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公开(公告)号:US20230304657A1
公开(公告)日:2023-09-28
申请号:US18197172
申请日:2023-05-15
CPC分类号: F21V33/0056 , E04B1/8409 , F21S8/04 , F21Y2105/16
摘要: In accordance with various embodiments, lighting systems features one or more inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels may feature one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals. One or more of the light panels may include sound-absorbing material therebelow and may define one or more apertures and/or cut-out regions that reveal the sound-absorbing material.
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公开(公告)号:US20210239301A1
公开(公告)日:2021-08-05
申请号:US17174503
申请日:2021-02-12
IPC分类号: F21V19/02 , F21V23/06 , F21V23/00 , F21S8/02 , F21V7/00 , F21V15/01 , F21V33/00 , F21V31/00 , E04B9/32 , E04B9/24 , F21V19/00 , H05B45/46 , E04B9/36
摘要: In accordance with certain embodiments, systems of lighting components feature multiple illumination panels each having a backing support and, secured thereto, multiple illumination elements. The illumination elements have shapes defined by arrangements of illumination unit cells may be assembled to illuminate an arbitrary two-dimensional area.
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公开(公告)号:US20220170625A1
公开(公告)日:2022-06-02
申请号:US17673001
申请日:2022-02-16
摘要: In accordance with various embodiments, lighting systems features one or more inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels may feature one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals. One or more of the light panels may include sound-absorbing material therebelow and may define one or more apertures and/or cut-out regions that reveal the sound-absorbing material.
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公开(公告)号:US20160079212A1
公开(公告)日:2016-03-17
申请号:US14948429
申请日:2015-11-23
IPC分类号: H01L25/075 , H01L33/48 , H01L33/62
CPC分类号: H01L25/0753 , H01L25/13 , H01L33/38 , H01L33/483 , H01L33/62 , H01L2224/16225 , H01L2924/07811 , H01L2924/00
摘要: In accordance with certain embodiments, an electric device includes a flexible substrate having first and second conductive traces on a first surface thereof and separated by a gap therebetween, an electronic component spanning the gap, and a stiffener configured to substantially prevent flexing of the substrate proximate the gap during flexing of the substrate.
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公开(公告)号:US20180374796A1
公开(公告)日:2018-12-27
申请号:US16021266
申请日:2018-06-28
IPC分类号: H01L23/538 , H01L33/50
摘要: In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.
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公开(公告)号:US20200343191A1
公开(公告)日:2020-10-29
申请号:US16842100
申请日:2020-04-07
IPC分类号: H01L23/538 , H01L33/50 , H01L33/62
摘要: In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.
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公开(公告)号:US20160104823A1
公开(公告)日:2016-04-14
申请号:US14970615
申请日:2015-12-16
CPC分类号: H01L33/505 , H01L23/495 , H01L27/15 , H01L27/156 , H01L33/32 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/07811 , H01L2924/00014 , H01L2924/00
摘要: In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.
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公开(公告)号:US20210296247A1
公开(公告)日:2021-09-23
申请号:US17202483
申请日:2021-03-16
IPC分类号: H01L23/538 , H01L33/50 , H01L33/62 , H01L23/498 , H01L51/00
摘要: In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.
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公开(公告)号:US20160327220A1
公开(公告)日:2016-11-10
申请号:US15215053
申请日:2016-07-20
IPC分类号: F21K9/66 , H01L23/498 , H01L23/00 , H01L33/62 , H01L33/36 , H01L33/50 , H01L33/48 , H05K1/18 , H05K3/32 , F21V3/02 , F21V9/16 , F21V23/00 , F21V23/02 , F21K9/278 , F21K9/275 , F21V29/74 , H05B37/02 , H05B33/08 , F21K9/64 , H01L25/075
CPC分类号: H01L51/0097 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21K9/66 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2224/83862 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
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公开(公告)号:US20160113087A1
公开(公告)日:2016-04-21
申请号:US14976698
申请日:2015-12-21
CPC分类号: F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
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