摘要:
An optical recording medium, wherein a recording layer is formed on a substrate to which a light beam is applied to record, erase, and read data with said recording and erasing of data being carried out by means of phase changes between amorphous and crystalline, and which recording medium has a laminated structure made up of a transparent substrate on which at least a first dielectric layer, recording layer, second dielectric layer, and reflecting layer are formed in this order; and the second dielectric layer not being transparent. Said optical recording media permit low-power recording and erasing, remain stable after repeated recording and erasing, and hardly suffer deterioration in performance or formation of defects. They are high in resistance to moist heat and oxidation and long in service life.
摘要:
Disclosed is a process which comprises bringing an acidic organic substance or phosphoric acid into contact with a metal to form, on the surface of the metal, a layer that contains either an organic acid salt formed from both the acidic organic substance and the metal or a phosphoric acid salt formed from both the phosphoric acid and the metal. In the process, the layer can be selectively formed only on the surface of the metal. When the process is applied to the production of core-shell particles, neither agglomeration of the particles nor viscosity increase of the fluid occurs, while when the process is applied to the production of a covered metal-wiring circuit board, the layer can be selectively formed only in the metal area to be covered.
摘要:
A paste composition containing (a) a resin, (b) high dielectric constant inorganic particles having a perovskite crystal structure, and (c) an organic solvent, wherein the average particle diameter of the high dielectric constant inorganic particles is 0.002 μm to 0.06 μm, and the amount of all organic solvents is 35 wt % to 85 wt % based on the total amount of the paste composition. Further, a dielectric composition containing (a) a resin and (b) high dielectric constant inorganic particles having a perovskite crystal structure, wherein the average particle diameter of the high dielectric constant inorganic particles (b) is 0.002 μm to 0.06 μm.
摘要:
This invention is a resin composition for optical wiring, comprising an inorganic filler with an average particle size of 1 nm to 100 nm and a resin, having a ratio nf/nr (where nf is the refractive index of the inorganic filler and nr is the refractive index of the resin) of 0.8 to 1.2, a thermal expansion coefficient of −1×10−5 /° C. to 4×10−5/° C., and a true dependency value of its refractive index on the temperature of −1×10−4/° C. to 1×10−4/° C. in a temperature range from −20° C. to 90° C., and substantially incapable of absorbing light in a wavelength range from 0.6 to 0.9 μm or from 1.2 to 1.6 μm. This invention also provides an optoelectronic circuit board.
摘要:
The object of this invention is to provide a rewritable phase change type optical recording medium and an optical recording apparatus that are good in erasure characteristics and small in jitter even in high linear velocity high density recording, are unlikely to cause cross erasure even in the use of a substrate with a narrow track width, are unlikely to be deteriorated in signal quality even after repeated irradiation with a laser beam, and are good also in storage durability. The object of this invention can be achieved by a phase change type optical recording medium, characterized in that at least a first dielectric layer, a first boundary layer, a recording layer, a second boundary layer, an absorption correction layer and a reflection layer are provided in this order on a substrate, that the recording layer has a specific composition, that the first and second boundary layers are respectively mainly composed of at least one selected from carbon, carbides, oxides and nitrides, and that the absorption correction layer is 1.0 to 4.0 in refractive index and 0.5 to 3.0 in attenuation coefficient.
摘要:
A solution for forming a superconductive thin film prepared by dissolving a mol of a compound selected from group A consisting of alkoxides and alkoxyalkoxides of a rare earth metal element; b mol of a compound selected from group B consisting of alkoxides and alkoxyalkoxides of Ba, Sr and Ca; and c mol of a compound selected from group C consisting of alkoxides and alkoxyalkoxides of Cu in e liter of a compound selected from group E, a solvent selected from alcohols together with d mol of a compound selected from group D for inhibiting hydrolysis action such as an amine, a ketone and a glycol, such that the following relationships:0.1.times.(a+b+c).ltoreq.d.ltoreq.3.times.(a+b+c)and0.01.ltoreq.[(a+b+c)/e].ltoreq.3can be satisfied.
摘要:
Provided is a process for producing an adhesive sheet having a singulated adhesive layer (b) on a carrier film (a), comprising the following steps in the order mentioned: Step A: cutting an adhesive film having a carrier film (a), an adhesive layer (b), and a cover film (c) in the order mentioned locally only at the adhesive layer (b) and the cover film (c) by means of local half-cutting; Step B: peeling only the cover film (c) at unwanted parts of the adhesive film; Step C: applying adhesive tape to the side of the cover film (c) of the adhesive film; and Step D: peeling the adhesive layer (b) at unwanted parts and the cover film (c) at desired parts of the adhesive film together with the adhesive tape. Also provided are a process for producing an adhesive sheet comprising a singulated adhesive disposed at a specific position, and equipment for producing an adhesive sheet.
摘要:
An adhesive composition for semiconductor containing an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C. under 1.013×105 N/m2 and a compound being solid at 25° C. under 1.013×105 N/m2, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.
摘要翻译:含有有机溶剂可溶性聚酰亚胺(a),环氧化合物(b)和硬化促进剂(c))的半导体用粘合剂组合物,其中,相对于100重量份的环氧化合物(b),含有15〜90 有机溶剂可溶性聚酰亚胺(a)的重量份和硬化促进剂(c)0.1〜10重量份,其中环氧化合物(b)在25℃下含有1.01×10 5 N / m2,化合物在25℃下为1.013×10 5 N / m 2,其中基于所有环氧化合物的液体化合物的比例为20重量%以上至60重量%以下。
摘要:
Disclosed is a photosensitive adhesive composition including: (A) an epoxy compound, (B) a soluble polyimide having a residue of the diamine represented by the general formula (2), (C) a photopolymerizable compound, and (D) a photopolymerization initiator, wherein the epoxy compound (A) contains an epoxy compound represented by the general formula (1), and also the soluble polyimide (B) has a residue of diamine represented by the general formula (2): The present invention provides a photosensitive adhesive composition which can be developed with an alkali developing solution after exposure, and exhibits high adhesive strength in case of thermocompression bonding on a substrate, and is also excellent in insulation stability.
摘要:
The present invention is an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.