公开(公告)号：US20120052086A1

公开(公告)日：2012-03-01

申请号：US13290960

申请日：2011-11-07

申请人： Teruhiko Terakawa ,  Hisakazu Hasegawa ,  Yasushi Shimada ,  Atsushi Takahashi ,  Takeshi Kawarabayashi ,  Mikio Shoji

发明人： Teruhiko Terakawa ,  Hisakazu Hasegawa ,  Yasushi Shimada ,  Atsushi Takahashi ,  Takeshi Kawarabayashi ,  Mikio Shoji

IPC分类号： A61K39/00 ,  A61P37/02 ,  A61P25/28 ,  C07K14/415

CPC分类号： A61K39/0007 ,  A61K2039/55516 ,  A61K2039/6031 ,  C07K14/415 ,  C07K14/4711 ,  C12N15/62 ,  C12N15/8257 ,  C12N15/8258

摘要： A vaccine composition for prophylaxis and/or therapy of Alzheimer's disease, which comprises a fusion protein prepared by inserting a single or tandemly repeated multiple copies of amyloid β antigenic peptide having 5 to 15 continuous amino acid residues derived from the N-terminus of amyloid β peptide into a wild type seed storage protein.

摘要翻译： 一种用于预防和/或治疗阿尔茨海默氏病的疫苗组合物，其包含通过插入单个或串联重复的多个淀粉样蛋白复合物制备的融合蛋白; 具有衍生自淀粉样蛋白N末端的5至15个连续氨基酸残基的抗原肽; 肽成野生型种子储存蛋白。

公开(公告)号：US08912145B2

公开(公告)日：2014-12-16

申请号：US13290960

申请日：2011-11-07

申请人： Teruhiko Terakawa ,  Hisakazu Hasegawa ,  Yasushi Shimada ,  Atsushi Takahashi ,  Takeshi Kawarabayashi ,  Mikio Shoji

发明人： Teruhiko Terakawa ,  Hisakazu Hasegawa ,  Yasushi Shimada ,  Atsushi Takahashi ,  Takeshi Kawarabayashi ,  Mikio Shoji

IPC分类号： C12N15/62 ,  C12N15/82 ,  A61P25/28 ,  A61K38/00 ,  A61K38/08 ,  A61K36/48 ,  C07K7/06 ,  C12N15/12 ,  C12N15/29 ,  A61K39/00 ,  C07K14/415 ,  C07K14/47

CPC分类号： A61K39/0007 ,  A61K2039/55516 ,  A61K2039/6031 ,  C07K14/415 ,  C07K14/4711 ,  C12N15/62 ,  C12N15/8257 ,  C12N15/8258

摘要： A vaccine composition for prophylaxis and/or therapy of Alzheimer's disease, which comprises a fusion protein prepared by inserting a single or tandemly repeated multiple copies of amyloid β antigenic peptide having 5 to 15 continuous amino acid residues derived from the N-terminus of amyloid β peptide into a wild type seed storage protein.

摘要翻译： 一种用于预防和/或治疗阿尔茨海默氏病的疫苗组合物，其包含通过插入单个或串联重复的多个淀粉样蛋白复合物制备的融合蛋白; 具有衍生自淀粉样蛋白N末端的5至15个连续氨基酸残基的抗原肽; 肽成野生型种子储存蛋白。

公开(公告)号：US06621170B2

公开(公告)日：2003-09-16

申请号：US09842441

申请日：2001-04-26

申请人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

发明人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

IPC分类号： H01L2348

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

摘要翻译： 本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和 使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产 处理。

公开(公告)号：US5965269A

公开(公告)日：1999-10-12

申请号：US930512

申请日：1997-10-03

申请人： Teiichi Inada ,  Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro

发明人： Teiichi Inada ,  Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro

IPC分类号： B32B7/12 ,  B32B15/08 ,  C09J163/00 ,  H05K3/38 ,  B32B27/38

CPC分类号： B32B15/08 ,  B32B7/12 ,  C09J163/00 ,  H05K3/386 ,  Y10S525/93 ,  Y10T428/31511 ,  Y10T428/31529

摘要： An adhesive comprising (1) 100 parts by weight of a combination of an epoxy resin having a weight average molecular weight of less than 5,000 and a curing agent, (2) 10 to 40 parts by weight of a high-molecular weight component being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, (3) 20 to 100 parts by weight of a high-molecular weight component being incompatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, and (4) 0.1 to 5 parts by weight of a cure accelerator. The adhesive is excellent not only in moisture resistance, heat resistance, adhesive strength at high temperature, heat dissipation, reliability of insulation, crack resistance and flexibility but also in circuit filling and tight adhesion, and exhibits suitable flow properties.

