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884 条记录 (耗时 0.033 秒)

    Vibration-enhanced spin-on film techniques for semiconductor device processing
    1.
    发明授权
    Vibration-enhanced spin-on film techniques for semiconductor device processing 失效
    用于半导体器件加工的振动增强旋涂膜技术

    公开(公告)号：US5925410A

    公开(公告)日：1999-07-20

    申请号：US852144

    申请日：1997-05-06

    申请人： Salman Akram ,  Paul D. Shirley ,  William T. Rericha

    发明人： Salman Akram ,  Paul D. Shirley ,  William T. Rericha

    IPC分类号： B05D1/00 ,  B05D3/12 ,  H01L21/00

    CPC分类号： H01L21/6715 ,  B05D1/005 ,  B05D3/12

    摘要： A method for forming a layer of material, particularly a dielectric material, on a substrate includes the steps of dispensing the material onto the substrate, spinning the substrate to produce a layer of the dispensed material, and vibrating the substrate to eliminate voids and/or gaps in the dispensed material. The dispensed material is hardened and if not sufficiently planar, may be subjected to a planarization step.

    摘要翻译： 在衬底上形成材料层，特别是介电材料层的方法包括以下步骤：将材料分配到衬底上，旋转衬底以产生分配材料层，并振动衬底以消除空隙和/或 分配材料中的间隙。 分配的材料被硬化并且如果不是足够的平面，可以进行平坦化步骤。

    METHODS AND APPARATUSES FOR TRANSFERRING HEAT FROM STACKED MICROFEATURE DEVICES
    3.
    发明申请
    METHODS AND APPARATUSES FOR TRANSFERRING HEAT FROM STACKED MICROFEATURE DEVICES 有权
    用于从堆叠微型设备传输热量的方法和装置

    公开(公告)号：US20120135567A1

    公开(公告)日：2012-05-31

    申请号：US13367158

    申请日：2012-02-06

    申请人： Salman Akram ,  David R. Hembree

    发明人： Salman Akram ,  David R. Hembree

    IPC分类号： H01L21/98 ,  F28F7/00

    CPC分类号： H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

    摘要： Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap.

    摘要翻译： 本文公开了用于从堆叠的微特征装置传递热量的方法和装置。 在一个实施例中，微特征装置组件包括具有端子的支撑构件和具有由支撑构件承载的第一外部触点的第一微电子模具。 第一外部触点可操作地耦合到支撑构件上的端子。 组件还包括具有集成电路的第二微电子管芯和电耦合到第一外部触点的第二外部触头。 第一模具在支撑构件和第二模具之间。 组件还可以包括在第一模具和第二模具之间的传热单元。 传热单元包括第一传热部分，第二传热部分和第一和第二传热部分之间的间隙，使得第一外部接触部和第二外部接触部与间隙对准。

    Methods for protecting imaging elements of photoimagers during back side processing
    6.
    发明授权
    Methods for protecting imaging elements of photoimagers during back side processing 有权
    用于在背面处理期间保护光成像器的成像元件的方法

    公开(公告)号：US07919348B2

    公开(公告)日：2011-04-05

    申请号：US12139068

    申请日：2008-06-13

    申请人： Salman Akram ,  Kyle K. Kirby

    发明人： Salman Akram ,  Kyle K. Kirby

    IPC分类号： H01L21/00

    CPC分类号： H01L27/14618 ,  H01L27/14636 ,  H01L27/14685 ,  H01L2224/13

    摘要： Methods for processing photoimagers include forming one or more protective layers over the image sensing elements of a photoimager. Protective layers may facilitate thinning of the substrates of photoimagers, as well as prevent contamination of the image sensing elements and associated optical features during back side processing of the photoimagers. Blind vias, which extend from the back side of a photoimager to bond pads carried by an active surface of the photoimager, may be formed through the back side. The vias may be filled with conductive material and, optionally, redistribution circuitry may be fabricated over the back side of the photoimager. Photoimagers including features at result from such processes are also disclosed.

