，散热器和模制化合物。 引线设置在芯片的外围。 芯片的后表面与散热器的顶面接合，散热片顶面的周边具有多个突起。 散热器底面周边的接合部分接合到引线的顶表面。 在散热器的底面的中心的突出部分设置在开口区域中，使得散热器的底表面和引线的底表面平行。 芯片的接合焊盘通过多个接合线电连接到引线的顶表面。 模制化合物封装芯片，散热器，引线的顶表面和接合线，同时暴露散热器的突出部分。

    Thermally enhanced quad flat non-lead package of semiconductor
    9.
    发明授权
    Thermally enhanced quad flat non-lead package of semiconductor 有权
    半导体热增强型四方扁平非引线封装

    公开(公告)号：US06198171B1

    公开(公告)日：2001-03-06

    申请号：US09475003

    申请日：1999-12-30

    申请人： Chien-Ping Huang ,  Eric Ko

    发明人： Chien-Ping Huang ,  Eric Ko

    IPC分类号： H01L2348

    CPC分类号： H01L23/4951 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/06135 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/05599

    摘要： A thermally enhanced quad flat non-lead package of semiconductor comprises a chip a plurality of leads, and a molding compound. The chip has its active surface bonded to the top surface of the die pad, and the area of the die pad is smaller than that of the chip in order to expose the bonding pads on the active surface of the chip. The leads are disposed at the periphery of the die pad wherein the bottom surface of the lead has a stepped structure with a relatively thin portion to form a wire-bonding protruded zone. A plurality of bonding wires is used to electrically connect the wire-bonding protruded zone of the leads to the bonding pads of the chip. The molding compound encapsulates the chip, bonding wires, the die pad, and a portion of the surface of the leads, but exposes the bottom surface of the die pad. In this way, the encapsulating process makes the side surface of the lead, and the portion excluding the wire-bonding protruded zone of the bottom surface of the lead exposed in order to make the lead become the external connecting points of the package structure.

    摘要翻译： 热增强型四边形半导体封装包括多个引线的芯片和模制化合物。 该芯片具有与芯片焊盘的顶表面结合的活性表面，并且芯片焊盘的面积小于芯片的面积，以露出芯片的有源表面上的焊盘。 引线设置在芯片焊盘的周边处，其中引线的底表面具有相对薄的部分的阶梯状结构，以形成引线接合突出区域。 使用多个接合线将导线的引线接合突出区域电连接到芯片的接合焊盘。 模塑料封装芯片，接合线，芯片焊盘和引线表面的一部分，但是露出芯片焊盘的底表面。 以这种方式，封装工艺使引线的侧表面，并且除了引线的底表面的引线接合突出区域之外的部分暴露以使引线变成封装结构的外部连接点。