公开(公告)号：US20090180042A1

公开(公告)日：2009-07-16

申请号：US12349189

申请日：2009-01-06

申请人： Takayuki Furukawa ,  Miyoko Irikiin ,  Yukihiro Iwata ,  Shinya Ogasawara ,  Hiroaki Takezawa

发明人： Takayuki Furukawa ,  Miyoko Irikiin ,  Yukihiro Iwata ,  Shinya Ogasawara ,  Hiroaki Takezawa

IPC分类号： H04N5/64

CPC分类号： H04N5/645

摘要： A display apparatus including a display device, circuit boards on which circuits for driving the display device are formed, a chassis plate having a first surface to which the display device is mounted and a second surface to which the circuit boards are mounted, and a back cover fastened onto the second surface of the chassis plate by screws. The chassis plate has a first radiating rib, and the back cover has a second radiating rib that is in surface contact with the first radiating rib.

摘要翻译： 一种显示装置，包括显示装置，其上形成有用于驱动显示装置的电路的电路板，具有安装显示装置的第一表面和安装电路板的第二表面的底板，以及背面 盖子通过螺丝固定在底盘的第二表面上。 底盘具有第一辐射肋，后盖具有与第一辐射肋表面接触的第二辐射肋。

公开(公告)号：US06749889B2

公开(公告)日：2004-06-15

申请号：US10409400

申请日：2003-04-07

申请人： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

发明人： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

IPC分类号： B05D512

CPC分类号： H05K3/321 ,  B32B7/02 ,  B32B7/12 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2203/0783 ,  H05K2203/121 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T428/24066 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/269 ,  Y10T428/31678 ,  Y10T428/31681

摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

摘要翻译： 在包括通过导电粘合剂彼此电连接的第一电极和第二电极的安装结构中，至少一个电极和导电粘合剂之间的粘合部分的周边被电绝缘层覆盖，由此附着 部分从外围加强。 电绝缘层可以通过将导电粘合剂的粘合剂树脂组分溶解在溶剂中而形成。 这增加了导电粘合剂中的导电填料的浓度，从而也增强了粘合部分的导电性。

公开(公告)号：US06510059B2

公开(公告)日：2003-01-21

申请号：US09889523

申请日：2001-07-18

申请人： Tsutomu Mitani ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Hiroaki Takezawa

发明人： Tsutomu Mitani ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Hiroaki Takezawa

IPC分类号： H05K118

CPC分类号： H05K3/321 ,  C09J9/02 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K3/305 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/0783 ,  Y02P70/611 ,  Y10S205/925 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

摘要： In mounting an electronic component using a conductive resin, a conductive resin containing a specific diluent component is used as the conductive resin, or a specific diluent component is applied to the conductive resin before being cured. This allows connection in a portion where an electrode (5) of an electronic component (4) and an electrode (2) of a circuit substrate (1) are opposed to each other to be provided via a resin (3a) containing a conductive filler as a main component, and allows connection at a lower surface of the electronic component (4) and connection in vicinities of the electrode (5) to be provided via a resin (3b, 3c) containing a binder resin as a main component that has oozed out of the conductive resin. The resin (3b, 3c) containing the binder resin as the main component increases junction strength.

公开(公告)号：US06488869B2

公开(公告)日：2002-12-03

申请号：US09056774

申请日：1998-04-08

申请人： Hiroaki Takezawa ,  Minehiro Itagaki ,  Yoshihiro Bessho

发明人： Hiroaki Takezawa ,  Minehiro Itagaki ,  Yoshihiro Bessho

IPC分类号： H01B102

CPC分类号： H05K1/095 ,  H01B1/22 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/10636 ,  H05K2203/121 ,  Y02P70/611 ,  Y10T428/24917 ,  Y10T428/3192

摘要： A conductive paste has conductive particles having metal particle surface coated with a complex of same metal of less than 10 nm in thickness and not having spontaneous oxide film on said metal particles, and a binder mainly composed of an insulating resin.