摘要翻译： PCT No.PCT / JP96 / 00798 Sec。 371日期1997年10月3日第 102（e）日期1997年10月3日PCT 1996年3月27日PCT公布。 出版物WO96 / 31574 日期：1996年10月10日粘合剂包含（1）100重量份的重均分子量小于5,000的环氧树脂和固化剂的组合，（2）10至40重量份的高分子量聚合物， 分子量成分与环氧树脂相容，重均分子量为30,000以上，（3）20〜100重量份与环氧树脂不相容的高分子量成分，重均分子量 30,000以上，（4）0.1〜5重量份的固化促进剂。 粘合剂不仅在耐湿性，耐热性，高温粘合强度，散热性，绝缘可靠性，抗裂性和柔韧性以及电路填充和紧密粘合方面都是优异的，并且表现出合适的流动性能。

公开(公告)号：US5323534A

公开(公告)日：1994-06-28

申请号：US27803

申请日：1993-03-08

申请人： Yorio Iwasaki ,  Toshiro Okamura ,  Shigeharu Arike ,  Yasushi Shimada ,  Hiroharu Kamiyama ,  Eisaku Namai ,  Fujio Kojima

发明人： Yorio Iwasaki ,  Toshiro Okamura ,  Shigeharu Arike ,  Yasushi Shimada ,  Hiroharu Kamiyama ,  Eisaku Namai ,  Fujio Kojima

IPC分类号： H05K1/02 ,  H05K3/10 ,  H05K3/42 ,  H05K7/06 ,  H01K3/10

CPC分类号： H05K1/0219 ,  H05K3/429 ,  H05K7/06 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K3/103 ,  Y10T29/49162

摘要： A coaxial conductor interconnection wiring board characterized by having at least one inner wall metallized conductive hole for connecting a conductive shield of coaxial conductor to a ground layer, or having connection metal layers for connecting ground layers or connecting the conductive shield to a ground layer, and an inner wall metallized conductive hole for connecting a central signal conductor of coaxial conductor to other circuits, is excellent in preventing crosstalk noise and shielding effect.

摘要翻译： 一种同轴导体互连线路板，其特征在于具有至少一个内壁金属化导电孔，用于将同轴导体的导电屏蔽连接到接地层，或具有用于连接接地层或将导电屏蔽连接到接地层的连接金属层，以及 用于将同轴导体的中心信号导体与其他电路连接的内壁金属化导电孔在防止串扰噪声和屏蔽效果方面是优异的。

公开(公告)号：US20070060672A1

公开(公告)日：2007-03-15

申请号：US10557890

申请日：2004-05-19

申请人： Yasushi Kumashiro ,  Yoshitaka Hirata ,  Shin Takanezawa ,  Yasushi Shimada ,  Kazuhisa Otsuka ,  Hiroyuki Kuriya ,  Kazunori Yamamoto

发明人： Yasushi Kumashiro ,  Yoshitaka Hirata ,  Shin Takanezawa ,  Yasushi Shimada ,  Kazuhisa Otsuka ,  Hiroyuki Kuriya ,  Kazunori Yamamoto

IPC分类号： B32B17/00 ,  B32B5/16 ,  C08K7/00 ,  C08K3/10 ,  C08K3/22

CPC分类号： H05K1/162 ,  H01B3/30 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/25 ,  Y10T428/269 ,  Y10T428/31678

摘要： There is provided an insulation material having a dielectric constant of 10 or more, comprising a filler having a dielectric constant of 50 or more and having two peaks in different particle size ranges in a particle size distribution and an insulating resin combined with each other; an insulation material having a dielectric constant of 10 or more comprising, as essential components, 1) at least one filler selected from the group consisting of barium titanate, strontium titanate, potassium titanate, magnesium titanate, lead titanate, titanium dioxide, barium zirconate, calcium zirconate and lead zirconate, 2) an insulating resin and 3) a dispersant containing a carboxylic group; or an insulation material comprising a filler having a dielectric constant of 50 or more, a dispersant for dispersing the filler and an insulating resin as essential components, wherein an extract of a cured product of the insulation material obtained by extraction with water at 120° C. for 20 hours using a pressure vessel has a pH of 6 or higher.