    摘要翻译： 用于处理光影目标的方法包括在光成像仪的图像感测元件上形成一个或多个保护层。 保护层可以促进光刻胶的基材的变薄，并且可以防止在光成像器的背面处理期间图像感测元件和相关的光学特征的污染。 可以通过背面形成从光电成像仪的背面延伸到由光电成像仪的有源表面承载的接合焊盘的盲通孔。 通孔可以用导电材料填充，并且可选地，重新分布电路可以在光电成像仪的背面上制造。 还公开了包括这些处理结果的特征的光照器。

    Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures
    7.
    发明授权
    Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures 有权
    包括镀镍铝，铜和钨结构的半导体器件结构

    公开(公告)号：US07855454B2

    公开(公告)日：2010-12-21

    申请号：US11702286

    申请日：2007-02-05

    申请人： Salman Akram ,  James M. Wark ,  William M. Hiatt

    发明人： Salman Akram ,  James M. Wark ,  William M. Hiatt

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H01L21/76879 ,  C23C18/1607 ,  C23C18/1637 ,  C23C18/1831 ,  C23C18/1834 ,  C23C18/34 ,  C23C18/36 ,  H01L21/288 ,  H01L21/76898 ,  H01L2924/00013 ,  Y10T428/12528 ,  Y10T428/24917 ,  H01L2224/29099

    摘要： A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure comprising at least one first metal structure and at least one second metal structure on a semiconductor substrate. The at least one first metal structure comprises at least one aluminum structure, at least one copper structure, or at least one structure comprising a mixture of aluminum and copper and the at least one second metal structure comprises at least one tungsten structure. One of the at least one first metal structure and the at least one second metal structure is activated toward metal plating without activating the other of the at least one first metal structure and the at least one second metal structure. An intermediate semiconductor device structure is also disclosed.

    摘要翻译： 一种激活中间半导体器件结构上的金属结构朝向金属电镀的方法。 该方法包括提供在半导体衬底上包括至少一个第一金属结构和至少一个第二金属结构的中间半导体器件结构。 所述至少一个第一金属结构包括至少一个铝结构，至少一个铜结构或至少一个包括铝和铜的混合物的结构，并且所述至少一个第二金属结构包括至少一个钨结构。 所述至少一个第一金属结构和所述至少一个第二金属结构中的一个被激活朝向金属镀覆，而不激活所述至少一个第一金属结构和所述至少一个第二金属结构中的另一个。 还公开了一种中间半导体器件结构。

    Method of forming vias in semiconductor substrates and resulting structures
    8.
    发明授权
    Method of forming vias in semiconductor substrates and resulting structures 有权
    在半导体衬底和结构中形成通孔的方法

    公开(公告)号：US07855140B2

    公开(公告)日：2010-12-21

    申请号：US11781083

    申请日：2007-07-20

    申请人： Charles M. Watkins ,  Kyle K. Kirby ,  Alan G. Wood ,  Salman Akram ,  Warren M. Farnworth

    发明人： Charles M. Watkins ,  Kyle K. Kirby ,  Alan G. Wood ,  Salman Akram ,  Warren M. Farnworth

    IPC分类号： H01L21/4763

    CPC分类号： H01L21/76898

    摘要： Methods for forming through vias in a semiconductor substrate and resulting structures are disclosed. In one embodiment, a through via may be formed by forming a partial via from an active surface through a conductive element thereon and a portion of the substrate underlying the conductive element. The through via may then be completed by laser ablation or drilling from a back surface. In another embodiment, a partial via may be formed by laser ablation or drilling from the back surface of a substrate to a predetermined distance therein. The through via may be completed from the active surface by forming a partial via extending through the conductive element and the underlying substrate to intersect the laser-drilled partial via. In another embodiment, a partial via may first be formed by laser ablation or drilling from the back surface of the substrate followed by dry etching to complete the through via.

    摘要翻译： 公开了在半导体衬底中形成贯通孔的方法和所得到的结构。 在一个实施例中，可以通过从活性表面通过其上的导电元件和导电元件下面的基底的一部分形成部分通孔来形成通孔。 然后可以通过从后表面的激光烧蚀或钻孔来完成通孔。 在另一个实施例中，部分通孔可以通过激光烧蚀或从衬底的背面钻孔到其中的预定距离来形成。 通孔可以通过形成延伸通过导电元件和下面的衬底以与激光钻孔的部分通孔相交的部分通孔从活性表面完成。 在另一个实施例中，可以首先通过激光烧蚀或从衬底的背面进行钻孔形成部分通孔，然后通过干蚀刻来完成通孔。