公开(公告)号：US20150061095A1

公开(公告)日：2015-03-05

申请号：US14468361

申请日：2014-08-26

申请人： Mi-Na Choi ,  Seran Bae ,  Yunhyeok Im

发明人： Mi-Na Choi ,  Seran Bae ,  Yunhyeok Im

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L25/16 ,  H01L23/367

CPC分类号： H01L25/105 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/211 ,  H01L2224/28105 ,  H01L2224/29006 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2225/06506 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a package-on-package (PoP) device according to the inventive concepts, an anisotropic conductive film is disposed between a lower semiconductor package and an upper semiconductor package to remove an air gap between the lower and upper semiconductor packages. Thus, heat generated from a lower semiconductor chip may be rapidly and smoothly transmitted toward the upper semiconductor package, thereby increasing or maximizing a heat exhaust effect of the PoP device.

摘要翻译： 在根据本发明构思的封装封装（PoP）器件中，各向异性导电膜设置在下半导体封装和上半导体封装之间以去除下半导体封装和上半导体封装之间的气隙。 因此，从下半导体芯片产生的热可以快速平稳地向上半导体封装传输，从而增加或最大化PoP器件的排热效果。

公开(公告)号：US09324696B2

公开(公告)日：2016-04-26

申请号：US14468361

申请日：2014-08-26

申请人： Mi-Na Choi ,  Seran Bae ,  Yunhyeok Im

发明人： Mi-Na Choi ,  Seran Bae ,  Yunhyeok Im

IPC分类号： H01L25/10 ,  H01L23/36 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L23/552 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L25/105 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/211 ,  H01L2224/28105 ,  H01L2224/29006 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2225/06506 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a package-on-package (PoP) device according to the inventive concepts, an anisotropic conductive film is disposed between a lower semiconductor package and an upper semiconductor package to remove an air gap between the lower and upper semiconductor packages. Thus, heat generated from a lower semiconductor chip may be rapidly and smoothly transmitted toward the upper semiconductor package, thereby increasing or maximizing a heat exhaust effect of the PoP device.

摘要翻译： 在根据本发明构思的封装封装（PoP）器件中，各向异性导电膜设置在下半导体封装和上半导体封装之间以去除下半导体封装和上半导体封装之间的气隙。 因此，从下半导体芯片产生的热可以快速平稳地向上半导体封装传输，从而增加或最大化PoP器件的排热效果。

公开(公告)号：US08692349B2

公开(公告)日：2014-04-08

申请号：US13240574

申请日：2011-09-22

申请人： Jae Choon Kim ,  Eunseok Cho ,  Mi-Na Choi ,  Kyoungsei Choi ,  Heejung Hwang ,  Seran Bae

发明人： Jae Choon Kim ,  Eunseok Cho ,  Mi-Na Choi ,  Kyoungsei Choi ,  Heejung Hwang ,  Seran Bae

IPC分类号： H01L31/058

CPC分类号： G05F1/463 ,  H01L23/34 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L25/16 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00

摘要： An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.

摘要翻译： 示例性实施例涉及一种包括半导体封装的半导体器件，其中半导体芯片安装在封装衬底上。 半导体封装可以包括温度测量装置和温度控制电路。 温度测量装置可以测量半导体封装的温度。 温度控制电路可以基于由温度测量装置测量的半导体封装的温度来改变半导体封装的操作速度。

公开(公告)号：US20120133427A1

公开(公告)日：2012-05-31

申请号：US13240574

申请日：2011-09-22

申请人： Jae Choon Kim ,  Eunseok Cho ,  Mi-Na Choi ,  Kyoungsei Choi ,  Heejung Hwang ,  Seran Bae

发明人： Jae Choon Kim ,  Eunseok Cho ,  Mi-Na Choi ,  Kyoungsei Choi ,  Heejung Hwang ,  Seran Bae

IPC分类号： H01L27/00

CPC分类号： G05F1/463 ,  H01L23/34 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49822 ,  H01L25/16 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00

摘要： An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.

