公开(公告)号：US06174606B1

公开(公告)日：2001-01-16

申请号：US08976923

申请日：1997-11-24

申请人： Vlasta Agnes Brusic ,  Judith Marie Roldan ,  Ravi F. Saraf

发明人： Vlasta Agnes Brusic ,  Judith Marie Roldan ,  Ravi F. Saraf

IPC分类号： B32B2738

CPC分类号： H01L24/83 ,  H01B1/22 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/321 ,  H05K2201/0769 ,  H05K2203/124 ,  Y10S428/901 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2224/05599

摘要： A conductive composite is described containing silver particles and a polymer which covers each silver particle and wherein a heterocyclic organic compound containing nitrogen such as benzotriazole (BTA) is present to reduce Ag dissolution and ion mobility by forming a water insoluble complex with the Ag ion. The invention overcomes the problem of silver dissolution or corrosion a conductive composite as a result of normal high Ag ion mobility in the presence of moisture and an electric field.

摘要翻译： 描述了包含银颗粒和覆盖每个银颗粒的聚合物的导电复合材料，并且其中存在含氮杂环有机化合物如苯并三唑（BTA））以通过与Ag离子形成水不溶性络合物来降低Ag溶解和离子迁移率。 本发明克服了在存在水分和电场的情况下由于正常高的Ag离子迁移率导致的导电复合材料的银溶解或腐蚀的问题。

公开(公告)号：US5997773A

公开(公告)日：1999-12-07

申请号：US249302

申请日：1999-02-12

申请人： Marie Angelopoulos ,  Vlasta A. Brusic ,  Teresita Ordonez Graham ,  Sampath Purushothaman ,  Ravi F. Saraf ,  Jane Margaret Shaw ,  Judith Marie Roldan ,  Alfred Viehbeck

发明人： Marie Angelopoulos ,  Vlasta A. Brusic ,  Teresita Ordonez Graham ,  Sampath Purushothaman ,  Ravi F. Saraf ,  Jane Margaret Shaw ,  Judith Marie Roldan ,  Alfred Viehbeck

IPC分类号： C08G61/12 ,  C08L33/00 ,  C08L65/00 ,  C09D5/08 ,  C09D5/24 ,  C09J9/02 ,  H01B1/12 ,  H01B1/22 ,  H01B1/24 ,  H05K3/32 ,  H05K9/00 ,  H01B1/20 ,  B05D5/12

CPC分类号： H05K9/0083 ,  C08G61/12 ,  C08L65/00 ,  C09D5/08 ,  C09D5/24 ,  C09J9/02 ,  H01B1/125 ,  H01B1/127 ,  H01B1/128 ,  H01B1/22 ,  H01B1/24 ,  H05K3/321 ,  H05K9/0079 ,  H05K9/0088 ,  C08L33/00 ,  H05K2201/0329 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/31529 ,  Y10T428/31533 ,  Y10T428/31605 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31855

摘要： Electrostatic discharge protection or electromagnetic interference shielding is provided by applying a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically conductive particles and at least one conducting polymer to a dielectric substrate.

摘要翻译： 通过施加包含热固性或热塑性聚合物基质和导电填料组分的组合物提供静电放电保护或电磁干扰屏蔽，其中所述填料组分包含导电颗粒和至少一种导电聚合物至电介质基底。

公开(公告)号：US6127253A

公开(公告)日：2000-10-03

申请号：US134210

申请日：1998-08-14

申请人： Judith Marie Roldan ,  Ravi F. Saraf

发明人： Judith Marie Roldan ,  Ravi F. Saraf

IPC分类号： H01L21/60 ,  H01L23/485 ,  H05K3/32 ,  H01L21/44

CPC分类号： H05K3/321 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/11 ,  H01L2224/11505 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K2201/0129 ,  H05K2201/0379 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0783 ,  H05K2203/176

摘要： An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles based on the total volume of the metal particles and the thermoplastic polymer. The present invention is also directed to a method of making electrical interconnections to an electronic device by pressing a plurality of composite bumps of a polymeric based material against a substrate having an electrically conductive surface by mechanical means under a sufficient temperature and/or a sufficient pressure. The present invention is further directed to a method of debonding an electronic device bonded by a composite binder by first providing an electronic device that is bonded by composite bumps consists of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles and then exposing the composite bumps to a solvent or to a temperature not less than about 50%.degree. C. below the glass transition temperature of the composite bump.

