公开(公告)号：US5212395A

公开(公告)日：1993-05-18

申请号：US844264

申请日：1992-03-02

申请人： Paul R. Berger ,  Alfred Y. Cho ,  Niloy K. Dutta ,  John Lopata ,  Henry M. O'Bryan, Jr. ,  Deborah L. Sivco ,  George J. Zydzik

发明人： Paul R. Berger ,  Alfred Y. Cho ,  Niloy K. Dutta ,  John Lopata ,  Henry M. O'Bryan, Jr. ,  Deborah L. Sivco ,  George J. Zydzik

IPC分类号： H01L31/10 ,  H01L31/0216 ,  H01L31/0224 ,  H01L31/105

CPC分类号： H01L31/022466 ,  H01L31/02161 ,  H01L31/105

摘要： This invention pertains to a p-i-n In.sub.0.53 Ga.sub.0.47 As photodiode having an optically transparent composite top electrode consisting of a thin semitransparent metal layer from 10 to 40 nm thick and a transparent cadmium tin oxide (CTO) layer from 90 to 600 nm thick. The metal layer makes a non-alloyed ohmic contact to the semiconductor surface, acts as a barrier between the semiconductor and the CTO preventing oxidation of the semiconductor from the O.sub.2 in the plasma during reactive magnetron sputtering of the CTO layer, and prevents formation of a p-n junction between the semiconductor and CTO. The CTO functions as the n or p contact, an optical window and an anti-reflection coating. The top electrode also avoids shadowing of the active layer by the top electrode, thus allowing greater collection of incident light. Since the top electrode is non-alloyed, inter-diffusion into the i-region is not relevant, which avoids an increased dark current.

公开(公告)号：US5208821A

公开(公告)日：1993-05-04

申请号：US825208

申请日：1992-01-24

申请人： Paul R. Berger ,  Niloy K. Dutta ,  William S. Hobson ,  John Lopata

发明人： Paul R. Berger ,  Niloy K. Dutta ,  William S. Hobson ,  John Lopata

IPC分类号： H01S5/00 ,  H01S5/042 ,  H01S5/227

CPC分类号： H01S5/227

摘要： This invention pertains to buried heterostructure lasers which have been fabricated using a single step MOCVD growth of an MQW laser structure over a pattern etched GaAs substrate. The wet chemical etching of grooves having a dovetailed cross-section and being parallel to the [011] direction in GaAs substrates produced reentrant mesas which resulted in isolated laser active regions buried by the AlGaAs cladding layer. The 250 .mu.m long uncoated lasers emit at about 1 .mu.m. Lasers with coated facets have threshold currents of 20 mA and emit >100 mW per facet under room temperature operation. The external differential quantum efficiency for currents of from 30 mA to about 50 mA is found to be nearly independent of temperature in the range of 10.degree. C. to 90.degree. C. suggesting a low temperature dependence of leakage current.

公开(公告)号：US20060274513A1

公开(公告)日：2006-12-07

申请号：US11475405

申请日：2006-06-27

申请人： Augusto Panella ,  John Lopata ,  James McGrath ,  Arindum Dutta

发明人： Augusto Panella ,  John Lopata ,  James McGrath ,  Arindum Dutta

IPC分类号： H05K7/06

CPC分类号： H05K1/0262 ,  H05K1/141 ,  H05K2201/10189 ,  H05K2201/10325 ,  H05K2201/10545 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734

摘要： A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.

公开(公告)号：US20050020100A1

公开(公告)日：2005-01-27

申请号：US10702299

申请日：2003-11-06

申请人： James McGrath ,  John Lopata ,  Arindum Dutta ,  Marvin Menzin ,  Daniel Fisher

发明人： James McGrath ,  John Lopata ,  Arindum Dutta ,  Marvin Menzin ,  Daniel Fisher

IPC分类号： H01R33/76 ,  H01R12/71 ,  H01R13/24 ,  H01R43/00 ,  H05K7/10 ,  H01R12/00

CPC分类号： H01R43/007 ,  H01R12/716 ,  H01R13/2414 ,  H05K7/1069

摘要： A land grid array connector is formed by attaching a reinforcing member to a frame and coating the reinforcing member with an elastomeric compound to form a reinforced, flexible body portion of the connector. Conductive wires are inserted in pairs in an array in the fabric extent. Free ends of the wires extend past the elastomeric compound to provide contacts of the connector. The pairs of wires provide redundancy for the contacts to ensure a reliable connection.