摘要翻译： 示例性实施例涉及一种包括半导体封装的半导体器件，其中半导体芯片安装在封装衬底上。 半导体封装可以包括温度测量装置和温度控制电路。 温度测量装置可以测量半导体封装的温度。 温度控制电路可以基于由温度测量装置测量的半导体封装的温度来改变半导体封装的操作速度。

公开(公告)号：US20130135823A1

公开(公告)日：2013-05-30

申请号：US13597628

申请日：2012-08-29

申请人： Ji-Chul Kim ,  Jin-Kwon Bae ,  Mi-Na Choi ,  Hee-Jung Hwang

发明人： Ji-Chul Kim ,  Jin-Kwon Bae ,  Mi-Na Choi ,  Hee-Jung Hwang

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  G06F1/203 ,  H01L23/043 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/1816 ,  H05K7/20136 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.

摘要翻译： 可与移动设备一起使用的半导体封装包括其中包括导电布线的电路板及其后表面上的接触端子，集成电路芯片，其位于电路板的前表面上并电连接到导电布线， 至少一个开口，并且覆盖集成电路芯片，使得在集成电路芯片周围设置流动空间，并且开口与流动空间连通;以及空气流发生器，其定位在盖上以产生通过流动的强制空气流 空间和开口，从而通过强制气流从集成电路芯片散发出半导体封装的热量。

公开(公告)号：US20110316144A1

公开(公告)日：2011-12-29

申请号：US13158486

申请日：2011-06-13

申请人： Jae-Wook Yoo ,  Kyoung-Sei Choi ,  Eun-Seok Cho ,  Mi-Na Choi ,  Hee-Jung Hwang ,  Se-Ran Bae

发明人： Jae-Wook Yoo ,  Kyoung-Sei Choi ,  Eun-Seok Cho ,  Mi-Na Choi ,  Hee-Jung Hwang ,  Se-Ran Bae

IPC分类号： H01L23/373 ,  F28F7/00

CPC分类号： H01L23/36 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A heat sink includes a first adhesive layer, and a heat dissipation layer disposed on the first adhesive layer, and has ventilation ports that extend therethrough including through the first adhesive layer and the heat dissipation layer. The heat sink forms an outermost part of a semiconductor package. Thus, when the heat sink is bonded via its adhesive layer to underlying structure during a manufacturing process, the ventilation ports allow air to pass therethrough. As a result, air is not trapped in the form of bubbles between the heat sink and the underlying structure.

摘要翻译： 散热器包括第一粘合剂层和布置在第一粘合剂层上的散热层，并且具有通过第一粘合层和散热层延伸穿过的通气口。 散热器形成半导体封装的最外部分。 因此，当在制造过程中散热器经由其粘合剂层粘合到下面的结构时，通风口允许空气通过。 因此，空气不会以散热器和底层结构之间的气泡的形式被捕获。

公开(公告)号：US20110304763A1

公开(公告)日：2011-12-15

申请号：US13095155

申请日：2011-04-27

申请人： Mi-Na Choi ,  Kyoung-Sei Choi ,  Hee-Seok Lee ,  Yong-Hoon Kim ,  Hee-Jung Hwang ,  Se-Ran Bae

发明人： Mi-Na Choi ,  Kyoung-Sei Choi ,  Hee-Seok Lee ,  Yong-Hoon Kim ,  Hee-Jung Hwang ,  Se-Ran Bae

IPC分类号： H04N5/225 ,  H01L31/0216

CPC分类号： H04N5/2253

摘要： An image sensor chip, a camera module, and devices incorporating the image sensor chip and camera module include a light receiving unit on which light is incident, a logic unit provided to surround the light receiving unit, and an electromagnetic wave shielding layer formed on the logic unit and not formed on the light receiving unit.