摘要翻译： 导电糊具有金属颗粒表面涂覆有厚度小于10nm且在所述金属颗粒上不具有自发氧化膜的相同金属的复合物的导电颗粒和主要由绝缘树脂构成的粘合剂。

公开(公告)号：US06376051B1

公开(公告)日：2002-04-23

申请号：US09519984

申请日：2000-03-07

申请人： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

发明人： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

IPC分类号： B32B300

CPC分类号： H05K3/321 ,  B32B7/02 ,  B32B7/12 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2203/0783 ,  H05K2203/121 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T428/24066 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/269 ,  Y10T428/31678 ,  Y10T428/31681

摘要： In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

公开(公告)号：US06916433B2

公开(公告)日：2005-07-12

申请号：US10030235

申请日：2001-02-27

申请人： Tsutomi Mitani ,  Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Yasuhiro Suzuki

发明人： Tsutomi Mitani ,  Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Yasuhiro Suzuki

IPC分类号： C09J9/02 ,  H05K3/32 ,  H01B1/22 ,  H01L23/04

CPC分类号： H05K3/321 ,  C09J9/02 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/10636 ,  H05K2203/0278 ,  H05K2203/0307 ,  Y02P70/611 ,  Y10T428/2982

摘要： A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesive 3 on a substrate electrode 2 of a circuit substrate 1 and also for packaging an electronic element 4. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.

摘要翻译： 导电粘合剂包括导电填料和粘合剂树脂的主要组分，并且导电填料的含量在20重量％至70重量％的范围内。 导电填料的至少一部分优选具有突起。 特别优选枝晶金属填料。 当该粘合剂被压缩时，树脂组分被挤出，而导电填料组分保留在内部。 结果，导电填料组分的浓度升高到内部，并且这通过划伤电极的表面来连接电极是有用的。 在电路基板1的基板电极2上形成导电性粘接剂3也需要焊料，也可以包装电子元件4。 还提供了使用导电粘合剂的电子元件的包装，其具有改善的初始和长期可靠性，以及包装该电子元件的方法。

公开(公告)号：US20050098338A1

公开(公告)日：2005-05-12

申请号：US11009045

申请日：2004-12-13

申请人： Takashi Kitae ,  Tsutomu Mitani ,  Yukihiro Ishimaru ,  Hiroaki Takezawa

发明人： Takashi Kitae ,  Tsutomu Mitani ,  Yukihiro Ishimaru ,  Hiroaki Takezawa

IPC分类号： H01L21/60 ,  H01L23/485 ,  H05K3/32 ,  H02G3/08

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29318 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/19041 ,  H05K3/321 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2203/0307 ,  H05K2203/1446 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element. Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 μm or more and to 10.0 μm or less and preferably to 1.0 μm or more and to 5.0 μm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.

摘要翻译： 电子部件4的外部电极3的表面形成有含有树脂成分的涂层。 因此，通过导电粘合剂的介质将电子部件安装到电路板1上可以显着改善粘附强度和可靠性。 此外，通过利用形成作为连接元件的外部电极3的导电粘合剂，能够将电子部件安装到要安装的元件上。 此外，电子部件的外部电极3的表面粗糙度（R a1 a）设定为0.1μm以上至10.0μm以下，优选为1.0μm以上且5.0μm以下 。 因此，与传统的电子部件相比，与导电粘合剂的粘附强度可以显着提高。

公开(公告)号：US06465082B1

公开(公告)日：2002-10-15

申请号：US09554502

申请日：2000-05-16

申请人： Hiroaki Takezawa ,  Masahide Tsukamoto ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Hideo Hatanaka ,  Yasushi Fukumura ,  Kazuo Eda ,  Toru Ishida

发明人： Hiroaki Takezawa ,  Masahide Tsukamoto ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Hideo Hatanaka ,  Yasushi Fukumura ,  Kazuo Eda ,  Toru Ishida

IPC分类号： H05K100

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K3/105 ,  H05K3/321 ,  H05K2201/0212 ,  H05K2201/0379 ,  H05K2201/10257 ,  H05K2201/10992 ,  H05K2203/121 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31681

摘要： A stress relaxation type electronic component which is to be mounted on a circuit board, wherein a stress relaxation mechanism member is disposed on a surface of said electronic component, said surface being on a side of a connection portion where said electronic component is to be connected to said circuit board, and said stress relaxation mechanism member is electrically conductive.