摘要翻译： 一种电子设备，其配备有多个焊盘，该多个焊盘位于该装置上，用于进行电互连，并且该导电复合凸块粘附到该焊盘上，其中该凸块由热塑性聚合物和至少约30体积的复合材料形成 基于金属颗粒和热塑性聚合物的总体积的导电金属颗粒的百分比。 本发明还涉及一种通过在足够的温度和/或足够的压力下通过机械手段将聚合物基材料的多个复合凸块压靠在具有导电表面的基底上的方式来制造与电子器件的电互连的方法 。 本发明进一步涉及一种通过首先提供一种电子器件来分离由复合粘结剂粘接的电子器件的方法，所述电子器件通过由热塑性聚合物和至少约30体积％的导电金属颗粒组成的复合凸块接合，然后暴露 复合物凸起到溶剂或达到低于复合凸块的玻璃化转变温度不低于约50％℃的温度。

公开(公告)号：US6013713A

公开(公告)日：2000-01-11

申请号：US965227

申请日：1997-11-06

申请人： John Michael Cotte ,  Judith Marie Roldan ,  Carlos Juan Sambucetti ,  Ravi F. Saraf

发明人： John Michael Cotte ,  Judith Marie Roldan ,  Carlos Juan Sambucetti ,  Ravi F. Saraf

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/28 ,  H05K3/34 ,  C08K3/08 ,  H01B1/22

CPC分类号： H01L24/12 ,  H01L23/49816 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/83 ,  H05K3/3436 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13311 ,  H01L2224/13411 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19043 ,  H05K2201/035 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K3/284 ,  H05K3/288 ,  H05K3/3484 ,  Y02P70/613 ,  Y10T29/49165 ,  Y10T428/12063 ,  Y10T428/12104 ,  Y10T428/12528 ,  Y10T428/12569 ,  Y10T428/12687 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12889 ,  Y10T428/31678

摘要： A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. The invention overcomes the problem of interconnecting Pb containing electrodes that are covered with an insulating oxide on integrated circuit chips by coating the Pb containing electrode with Au to provide an oxide free surface for testing and interconnection.

摘要翻译： 描述了一种糊状物，用掺有溶剂的无氧化物金属层，不可剥离的聚合物和颗粒来覆盖电极。 电极可以是诸如C4凸起的互连。 还描述了用于形成涂层的方法和用于测试集成电路芯片的方法。 本发明克服了通过用含有Pb的电极与Au一起涂覆由集成电路芯片上的绝缘氧化物覆盖的含Pb电极来提供无氧化物表面进行测试和互连的问题。

公开(公告)号：US06197222B1

公开(公告)日：2001-03-06

申请号：US09119569

申请日：1998-07-20

申请人： Ravi F. Saraf ,  Judith Marie Roldan ,  Michael Anthony Gaynes ,  Richard Benton Booth ,  Steven Paul Ostrander ,  Emanuel I. Cooper ,  Carlos J. Sambucetti

发明人： Ravi F. Saraf ,  Judith Marie Roldan ,  Michael Anthony Gaynes ,  Richard Benton Booth ,  Steven Paul Ostrander ,  Emanuel I. Cooper ,  Carlos J. Sambucetti

IPC分类号： H01B104

CPC分类号： H01L24/81 ,  H01B1/22 ,  H01L23/49883 ,  H01L2224/13009 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/321 ,  H05K3/4614 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2203/0783

摘要： An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.

摘要翻译： 公开了一种包括热塑性聚合物，导电金属粉末和有机溶剂系统的导电浆料。 本发明还包括一种包含上述热塑性和金属的导电复合材料，其中基于复合材料的总体积，金属占体积的至少约30体积％。 复合材料由高温下的糊料形成。 该糊剂用于涉及将糊料转化为复合材料的工艺条件下的电气和电子部件电连接的工艺。

公开(公告)号：US6015509A

公开(公告)日：2000-01-18

申请号：US928495

申请日：1997-09-12

申请人： Marie Angelopoulos ,  Vlasta A. Brusic ,  Teresita Ordonez Graham ,  Sampath Purushothaman ,  Ravi F. Saraf ,  Jane Margaret Shaw ,  Judith Marie Roldan ,  Alfred Viehbeck

发明人： Marie Angelopoulos ,  Vlasta A. Brusic ,  Teresita Ordonez Graham ,  Sampath Purushothaman ,  Ravi F. Saraf ,  Jane Margaret Shaw ,  Judith Marie Roldan ,  Alfred Viehbeck

IPC分类号： C08G61/12 ,  C08L33/00 ,  C08L65/00 ,  C09D5/08 ,  C09D5/24 ,  C09J9/02 ,  H01B1/12 ,  H01B1/22 ,  H01B1/24 ,  H05K3/32 ,  H05K9/00 ,  H01B1/06

CPC分类号： H05K9/0083 ,  C08G61/12 ,  C08L65/00 ,  C09D5/08 ,  C09D5/24 ,  C09J9/02 ,  H01B1/125 ,  H01B1/127 ,  H01B1/128 ,  H01B1/22 ,  H01B1/24 ,  H05K3/321 ,  H05K9/0079 ,  H05K9/0088 ,  C08L33/00 ,  H05K2201/0329 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/31529 ,  Y10T428/31533 ,  Y10T428/31605 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31855

摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.

