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    SOLDER PASTE
    2.
    发明申请
    SOLDER PASTE 审中-公开
    焊膏

    公开(公告)号：US20070278456A1

    公开(公告)日：2007-12-06

    申请号：US11754421

    申请日：2007-05-29

    申请人： Tadahiko Sakai ,  Tadashi Maeda

    发明人： Tadahiko Sakai ,  Tadashi Maeda

    IPC分类号： H01B1/22

    CPC分类号： H05K3/3484 ,  H05K2201/0218 ,  H05K2201/0266 ,  H05K2203/0435

    摘要： In a solder paste 3 formed by allowing a resin component 3a having oxide removability to contain solder particles 4A, 4B, and 4C which are formed by coating the surfaces of core particles 6A, 6B, and 6C made of tin (Sn) or an alloy of tin with silver (Ag) coating films 7A, 7B, and 7C, the core particles are distributed to have such a particle distribution that the average particle diameter is in the range of 3 μm to 7 μm and 75% or more of the particles is in the range of 1 μm to 9 μm and the coating film is formed so that the core particles are coated with a silver coating film of an amount which occupies 1 to 4 wt % of the solder particles. Accordingly, it is possible to prevent oxide from being formed on the surfaces of the solder particles and to enhance the solder wettability at the time of soldering. In addition, it is possible to secure printability onto fine electrodes and to secure excellent solder adhesion with respect to a fine-pitch part by the use of a simple and low-cost method.

    摘要翻译： 在通过使具有氧化物去除性的树脂组分3a含有通过涂覆由下列物质制成的芯颗粒6A，6B和6C的表面形成的焊料颗粒4A，4B和4C形成的焊膏3中， 锡（Sn）或锡与银（Ag）涂膜7 A，7 B和7 C的合金，芯颗粒分布成具有这样的颗粒分布，使得平均粒径在3μm至 7μm和75％以上的颗粒在1μm〜9μm的范围内，并且形成涂膜，使得芯颗粒涂覆有占银的1〜4wt％的银涂膜 焊料颗粒。 因此，可以防止在焊料颗粒的表面上形成氧化物，并且可以提高焊接时的焊料润湿性。 此外，可以通过简单且低成本的方法将可印刷性确保到细小电极上并且确保相对于细间距部分的良好焊接粘合性。

    Method for soldering electronic component and soldering structure of electronic component
    6.
    发明授权
    Method for soldering electronic component and soldering structure of electronic component 有权
    焊接电子部件的方法和电子部件的焊接结构

    公开(公告)号：US07632710B2

    公开(公告)日：2009-12-15

    申请号：US11817522

    申请日：2006-11-10

    申请人： Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

    发明人： Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

    IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/52 ,  H01L23/48 ,  H01L23/40 ,  H01L23/485 ,  H01L23/488

    CPC分类号： H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

    摘要： In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder 8 is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder 8 has a flake or dendrite shape including a core segment 8a of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment 8b of the metal with good-wettability for the molten solder and to be solid-solved in the core segment 8a molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles 18. Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

    摘要翻译： 在焊接电子部件时，为了在再流动期间引导熔融焊料的目的，将金属粉末8混合到所使用的焊剂中，以便介于凸块和电极之间。 金属粉末8具有片状或枝晶状，其包括在比构成焊料凸块的焊料的液相温度高的温度下熔融的金属的芯部分8a和金属的具有良好润湿性的熔融焊料的表面部分8b 并固化在芯部8a熔化。 在通过再流动的加热中，残留在助熔剂中而不被吸入焊料部分的金属粉末熔融固化成为大致球形的金属颗粒18.因此，在再流动之后，金属粉末不残留在 在可能发生迁移的状态下的助焊剂残留物，从而结合焊接连接性和绝缘保险。

    METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE OF ELECTRONIC COMPONENT
    7.
    发明申请
    METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE OF ELECTRONIC COMPONENT 有权
    焊接电子元件的方法和电子元器件的焊接结构

    公开(公告)号：US20090233117A1

    公开(公告)日：2009-09-17

    申请号：US11817522

    申请日：2006-11-10

    申请人： Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

    发明人： Tadahiko Sakai ,  Tadashi Maeda ,  Mitsuru Ozono

    IPC分类号： B32B15/04 ,  B23K31/02 ,  B23K1/20

    CPC分类号： H05K3/3484 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/10977 ,  H05K2203/0435 ,  Y10T428/12049

    摘要： In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder 8 is mixed into flux employed so as to intervene between a bump and an electrode. The metallic powder 8 has a flake or dendrite shape including a core segment 8a of the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segment 8b of the metal with good-wettability for the molten solder and to be solid-solved in the core segment 8a molten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particles 18. Thus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

    摘要翻译： 在焊接电子部件时，为了在再流动期间引导熔融焊料的目的，将金属粉末8混合到所使用的焊剂中，以便介于凸块和电极之间。 金属粉末8具有片状或枝晶状，其包括在比构成焊料凸块的焊料的液相温度高的温度下熔融的金属的芯部分8a和金属的具有良好润湿性的熔融焊料的表面部分8b 并固化在芯部8a熔化。 在通过再流动的加热中，残留在助熔剂中而不被吸入焊料部分的金属粉末熔融固化成为大致球形的金属颗粒18.因此，在再流动之后，金属粉末不残留在 在可能发生迁移的状态下的助焊剂残留物，从而结合焊接连接性和绝缘保险。