LIGHT EMITTING DEVICE PACKAGE
    2.
    发明申请

    公开(公告)号:US20170338210A1

    公开(公告)日:2017-11-23

    申请号:US15386425

    申请日:2016-12-21

    Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.

    LIGHT EMITTING DEVICE PACKAGE
    6.
    发明申请

    公开(公告)号:US20180269192A1

    公开(公告)日:2018-09-20

    申请号:US15971196

    申请日:2018-05-04

    Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.

    LIGHT EMITTING DEVICE PACKAGE
    7.
    发明申请

    公开(公告)号:US20180068991A1

    公开(公告)日:2018-03-08

    申请号:US15802493

    申请日:2017-11-03

    Abstract: A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.

    METHOD OF MANUFACTURING NANOSTRUCTURE SEMICONDUCTOR LIGHT-EMITTING DEVICE
    8.
    发明申请
    METHOD OF MANUFACTURING NANOSTRUCTURE SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权
    制造纳米结构半导体发光器件的方法

    公开(公告)号:US20160099376A1

    公开(公告)日:2016-04-07

    申请号:US14867659

    申请日:2015-09-28

    CPC classification number: H01L33/005 H01L33/06 H01L33/08 H01L33/145 H01L33/24

    Abstract: According to an example embodiment, a method of manufacturing a nanostructure semiconductor light-emitting device includes forming nanocores of a first-conductivity type nitride semiconductor material on abase layer to be spaced apart from each other, and forming a multilayer shell including an active layer and a second-conductivity type nitride semiconductor layers on surfaces of each of the nanocores. At least a portion the multilayer shell is formed by controlling at least one process parameter of a flux of source gas, a flow rate of source gas, a chamber pressure, a growth temperature, and a growth rate so as to have a higher film thickness uniformity.

    Abstract translation: 根据一个示例性实施例,一种制造纳米结构半导体发光器件的方法包括:将第一导电型氮化物半导体材料的纳米孔彼此间隔开,并形成包含活性层的多层壳, 在每个纳米孔的表面上的第二导电型氮化物半导体层。 通过控制源气体通量,源气体流量,室压力,生长温度和生长速率的至少一个工艺参数来形成多层壳体的至少一部分,从而具有更高的膜厚度 均匀性

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