摘要翻译： 提供介电常数为10以上的绝缘材料，其包含介电常数为50以上的填料，并且在粒度分布中具有不同粒径范围的两个峰和彼此结合的绝缘树脂; 一种具有10或更高介电常数的绝缘材料，其包含作为必要组分的1）至少一种选自钛酸钡，钛酸锶，钛酸钾，钛酸镁，钛酸铅，二氧化钛，锆酸钡， 锆酸锆和锆酸铅，2）绝缘树脂和3）含有羧基的分散剂; 或包含介电常数为50以上的填料的绝缘材料，用于分散填料的分散剂和绝缘树脂作为必要成分，其中通过在120℃下用水萃取获得的绝缘材料的固化产物的提取物 使用压力容器20小时，pH为6以上。

公开(公告)号：US20060106166A1

公开(公告)日：2006-05-18

申请号：US11319069

申请日：2005-12-28

申请人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka

发明人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka

IPC分类号： C08L63/00 ,  B32B27/38

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.

公开(公告)号：US06184577B2

公开(公告)日：2001-02-06

申请号：US09308525

申请日：1999-08-30

申请人： Kenzo Takemura ,  Itsuo Watanabe ,  Akira Nagai ,  Osamu Watanabe ,  Kazuyoshi Kojima ,  Akishi Nakaso ,  Kazunori Yamamoto ,  Yoshiyuki Tsuru ,  Teiichi Inada ,  Yasushi Shimada

发明人： Kenzo Takemura ,  Itsuo Watanabe ,  Akira Nagai ,  Osamu Watanabe ,  Kazuyoshi Kojima ,  Akishi Nakaso ,  Kazunori Yamamoto ,  Yoshiyuki Tsuru ,  Teiichi Inada ,  Yasushi Shimada

IPC分类号： H01L2363

CPC分类号： H05K1/0271 ,  H01L21/563 ,  H01L23/145 ,  H01L23/5383 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07811 ,  H01L2924/1301 ,  H01L2924/13034 ,  H05K3/323 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0133 ,  H05K2201/068 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

摘要： In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of the inner-layer circuit by press lamination, and a through hole is formed through the sheet, followed by electroless copper plating, outer-layer circuit formation by the subtractive process, and solder coating to obtain the packaging substrate. The bump electrode of the semiconductor chip and the packaging substrate are connected through an adhesive film.

摘要翻译： 对于其上安装有半导体芯片的封装基板，双面覆铜玻璃环氧树脂层压片的表面铜箔进行电路形成和内层结合，然后将具有铜的环氧树脂粘合膜 箔通过压力叠层结合到内层电路的表面，并且通过片形成通孔，接着进行无电镀铜，通过减法处理形成外层电路，并获得焊料涂层以获得封装基板 。 半导体芯片的凸起电极和封装基板通过粘合膜连接。

公开(公告)号：US20090186955A1

公开(公告)日：2009-07-23

申请号：US12414420

申请日：2009-03-30

申请人： Teiichi INADA ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi INADA ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： C08L63/00 ,  C08J9/00

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the fillers followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.

摘要翻译： 本发明提供了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还任选地包含（d）填料和/或（e） 固化促进剂; 一种制备粘合剂组合物的方法，包括：（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合; 包含形成为膜的上述粘合剂组合物的粘合膜; 一种用于安装半导体的基板，包括布线板和其上安装有芯片的侧面上的粘合膜; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。

公开(公告)号：US20070036971A1

公开(公告)日：2007-02-15

申请号：US11476725

申请日：2006-06-29

申请人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： B32B27/38 ,  C09J163/00 ,  C08L63/00 ,  C09J7/02

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.

摘要翻译： 本发明提供了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还任选地包含（d）填料和/或（e） 固化促进剂; 一种制备粘合剂组合物的方法，包括：（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合; 包含形成为膜的上述粘合剂组合物的粘合膜; 一种用于安装半导体的基板，包括布线板和其上安装有芯片的侧面上的粘合膜; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。