摘要翻译： 一种要安装在电路板上的应力松弛型电子部件，其中应力松弛机构部件设置在所述电子部件的表面上，所述表面位于要连接所述电子部件的连接部分的一侧 到所述电路板，并且所述应力松弛机构构件是导电的。

公开(公告)号：US06207550B1

公开(公告)日：2001-03-27

申请号：US09107319

申请日：1998-06-30

申请人： Nobuhiro Hase ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Satoru Yuhaku ,  Hiroaki Takezawa ,  Yoshihiro Bessho

发明人： Nobuhiro Hase ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Satoru Yuhaku ,  Hiroaki Takezawa ,  Yoshihiro Bessho

IPC分类号： H01L2144

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K1/092 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/323 ,  H05K3/4007 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/10674 ,  H05K2203/0278 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed is a method for mounting a semiconductor element, the method requiring no strict flatness for a substrate and being reliable in a semiconductor device produced by mounting a semiconductor element on a circuit substrate. In the multilayer circuit substrate comprising bump electrodes formed of a conductive paste, a conductive adhesive is applied to the top of bump electrodes and then leveled to obtain the end portions on the bump electrodes with a high coplanarity in height. The semiconductor element is mounted on this substrate using a combination of a conductive resin and a sealing resin or an anisotropic conductive sheet. Every top of the bump electrodes after the conductive adhesive is applied has a high coplanarity. The semiconductor element can be mounted with high reliability, on the substrate having such a poor flatness of the electrode face that mounting by a conventional method can not be applied.

摘要翻译： 公开了一种用于安装半导体元件的方法，该方法对于基板不需要严格的平坦度，并且在通过将半导体元件安装在电路基板上而制造的半导体器件中是可靠的。 在包含由导电浆料形成的凸块电极的多层电路基板中，将导电性粘合剂施加到凸块电极的顶部，然后平整，以在凸起电极上获得具有高共面度的端部。 半导体元件使用导电树脂和密封树脂或各向异性导电片的组合安装在该基板上。 使用导电性粘合剂之后的凸起电极的每个顶部具有高的共面性。 半导体元件可以以高可靠性安装在基板上，其电极面的平坦度差，不能施加常规方法的安装。

公开(公告)号：US06203919B1

公开(公告)日：2001-03-20

申请号：US08980749

申请日：1997-12-01

申请人： Yasuo Takebe ,  Tadashi Ootake ,  Norihisa Mino ,  Hiroaki Takezawa

发明人： Yasuo Takebe ,  Tadashi Ootake ,  Norihisa Mino ,  Hiroaki Takezawa

IPC分类号： B32B1508

CPC分类号： H01B3/30 ,  Y10T428/31529 ,  Y10T428/31533 ,  Y10T428/31536 ,  Y10T428/31605 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31909

摘要： An electrically insulating film capable of maintaining a preferable insulating property even with a film thickness of only some &mgr;and a method for preparing the same are disclosed. The insulating film comprises a first layer formed on a surface of a conductor substrate of a transition metal and comprised of molecules fixed on the surface of the conductor substrate through chemical bonds such as transition metal-sulfur bonds or chelate bonds, and a second layer formed on the first layer and comprised of a resin bonded to the molecules of the first layer through covalent bonds.

摘要翻译： 公开了一种甚至即使膜厚仅有一些保持优选绝缘性能的电绝缘膜及其制备方法。 绝缘膜包括形成在过渡金属的导体基板的表面上的第一层，并且由通过诸如过渡金属 - 硫键或螯合键的化学键固定在导体基板的表面上的分子组成，第二层形成 在第一层上并且由通过共价键与第一层的分子键合的树脂组成。