公开(公告)号：US5427642A

公开(公告)日：1995-06-27

申请号：US772642

申请日：1991-10-08

申请人： Takashi Akiguchi ,  Yukio Maeda

发明人： Takashi Akiguchi ,  Yukio Maeda

IPC分类号： C08K5/20 ,  C08L63/00 ,  C09J201/00 ,  H05K3/30 ,  B32B31/00

CPC分类号： H05K3/305 ,  C08K5/20 ,  C08L63/00 ,  C09J201/00 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2203/0545 ,  H05K2203/1105 ,  H05K2203/122 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T156/1092

摘要： An adhesive composition for use in the mounting of electronic parts on a printed circuit board is disclosed. The composition comprises a photosetting and thermosetting resin ingredient and a long-chain saturated fatty acid amide. Also disclosed is a method for mounting electronic parts on a printed circuit board by the use of such an adhesive composition.

摘要翻译： 公开了一种用于将电子部件安装在印刷电路板上的粘合剂组合物。 组合物包含光固化和热固性树脂成分和长链饱和脂肪酸酰胺。 还公开了通过使用这种粘合剂组合物将电子部件安装在印刷电路板上的方法。

公开(公告)号：US5137936A

公开(公告)日：1992-08-11

申请号：US558236

申请日：1990-07-26

申请人： Takashi Akiguchi ,  Yukio Maeda ,  Daisuke Irii

发明人： Takashi Akiguchi ,  Yukio Maeda ,  Daisuke Irii

IPC分类号： H05K3/34 ,  C08F2/46 ,  C08G59/00 ,  C08G59/18 ,  C09D4/06 ,  C09J4/02 ,  C09J163/00 ,  H05K3/30

CPC分类号： H05K3/305 ,  C09D4/06 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： An adhesive composition comprising 10 to 60 parts by weight per 100 parts of the total weight of components (1) to (4) of a monofunctional (meth)acrylic monomer, 0.01 to 10 parts by weight per 100 parts of the total weight of components (1) to (4) of a compound having at least two (meth)acryloyl groups in a molecule, 30 to 80 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a heat resistant epoxy resin, 0.1 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of an imidazole compound, 0.001 to 10 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a photopolymerization initiator, and 0.01 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a thixotropic agent, with which an electronic part can be effectively packaged to a printed board.

摘要翻译： 一种粘合剂组合物，其包含每100份单官能（甲基）丙烯酸单体的组分（1）至（4））的总重量为10至60重量份，相对于每100份组分的总重量为0.01至10重量份 在分子中具有至少两个（甲基）丙烯酰基的化合物的（1）〜（4）中，相对于热成分（1）〜（4）的总重量的100重量份，为30〜80重量份 相对于100重量份的咪唑化合物的组分（1）〜（4）的总重量为0.1〜20重量份，相对于100重量份的组分 （1）〜（4），相对于触变剂的成分（1）〜（4）的总重量的100重量份为0.01〜20重量份，电子部件能够有效地 包装到印刷板上。

公开(公告)号：US06357106B1

公开(公告)日：2002-03-19

申请号：US09257268

申请日：1999-02-25

申请人： Mitsumasa Oku ,  Takashi Akiguchi ,  Shinji Murakami ,  Yutaka Harada ,  Norihito Tsukahara ,  Mitsunori Yokomakura ,  Kenichi Sato

发明人： Mitsumasa Oku ,  Takashi Akiguchi ,  Shinji Murakami ,  Yutaka Harada ,  Norihito Tsukahara ,  Mitsunori Yokomakura ,  Kenichi Sato

IPC分类号： H01F4110

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01F5/003 ,  H01F27/40 ,  H01F41/041 ,  H01L21/4867 ,  H01L24/32 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/095 ,  H05K3/222 ,  H05K3/321 ,  H05K3/4685 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/1453 ,  Y10T29/4902 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/05599

摘要： A method for mounting parts, and an IC card and its manufacturing method. The method reduces the number of steps, increases productivity, lowers costs, and miniaturizes the chip. A first electrode of the IC chip for processing signals received from a coil is connected to an internal end of a coil pattern formed on a first substrate, and an external end of the coil pattern and a second electrode of the IC chip are connected via a jumper wire.

