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1.发明授权公开(公告)号：US07061599B2
公开(公告)日：2006-06-13
申请号：US10465821
申请日：2003-06-20
IPC分类号： G01N21/00
CPC分类号： H05K3/4069 , H05K1/0269 , H05K3/0035 , H05K3/0055 , H05K3/4614 , H05K3/4617 , H05K2201/0394 , H05K2203/0191 , H05K2203/0264 , H05K2203/108 , H05K2203/161
摘要： An inspection apparatus for a base substrate of a multi-layered board irradiates light to the base substrate of a multilayered board to which a protective film is attached. An image of a surface, to which the protective film is attached, is picturized by a camera, so that an acceptability of a state of a via hole is inspected on the basis of a difference between a light reflectivity of the via hole and a light reflectivity of the protective film. The protective film is colored so as to lower its light reflectivity so that the difference between the light reflectivity of the via hole and that of the protective film is clearly generated. Accordingly, on the basis of the image picturized by the camera, the size of the via hole, dusts therein and the acceptability of the via hole can be accurately inspected.
摘要翻译： 多层基板的基板检查装置将光照射到附着有保护膜的多层基板的基板上。 通过照相机对附着有保护膜的表面的图像进行检查，从而基于通孔的光反射率和光的差异来检查通孔的状态的可接受性 保护膜的反射率。 保护膜着色以降低其光反射率，从而清楚地产生通孔的光反射率与保护膜的光反射率之间的差异。 因此，基于由照相机拍摄的图像，可以精确地检查通孔的尺寸，其中的灰尘和通孔的可接受性。
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公开(公告)号：US06855625B2
公开(公告)日：2005-02-15
申请号：US10458630
申请日：2003-06-11
申请人： Koji Kondo , Tetsuaki Kamiya , Toshikazu Harada , Ryuichi Onoda , Yasutaka Kamiya , Gentaro Masuda , Yoshitaro Yazaki , Tomohiro Yokochi
发明人： Koji Kondo , Tetsuaki Kamiya , Toshikazu Harada , Ryuichi Onoda , Yasutaka Kamiya , Gentaro Masuda , Yoshitaro Yazaki , Tomohiro Yokochi
CPC分类号： H05K3/4638 , H05K3/0035 , H05K3/281 , H05K3/4069 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0355 , H05K2201/0394 , H05K2201/09245 , H05K2201/096 , H05K2201/09854 , H05K2203/063 , H05K2203/065 , H05K2203/1476 , H05K2203/1572 , Y10T156/1064
摘要： Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.
摘要翻译： 制备单面导体图案化膜，其每一个具有只形成树脂膜的一侧的导体图案和填充有导电浆料的通孔。 在单面导体图案化膜上层叠单面导体图案膜，其具有仅形成树脂膜的一侧的导体图案和形成在树脂膜中以露出电极的开口。 此外，在单面导体图案化膜的底面上层叠具有露出电极的开口的覆盖层，以形成层压体。 然后，通过在加热层叠体的同时按压，可以制造在其两侧具有电极的多层基板。
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公开(公告)号：US06527162B2
公开(公告)日：2003-03-04
申请号：US09907599
申请日：2001-07-19
申请人： Makoto Totani , Toshihiro Miyake , Tomohiro Yokochi , Takehito Teramae , Yoshitaro Yazaki , Kazuyuki Deguchi , Hajime Nakagawa
发明人： Makoto Totani , Toshihiro Miyake , Tomohiro Yokochi , Takehito Teramae , Yoshitaro Yazaki , Kazuyuki Deguchi , Hajime Nakagawa
IPC分类号： B23K3102
CPC分类号： H05K3/363 , H05K3/3452 , H05K3/3494 , H05K2201/0129 , H05K2201/091 , H05K2201/0989 , H05K2201/09909 , H05K2201/10772 , H05K2203/0195 , H05K2203/0278 , H05K2203/065
摘要： Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.
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公开(公告)号：US06972070B2
公开(公告)日：2005-12-06
申请号：US10643919
申请日：2003-08-20
CPC分类号： H05K3/4632 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0129 , H05K2201/0272 , H05K2201/0305 , H05K2201/0355 , H05K2201/0394 , H05K2201/09827 , H05K2201/09863 , H05K2203/0425 , H05K2203/1131 , Y10T428/24917
摘要： A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.
摘要翻译： 通过用层间导电材料填充形成在布线板的绝缘膜层上的孔，制成加压印刷线路板。 绝缘膜与导体图案堆叠，并且每个导体图案封闭通孔。 夹层导电材料在加压压制程序后在通孔中形成固体导电材料。 固体导电材料包括两种类型的导电材料。 第一类导电材料包括金属，第二类导电材料包括由导体图案的金属和导体金属形成的合金。 导体图形可靠地电连接，而不依赖于机械接触。
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公开(公告)号：US06667443B2
公开(公告)日：2003-12-23
申请号：US10007703
申请日：2001-12-10
申请人： Koji Kondo , Tetsuaki Kamiya , Toshikazu Harada , Ryuichi Onoda , Yasutaka Kamiya , Gentaro Masuda , Yoshitaro Yazaki , Tomohiro Yokochi
发明人： Koji Kondo , Tetsuaki Kamiya , Toshikazu Harada , Ryuichi Onoda , Yasutaka Kamiya , Gentaro Masuda , Yoshitaro Yazaki , Tomohiro Yokochi
IPC分类号： H05K100
CPC分类号： H05K3/4638 , H05K3/0035 , H05K3/281 , H05K3/4069 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0355 , H05K2201/0394 , H05K2201/09245 , H05K2201/096 , H05K2201/09854 , H05K2203/063 , H05K2203/065 , H05K2203/1476 , H05K2203/1572 , Y10T156/1064
摘要： Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.