摘要翻译： 通过将加强构件附接到框架并用弹性体复合材料涂覆加强构件形成平台格栅阵列连接器，以形成连接器的增强的柔性主体部分。 导电线成对地插入到织物范围内的阵列中。 电线的自由端延伸穿过弹性体混合物以提供连接器的触点。 电线对为触点提供冗余以确保可靠的连接。

公开(公告)号：US5861665A

公开(公告)日：1999-01-19

申请号：US853735

申请日：1997-05-13

申请人： Gustav Edward Derkits, Jr. ,  John Lopata ,  Franklin Richard Nash

发明人： Gustav Edward Derkits, Jr. ,  John Lopata ,  Franklin Richard Nash

IPC分类号： G02B6/42 ,  H01L23/26 ,  H01S5/022 ,  H05K5/06 ,  H01L23/20

CPC分类号： H01L23/26 ,  H01S5/02216 ,  H01L2924/0002 ,  H01S5/02204 ,  H01S5/02248 ,  H01S5/0683

摘要： Disclosed is an optical and/or microelectronics hermetic package which includes a member for absorbing hydrogen from the internal package ambient. The member includes a first layer which forms a hydride and, formed thereover, a second layer which forms solvated hydrogen upon exposure to molecular hydrogen in the package. The second layer acts as a one way valve for transporting hydrogen to the first layer which locks up the hydrogen.

摘要翻译： 公开了一种光学和/或微电子封装，其包括用于从内部封装环境吸收氢的部件。 该构件包括形成氢化物并在其上形成第二层的第一层，其在暴露于包装中的分子氢时形成溶剂化氢。 第二层用作将氢气输送到锁定氢气的第一层的单向阀。

公开(公告)号：US20050250387A1

公开(公告)日：2005-11-10

申请号：US11182988

申请日：2005-07-15

申请人： David Brunker ,  Daniel Dawiedczyk ,  John Lopata ,  Arindum Dutta

发明人： David Brunker ,  Daniel Dawiedczyk ,  John Lopata ,  Arindum Dutta

IPC分类号： H01B11/00 ,  H01P1/02 ,  H01P3/02 ,  H01R9/03 ,  H01R12/50 ,  H01R12/71 ,  H01R12/79 ,  H01R13/648 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/10 ,  H05K3/40 ,  H01B11/02

CPC分类号： H05K1/024 ,  H01P3/02 ,  H01R12/716 ,  H01R12/79 ,  H01R13/658 ,  H05K1/0284 ,  H05K1/145 ,  H05K3/107 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10189 ,  H05K2201/10893

摘要： Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.

摘要翻译： 用于终止高频数据信号传输线路的终端组件包括具有一个或多个腔体的壳体，该腔体容纳传输线路的端部。 传输线通常包括绝缘体和设置在其上的多个导电元件，多个导电元件成对布置以用于差分信号传输。 终端组件在一个实施例中包括由电介质形成并且具有一个或多个导电触点或设置在空腔中或腔内的电镀表面的空心端盖，使得它们将与传输线上的导电迹线摩擦配合。 在另一个实施例中，连接器壳体设置有中心狭槽和多个双环触点，以向终端组件提供冗余电路路径和低电感。 可以在槽中使用耦合元件以实现端接触点之间期望的耦合水平。

公开(公告)号：US20050092513A1

公开(公告)日：2005-05-05

申请号：US11001445

申请日：2004-11-30

申请人： David Brunker ,  Daniel Dawiedczyk ,  John Lopata ,  Arindum Dutta

发明人： David Brunker ,  Daniel Dawiedczyk ,  John Lopata ,  Arindum Dutta

IPC分类号： H01B11/00 ,  H01P1/02 ,  H01P3/02 ,  H01R9/03 ,  H01R12/50 ,  H01R12/71 ,  H01R12/79 ,  H01R13/648 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/10 ,  H05K3/40 ,  H01B9/02

CPC分类号： H05K1/024 ,  H01P3/02 ,  H01R12/716 ,  H01R12/79 ,  H01R13/658 ,  H05K1/0284 ,  H05K1/145 ,  H05K3/107 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10189 ,  H05K2201/10893

摘要： Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.

摘要翻译： 用于终止高频数据信号传输线路的终端组件包括具有一个或多个腔体的壳体，该腔体容纳传输线路的端部。 传输线通常包括绝缘体和设置在其上的多个导电元件，多个导电元件成对布置以用于差分信号传输。 终端组件在一个实施例中包括由电介质形成并且具有一个或多个导电触点或设置在空腔中或腔内的电镀表面的空心端盖，使得它们将与传输线上的导电迹线摩擦配合。 在另一个实施例中，连接器壳体设置有中心狭槽和多个双环触点，以向终端组件提供冗余电路路径和低电感。 可以在槽中使用耦合元件以实现端接触点之间期望的耦合水平。

公开(公告)号：US20050260872A1

公开(公告)日：2005-11-24

申请号：US11190138

申请日：2005-07-25

申请人： Maxwill Bassler ,  David Brunker ,  Daniel Dawiedczyk ,  John Lopata

发明人： Maxwill Bassler ,  David Brunker ,  Daniel Dawiedczyk ,  John Lopata

IPC分类号： H01R4/58 ,  H01R4/66 ,  H01R12/72 ,  H01R13/6471 ,  H01R13/6473 ,  H01R13/6474 ,  H01R13/652 ,  H01R13/6585 ,  H01R24/00 ,  H05K5/02

CPC分类号： H01R12/724 ,  H01R13/6471 ,  H01R13/6473 ,  H01R13/6474 ,  H01R13/6585

摘要： A termination structure for mating a cable connector to a circuit board has a ground terminal and two signal terminals arranged in triangular pattern through the connector in order to reduce the impedance through the connector. The width of the ground terminal increases along its extent with respect to the signal terminals. This increase occurs along either a transition or contact portion of the ground terminal.