摘要翻译： 一种安装部件的方法，以及IC卡及其制造方法。 该方法减少了步骤数量，提高了生产率，降低了成本，并且使芯片小型化。 用于处理从线圈接收的信号的IC芯片的第一电极连接到形成在第一基板上的线圈图案的内端，线圈图案的外端和IC芯片的第二电极经由 跳线

公开(公告)号：US6086441A

公开(公告)日：2000-07-11

申请号：US69334

申请日：1998-04-29

申请人： Takashi Akiguchi ,  Kazuto Nishida

发明人： Takashi Akiguchi ,  Kazuto Nishida

IPC分类号： H01J9/28 ,  H05K1/09 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36 ,  H01J9/24

CPC分类号： H01J9/28 ,  H05K3/361 ,  H01J2211/46 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/092 ,  H05K2201/10977 ,  H05K2203/1189 ,  H05K3/284 ,  H05K3/305 ,  H05K3/323

摘要： A method is disclosed for connecting electrodes of a plasma display panel. The method includes overlapping a thick film electrode formed on a glass substrate with an electrode of a flexible substrate via an adhesive sheet having conductive particles dispersed therein, then, heating and pressuring from above the flexible substrate with a pressuring tool, to thereby set the adhesive sheet, and finally electrically connecting the electrode of the glass substrate and the electrode of the flexible substrate with each other.

摘要翻译： 公开了一种用于连接等离子体显示面板的电极的方法。 该方法包括通过具有分散在其中的导电颗粒的粘合片将形成在玻璃基板上的厚膜电极与柔性基板的电极重叠，然后用加压工具从柔性基板的上方加热和加压，从而将粘合剂 并且最后将玻璃基板的电极和柔性基板的电极彼此电连接。

公开(公告)号：US07090482B2

公开(公告)日：2006-08-15

申请号：US10736568

申请日：2003-12-17

申请人： Norihito Tsukahara ,  Takashi Akiguchi ,  Hidenori Miyakawa

发明人： Norihito Tsukahara ,  Takashi Akiguchi ,  Hidenori Miyakawa

IPC分类号： B29C33/00

CPC分类号： H01L24/82 ,  G06K19/07745 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49855 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： A bump is formed on each element electrode of a semiconductor device, and a thermoplastic resin sheet is aligned in position with the semiconductor device. The sheet and the semiconductor device are subjected to hot pressing to melt the sheet, forming a thermoplastic resin portion that covers a portion other than the end surface of each bump of the semiconductor device. The thermoplastic resin portion obtained after the hot pressing is cut.

摘要翻译： 在半导体器件的每个元件电极上形成凸起，并且热塑性树脂片与半导体器件对准。 对片材和半导体器件进行热压以熔化片材，形成覆盖半导体器件的每个凸起的端面之外的部分的热塑性树脂部分。 切割热压后得到的热塑性树脂部分。

公开(公告)号：US06708401B2

公开(公告)日：2004-03-23

申请号：US09818899

申请日：2001-03-28

申请人： Hidenori Miyakawa ,  Yoshio Maruyama ,  Hiroshi Yamauchi ,  Mikiya Nakata ,  Takashi Akiguchi ,  Yoshinori Wada ,  Kazuhiro Mori

发明人： Hidenori Miyakawa ,  Yoshio Maruyama ,  Hiroshi Yamauchi ,  Mikiya Nakata ,  Takashi Akiguchi ,  Yoshinori Wada ,  Kazuhiro Mori

IPC分类号： H05K330

CPC分类号： H05K5/068 ,  H05K3/284 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49146

摘要： A package is formed by covering a circuit board with a thermoplastice film. The cylindrical or sheet-like thermoplastic film is decompressed and used to cover the circuit board to protect the board and components mounted on the board.