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公开(公告)号：US06641898B2
公开(公告)日：2003-11-04
申请号：US10024470
申请日：2001-12-21
IPC分类号： B32B300
CPC分类号： H05K3/4632 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0129 , H05K2201/0272 , H05K2201/0305 , H05K2201/0355 , H05K2201/0394 , H05K2201/09827 , H05K2201/09863 , H05K2203/0425 , H05K2203/1131 , Y10T428/24917
摘要： A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.
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公开(公告)号：US06966482B2
公开(公告)日：2005-11-22
申请号：US10340798
申请日：2003-01-13
申请人： Makoto Totani , Toshihiro Miyake , Tomohiro Yokochi , Takehito Teramae , Yoshitaro Yazaki , Kazuyuki Deguchi , Hajime Nakagawa
发明人： Makoto Totani , Toshihiro Miyake , Tomohiro Yokochi , Takehito Teramae , Yoshitaro Yazaki , Kazuyuki Deguchi , Hajime Nakagawa
CPC分类号： H05K3/363 , H05K3/3452 , H05K3/3494 , H05K2201/0129 , H05K2201/091 , H05K2201/0989 , H05K2201/09909 , H05K2201/10772 , H05K2203/0195 , H05K2203/0278 , H05K2203/065
摘要： Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.
摘要翻译： 形成在柔性印刷电路板上的焊盘通过焊料与刚性印刷电路板上形成的焊盘电连接。 此时，在刚性印刷电路板上的相邻的两个焊盘之间形成阻焊剂，并且端接有刚性印刷电路板和柔性印刷电路板之间的端部。 因此，即使剩余焊料被挤出到刚性印刷电路板上，阻焊剂也可以防止在焊盘之间形成焊料桥。
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8.发明授权公开(公告)号：US06449836B1
公开(公告)日：2002-09-17
申请号：US09626243
申请日：2000-07-26
申请人： Toshihiro Miyake , Katsuaki Kojima , Hiroyasu Iwama , Makoto Totani , Yoshitaro Yazaki , Takehito Teramae , Tomohiro Yokochi , Kenzo Hirano , Tomoyuki Nanami
发明人： Toshihiro Miyake , Katsuaki Kojima , Hiroyasu Iwama , Makoto Totani , Yoshitaro Yazaki , Takehito Teramae , Tomohiro Yokochi , Kenzo Hirano , Tomoyuki Nanami
IPC分类号： H05K336
CPC分类号： H05K3/361 , H05K3/3484 , H05K3/363 , H05K2201/0129 , H05K2201/10977 , H05K2203/0195 , H05K2203/065 , Y10T29/49126 , Y10T29/49144 , Y10T29/49149
摘要： In interconnecting printed circuit boards: preparing a first and second printed circuit board is accomplished with the first having an insulating substrate of thermoplastic resin and a conductive pattern with a land, while the second has a conductive pattern with a land; overlapping the land of the first with the land of the second is done to form an interconnection portion; and heating the interconnection portion at a temperature approximately higher than a glass transition temperature of the thermoplastic resin while applying pressure to the interconnection portion to create an electrical interconnection sealed with a part of the thermoplastic resin constituting the insulating substrate of the first board is accomplished. The insulating substrate of the first board is overlapped with an insulating substrate of the second printed board to interpose a film, the film including material to reduce a modulus of elasticity of the insulating substrate of the first board.
摘要翻译： 在互连印刷电路板中：制备第一和第二印刷电路板，其中第一和第二印刷电路板的第一个具有热塑性树脂的绝缘基板和具有焊盘的导电图案，而第二印刷电路板具有带有焊盘的导电图案; 重叠第一个与第二个土地的土地，以形成互连部分; 并在相当于热塑性树脂的玻璃化转变温度的温度下加热互连部分，同时向互连部分施加压力以形成由构成第一板的绝缘基板的热塑性树脂的一部分密封的电互连。 第一板的绝缘基板与第二印刷电路板的绝缘基板重叠以插入膜，该膜包括材料以降低第一板的绝缘基板的弹性模量。
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9.发明申请Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device 有权用于半导体器件的封装衬底，其制造方法和半导体器件公开(公告)号：US20060044735A1
公开(公告)日：2006-03-02
申请号：US11213867
申请日：2005-08-30
申请人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
发明人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
IPC分类号： H05K1/00
CPC分类号： H05K3/4632 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/0271 , H05K1/114 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , H05K2201/068 , H05K2201/09063 , H05K2201/096 , H05K2201/09781 , H05K2201/2009 , H05K2203/1178 , H01L2924/00 , H01L2224/0401
摘要： A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
摘要翻译： 具有形成在表面上的导电图案的多个膜绝缘体和在厚度方向上穿过膜绝缘体的导电通孔堆叠在一起并且集体地经受压力和热量以形成为单个单元。 在如此形成的多层板的一个最外层上，多个连接端子暴露于外部，LSI芯片的连接凸块固定在这些连接端子上。 在相对侧的最外层，设置多个金属焊盘，并且在每个金属焊盘上固定焊球以形成用于连接到主板的球栅阵列（BGA）结构。
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公开(公告)号：US07036214B2
公开(公告)日：2006-05-02
申请号：US10383227
申请日：2003-03-07
IPC分类号： H05K3/36
CPC分类号： H05K3/4691 , H05K1/118 , H05K3/4069 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2201/0909 , H05K2201/09109 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.
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