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    SEMICONDUCTOR DEVICE WITH ISLAND AND ASSOCIATED LEADS
    5.
    发明申请
    SEMICONDUCTOR DEVICE WITH ISLAND AND ASSOCIATED LEADS 审中-公开

    公开(公告)号：US20190385937A1

    公开(公告)日：2019-12-19

    申请号：US16551885

    申请日：2019-08-27

    Applicant: ROHM CO., LTD.

    Inventor： Akihiro KOGA ,  Toichi NAGAHARA

    IPC: H01L23/495 ,  H01L23/31 ,  H01L23/29 ,  H01L23/498 ,  H01L23/00

    Abstract: A semiconductor part includes a resin package and an exposed portion exposed from a bottom surface of the resin package. The exposed portion has a first diagonal line perpendicular to both first and third sides of the package as viewed from the bottom surface. The exposed portion also has a second diagonal line perpendicular to both the second fourth side in the bottom view. A first lead terminal portion opposes the exposed portion and has a first shape in the bottom view. A second lead terminal portion, also opposing the exposed portion, has a second shape in the bottom view. A third lead terminal portion opposing the exposed portion, also has the second shape in the bottom view. A fourth lead terminal portion, similarly opposed to the exposed portion, likewise has the second shape in the bottom view.

    SEMICONDUCTOR DEVICE
    6.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20150228565A1

    公开(公告)日：2015-08-13

    申请号：US14693071

    申请日：2015-04-22

    Applicant: ROHM CO., LTD.

    Inventor： Akihiro KOGA ,  Toichi NAGAHARA

    IPC: H01L23/495 ,  H01L23/31 ,  H01L23/29

    CPC classification number: H01L23/49541 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

    Abstract: A semiconductor device of the present invention includes a resin package, a semiconductor chip sealed in the resin package, and having first and second pads on a front surface, a lead integrated island sealed in the resin package, to one surface of which a back surface of the semiconductor chip is bonded, and the other surface of an opposite side to the one surface of which is partially exposed from a bottom surface of the resin package as a first pad connecting terminal for electrical connection between the first pad and outside and a back connecting terminal for electrical connection between the back surface of the semiconductor chip and outside separately from each other, and a lead formed separately from the lead integrated island, sealed in the resin package, one surface of which is connected with the second pad by a wire, and the other surface of an opposite side to the one surface of which is exposed from a bottom surface of the resin package as a second pad connecting terminal for electrical connection between the second pad and outside, and the semiconductor chip is, on the one surface of the lead integrated island, disposed at a position one-sided to the first pad connecting terminal side, and the first pad and the one surface of the lead integrated island are connected by a wire.

    Abstract translation: 本发明的半导体器件包括树脂封装，密封在树脂封装中的半导体芯片，并且在前表面上具有第一和第二焊盘，密封在树脂封装中的引线集成岛，其一个表面的后表面 并且其一个表面的相对侧的另一个表面部分地从树脂封装的底表面露出，作为用于在第一焊盘和外部之间进行电连接的第一焊盘连接端子和背面 连接端子，用于在半导体芯片的背表面和外部彼此分离的电连接;以及引线，与引线集成岛分开形成，密封在树脂封装中，一个表面通过导线与第二焊盘连接 并且其一个表面的相对侧的另一个表面作为第二焊盘连接端子从树脂封装的底表面露出 用于第二焊盘和外部之间的电连接，并且半导体芯片在引线集成岛的一个表面上设置在与第一焊盘连接端子侧单侧的位置处，并且第一焊盘和第一焊盘的一个表面 导联集成岛通过电线连接。

    SEMICONDUCTOR DEVICE
    7.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20140138810A1

    公开(公告)日：2014-05-22

    申请号：US14160315

    申请日：2014-01-21

    Applicant: ROHM CO., LTD.

    Inventor： Akihiro KOGA ,  Toichi NAGAHARA

    IPC: H01L23/498

    CPC classification number: H01L23/49541 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10162 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/85399

    Abstract: A semiconductor device of the present invention includes a resin package, a semiconductor chip sealed in the resin package, and having first and second pads on a front surface, a lead integrated island sealed in the resin package, to one surface of which a back surface of the semiconductor chip is bonded, and the other surface of an opposite side to the one surface of which is partially exposed from a bottom surface of the resin package as a first pad connecting terminal for electrical connection between the first pad and outside and a back connecting terminal for electrical connection between the back surface of the semiconductor chip and outside separately from each other, and a lead formed separately from the lead integrated island, sealed in the resin package, one surface of which is connected with the second pad by a wire, and the other surface of an opposite side to the one surface of which is exposed from a bottom surface of the resin package as a second pad connecting terminal for electrical connection between the second pad and outside, and the semiconductor chip is, on the one surface of the lead integrated island, disposed at a position one-sided to the first pad connecting terminal side, and the first pad and the one surface of the lead integrated island are connected by a wire.

    Abstract translation: 本发明的半导体器件包括树脂封装，密封在树脂封装中的半导体芯片，并且在前表面上具有第一和第二焊盘，密封在树脂封装中的引线集成岛，其一个表面的后表面 并且其一个表面的相对侧的另一个表面部分地从树脂封装的底表面露出，作为用于在第一焊盘和外部之间进行电连接的第一焊盘连接端子和背面 连接端子，用于在半导体芯片的背表面和外部彼此分离的电连接;以及引线，与引线集成岛分开形成，密封在树脂封装中，一个表面通过导线与第二焊盘连接 并且其一个表面的相对侧的另一个表面作为第二焊盘连接端子从树脂封装的底表面露出 用于第二焊盘和外部之间的电连接，并且半导体芯片在引线集成岛的一个表面上设置在与第一焊盘连接端子侧单侧的位置处，并且第一焊盘和第一焊盘的一个表面 导联集成岛通过电线连接。

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