摘要翻译： 用于将电缆连接器配合到电路板的终端结构具有通过连接器以三角形图案布置的接地端子和两个信号端子，以便减小通过连接器的阻抗。 接地端子的宽度相对于信号端子的范围增加。 该增加沿接地端子的过渡或接触部分发生。

公开(公告)号：US06888235B2

公开(公告)日：2005-05-03

申请号：US10254497

申请日：2002-09-25

申请人： John Lopata ,  Augusto P. Panella ,  Arindum Dutta ,  Jeoffrey Urbanowski

发明人： John Lopata ,  Augusto P. Panella ,  Arindum Dutta ,  Jeoffrey Urbanowski

IPC分类号： H01L23/12 ,  H01L23/32 ,  H01L23/36 ,  H01L23/498 ,  H01L23/50 ,  H01L23/52 ,  H01R13/66 ,  H01R33/76 ,  H01R33/945 ,  H05K7/10 ,  H01G4/228

CPC分类号： H01L23/49805 ,  H01L23/50 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15331 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R13/6625 ,  H05K7/1092 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Systems for power delivery to an integrated circuit include a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system delivers power to the IC along various surfaces thereof by way of a plurality of discrete capacitors that are supported by a socket-style connector. The socket-style connector has an insulative body portion that is mounted to a circuit board and has a recess defined thereon that receives the IC therein. A plurality of capacitors are integrated with the body portion and, each of the capacitors supplies a desired amount of power to the IC. The capacitors are charged by way of leads on the circuit board that bring power to current to the capacitors and then are discharged as the IC draws power from the socket such that the capacitors form a power reservoir integrated with the socket, thereby eliminating the need for mounting such capacitors on the circuit board near the IC and freeing up space on the circuit board.

摘要翻译： 用于向集成电路供电的系统包括位于形成为用于IC的插座或框架的连接器中的去耦电容。 电力输送系统通过由插座式连接器支撑的多个分立电容器向其各个表面向IC输送功率。 插座式连接器具有绝缘本体部分，其安装到电路板并且具有限定在其上的凹部，其中容纳IC。 多个电容器与主体部分集成，并且每个电容器向IC提供所需量的电力。 电容器通过电路板上的引线充电，为电容器提供电流，然后当IC从插座中吸取电力时放电，使得电容器形成与插座集成的电源存储器，从而不需要 在IC附近的电路板上安装这样的电容器，并释放电路板上的空间。

公开(公告)号：US06493368B1

公开(公告)日：2002-12-10

申请号：US09605342

申请日：2000-06-28

申请人： Leo Maria Chirovsky ,  Lucian Arthur D'Asaro ,  William Scott Hobson ,  John Lopata

发明人： Leo Maria Chirovsky ,  Lucian Arthur D'Asaro ,  William Scott Hobson ,  John Lopata

IPC分类号： H01S500

CPC分类号： H01S5/18341 ,  H01S5/0421 ,  H01S5/0422 ,  H01S5/18308 ,  H01S5/18327 ,  H01S5/18369 ,  H01S5/18377 ,  H01S5/2063

摘要： A lateral injection VCSEL comprises upper and lower mirrors forming a cavity resonator, an active region disposed in the resonator, high conductivity upper and lower contact layers located on opposite sides of the active region, upper and lower electrodes disposed on the upper and lower contact layers, respectively, and on laterally opposite sides of the upper mirror, and a current guide structure including an apertured high resistivity layer for constraining current to flow in a relatively narrow channel through the active region, characterized in that a portion of the lower contact layer that extends under the top electrode has relatively high resistivity. This feature of our invention serves two purposes. First, it suppresses current flow in parallel paths and, therefore, tends to make the current density distribution in the aperture more favorable for the fundamental mode. Second, it reduces parasitic capacitance.

摘要翻译： 侧向注入VCSEL包括形成空腔谐振器的上镜和下镜，设置在谐振器中的有源区，位于有源区的相对侧上的高导电性上和下接触层，设置在上接触层和下接触层上的上电极和下电极 以及电流引导结构，其包括用于限制电流在相对窄的通道中流动通过有源区域的有孔的高电阻率层，其特征在于，所述下接触层的一部分， 在顶部电极下方具有较高的电阻率。 本发明的这个特征有两个目的。 首先，它抑制平行路径中的电流流动，并且因此倾向于使孔径中的电流密度分布更有利于基模。 二是降低寄生电容。