摘要翻译： 通过用热塑性薄膜覆盖电路板形成封装。 圆柱形或片状热塑性薄膜被减压并用于覆盖电路板以保护安装在板上的板和组件。

公开(公告)号：US06780668B1

公开(公告)日：2004-08-24

申请号：US10031000

申请日：2002-01-16

申请人： Norihito Tsukahara ,  Takashi Akiguchi ,  Hidenori Miyakawa

发明人： Norihito Tsukahara ,  Takashi Akiguchi ,  Hidenori Miyakawa

IPC分类号： H01L2150

CPC分类号： H01L24/82 ,  G06K19/07745 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49855 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： A bump is formed on each element electrode of a semiconductor device, and a thermoplastic resin sheet is aligned in position with the semiconductor device. The sheet and the semiconductor device are subjected to hot pressing to melt the sheet, forming a thermoplastic resin portion that covers a portion other than the end surface of each bump of the semiconductor device. The thermoplastic resin portion obtained after the hot pressing is out.

摘要翻译： 在半导体器件的每个元件电极上形成凸起，并且热塑性树脂片与半导体器件对准。 对片材和半导体器件进行热压以熔化片材，形成覆盖半导体器件的每个凸起的端面之外的部分的热塑性树脂部分。 热压后获得的热塑性树脂部分出来。

公开(公告)号：US5744382A

公开(公告)日：1998-04-28

申请号：US703879

申请日：1996-08-27

申请人： Yoshifumi Kitayama ,  Kazuhiro Mori ,  Keiji Saeki ,  Takashi Akiguchi

发明人： Yoshifumi Kitayama ,  Kazuhiro Mori ,  Keiji Saeki ,  Takashi Akiguchi

IPC分类号： H01L21/603 ,  H01L21/607 ,  H01L23/31 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L23/3171 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/85 ,  H01L24/94 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85375 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/3025

摘要： An electronic chip component includes an electrode formed on a wafer, a passivation film formed on the water, and an organic protective film covering an entire surface of exposed portions of the electrode and the passivation film. Such component is packed in a package including a carrier tape having therethrough a space for receiving the component with one end of such space open. A cover is applied to close the open end of the space after the component is inserted therein.

摘要翻译： 电子芯片部件包括形成在晶片上的电极，形成在水上的钝化膜，以及覆盖电极和钝化膜的暴露部分的整个表面的有机保护膜。 这种组件被包装在一个包装中，该包装带有一个带有一个空间的载带，用于接收一个这样的空间开口的部件。 在将组件插入其中之后，应用盖子封闭空间的开口端。

公开(公告)号：US5646439A

公开(公告)日：1997-07-08

申请号：US703876

申请日：1996-08-27

申请人： Yoshifumi Kitayama ,  Kazuhiro Mori ,  Keiji Saeki ,  Takashi Akiguchi

发明人： Yoshifumi Kitayama ,  Kazuhiro Mori ,  Keiji Saeki ,  Takashi Akiguchi

IPC分类号： H01L21/603 ,  H01L21/607 ,  H01L23/31 ,  H01L23/485 ,  H01L23/58

CPC分类号： H01L23/3171 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/85 ,  H01L24/94 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85375 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/3025

摘要： An electronic chip component includes an electrode formed on a wafer, a passivation film formed on the wafer, and an organic protective film covering an entire surface of exposed portions of the electrode and the passivation film. A package for packing the component includes a carrier tape having therethrough a space for receiving the component with one end or side of the space opened, and a cover tape for closing the open end of the space after the component is stored in the space. A method for packing the component includes the steps of storing the component in the space of the carrier tape with one end of the space opened, and closing the open end of the space with the cover tape.

摘要翻译： 电子芯片部件包括形成在晶片上的电极，形成在晶片上的钝化膜和覆盖电极和钝化膜的暴露部分的整个表面的有机保护膜。 一种用于包装该组件的包装件，具有一穿过其中一个空间的载体带，该空间用于在该空间的一端或侧面打开的状态下接收该部件;以及盖带，用于在该部件被储存在该空间中之后封闭该空间的开口端。 用于包装部件的方法包括以下步骤：将部件存放在承载带的空间中，其一端敞开，并用盖带封闭空间的开口端。