摘要翻译： 图像传感器芯片，相机模块以及包含图像传感器芯片和相机模块的装置包括光入射的光接收单元，围绕光接收单元的逻辑单元和形成在该光接收单元上的电磁波屏蔽层 逻辑单元，并且不形成在光接收单元上。

公开(公告)号：US08994169B2

公开(公告)日：2015-03-31

申请号：US13597628

申请日：2012-08-29

申请人： Ji-Chul Kim ,  Jin-Kwon Bae ,  Mi-Na Choi ,  Hee-Jung Hwang

发明人： Ji-Chul Kim ,  Jin-Kwon Bae ,  Mi-Na Choi ,  Hee-Jung Hwang

IPC分类号： H01L23/34 ,  H01L23/467 ,  H05K7/20 ,  F28F7/00

CPC分类号： H01L23/467 ,  G06F1/203 ,  H01L23/043 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/1816 ,  H05K7/20136 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.

摘要翻译： 可与移动设备一起使用的半导体封装包括其中包括导电布线的电路板及其后表面上的接触端子，集成电路芯片，其位于电路板的前表面上并电连接到导电布线， 至少一个开口，并且覆盖集成电路芯片，使得在集成电路芯片周围设置流动空间，并且开口与流动空间连通;以及空气流发生器，其定位在盖上以产生通过流动的强制空气流 空间和开口，从而通过强制气流从集成电路芯片散发出半导体封装的热量。

公开(公告)号：US08988645B2

公开(公告)日：2015-03-24

申请号：US13596647

申请日：2012-08-28

申请人： Jichul Kim ,  Young-Deuk Kim ,  Eunseok Cho ,  Mi-Na Choi

发明人： Jichul Kim ,  Young-Deuk Kim ,  Eunseok Cho ,  Mi-Na Choi

IPC分类号： G02F1/1345 ,  G06F13/00 ,  G02F1/1333 ,  G06F3/038 ,  G06F13/14

CPC分类号： G06F13/00 ,  G09G3/3648 ,  G09G2300/0426

摘要： A display device includes a panel including pixels defined by data lines and gate lines, a housing chassis covering a sidewall and an edge of the panel, a printed circuit board under the panel, the printed circuit board including circuit elements configured to generate at least one of a data signal, a gate signal, and a control signal, a chip on film connecting the printed circuit board to the panel, the chip on film between the housing chassis and the sidewall of the panel, a driver integrated circuit mounted on the chip on film and configured to respond to the control signal and drive at least one of the data signal and the gate signal applied to the data lines and the gate lines, and a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis.

摘要翻译： 显示装置包括包括由数据线和栅极线限定的像素的面板，覆盖面板的侧壁和边缘的壳体底板，面板下面的印刷电路板，印刷电路板包括被配置为产生至少一个 数据信号，门信号和控制信号，将印刷电路板连接到面板上的片上胶片，壳体底板和面板侧壁之间的芯片，安装在芯片上的驱动器集成电路 并且被配置为响应于控制信号并且驱动施加到数据线和栅极线的数据信号和栅极信号中的至少一个;以及连接单元，将膜上的芯片附接到壳体底座并且散发产生的热量 由驱动器集成电路到外壳底盘。

公开(公告)号：US08858007B2

公开(公告)日：2014-10-14

申请号：US13591873

申请日：2012-08-22

申请人： Young-Deuk Kim ,  Ji-Chul Kim ,  Se-Ran Bae ,  Eun-Seok Cho ,  Mi-Na Choi

发明人： Young-Deuk Kim ,  Ji-Chul Kim ,  Se-Ran Bae ,  Eun-Seok Cho ,  Mi-Na Choi

IPC分类号： G09F13/04 ,  H05K1/02

CPC分类号： G02F1/133308 ,  G02F2001/13332 ,  H05K1/0203 ,  H05K1/0281 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09909 ,  H05K2201/2036

摘要： A display device may include a chassis, a flexible printed circuit board on the chassis, a semiconductor device on the flexible printed circuit board, and a supporting element on the flexible printed circuit board. The semiconductor device may be spaced apart from the supporting element. The supporting element may be configured to maintain contact between the chassis and the flexible printed circuit board.

摘要翻译： 显示装置可以包括底盘，底盘上的柔性印刷电路板，柔性印刷电路板上的半导体器件以及柔性印刷电路板上的支撑元件。 半导体器件可以与支撑元件间隔开。 支撑元件可以被配置为保持底盘和柔性印刷电路板之间的接触。