摘要翻译： 提供含有聚合物基质和导电填料组分的组合物。 导电填料组分包括导电颗粒和选自取代和未取代的聚苯胺，取代和未取代的聚对亚苯基亚乙烯基，取代和未取代的聚噻吩，取代和未取代的聚吡嗪，取代和未取代的聚对苯二甲酸，取代和未取代的聚呋喃，取代和未取代的聚吡咯 取代和未取代的聚硒吩，取代和未取代的聚对苯硫醚和取代和未取代的聚乙炔及其混合物，及其共聚物。 本发明的组合物可用作金属基材的防腐层，用于静电放电保护，电磁干扰屏蔽，以及作为焊接互连替代物的互连技术的粘合剂。 此外，聚苯胺的膜可用作具有或不具有导电金属颗粒的防腐蚀层。

公开(公告)号：US6005292A

公开(公告)日：1999-12-21

申请号：US135415

申请日：1998-08-14

申请人： Judith Marie Roldan ,  Ravi F. Saraf

发明人： Judith Marie Roldan ,  Ravi F. Saraf

IPC分类号： H01L21/60 ,  H01L23/485 ,  H05K3/32 ,  H01L23/538

CPC分类号： H05K3/321 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/11 ,  H01L2224/11505 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K2201/0129 ,  H05K2201/0379 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2203/0783 ,  H05K2203/176

摘要： An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles based on the total volume of the metal particles and the thermoplastic polymer. The present invention is also directed to a method of making electrical interconnections to an electronic device by pressing a plurality of composite bumps of a polymeric based material against a substrate having an electrically conductive surface by mechanical means under a sufficient temperature and/or a sufficient pressure. The present invention is further directed to a method of debonding an electronic device bonded by a composite binder by first providing an electronic device that is bonded by composite bumps consists of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles and then exposing the composite bumps to a solvent or to a temperature not less than about 50%.degree. C. below the glass transition temperature of the composite bump.

公开(公告)号：US5985458A

公开(公告)日：1999-11-16

申请号：US928464

申请日：1997-09-12

申请人： Marie Angelopoulos ,  Vlasta A. Brusic ,  Teresita Ordonez Graham ,  Sampath Purushothaman ,  Ravi F. Saraf ,  Jane Margaret Shaw ,  Judith Marie Roldan ,  Alfred Viehbeck

发明人： Marie Angelopoulos ,  Vlasta A. Brusic ,  Teresita Ordonez Graham ,  Sampath Purushothaman ,  Ravi F. Saraf ,  Jane Margaret Shaw ,  Judith Marie Roldan ,  Alfred Viehbeck

IPC分类号： C08G61/12 ,  C08L33/00 ,  C08L65/00 ,  C09D5/08 ,  C09D5/24 ,  C09J9/02 ,  H01B1/12 ,  H01B1/22 ,  H01B1/24 ,  H05K3/32 ,  H05K9/00 ,  B32B15/08

CPC分类号： H05K9/0083 ,  C08G61/12 ,  C08L65/00 ,  C09D5/08 ,  C09D5/24 ,  C09J9/02 ,  H01B1/125 ,  H01B1/127 ,  H01B1/128 ,  H01B1/22 ,  H01B1/24 ,  H05K3/321 ,  H05K9/0079 ,  H05K9/0088 ,  C08L33/00 ,  H05K2201/0329 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/31529 ,  Y10T428/31533 ,  Y10T428/31605 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31855

摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substiututed and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.

摘要翻译： 提供含有聚合物基质和导电填料组分的组合物。 导电填料组分包括导电颗粒和选自取代和未取代的聚苯胺，取代和未取代的聚对亚苯基亚乙烯基，取代和未取代的聚噻吩，取代和未取代的聚吡嗪，取代和未取代的聚对苯二甲酸，取代和未取代的聚呋喃，取代和未取代的聚吡咯 取代和未取代的聚硒吩，取代和未取代的聚对苯硫醚和取代和未取代的聚乙炔，及其混合物，及其共聚物。 本发明的组合物可用作金属基材的防腐层，用于静电放电保护，电磁干扰屏蔽，以及作为焊接互连替代物的互连技术的粘合剂。 此外，聚苯胺的膜可用作具有或不具有导电金属颗粒的防腐蚀层。

公开(公告)号：US06099939A

公开(公告)日：2000-08-08

申请号：US921453

申请日：1997-08-25

申请人： Kashmiri L. Mittal ,  Judith Marie Roldan ,  Carlos Juan Sambucetti ,  Ravi F. Saraf

发明人： Kashmiri L. Mittal ,  Judith Marie Roldan ,  Carlos Juan Sambucetti ,  Ravi F. Saraf

IPC分类号： C23C14/02 ,  H01L21/48 ,  H01L21/768 ,  H05K3/38 ,  B32B15/08

CPC分类号： C23C14/024 ,  H01L21/4864 ,  H05K3/381 ,  Y10T428/24355 ,  Y10T428/24521 ,  Y10T428/31678 ,  Y10T428/31681

摘要： Enhanced adhesion between a vapor deposited metal and an organic polymer surface is achieved without utilizing any intermediate surface preparatory steps. The morphology of the polymer surface is tailored to produce mounds and dimples on the surface which leads to a mechanically tougher, interdigitated metal/polymer interface. In the preferred embodiment, a solution of a solvent or solvent system and two or more polymer precursors or polymers or combinations thereof are cast in a film on a substrate and heated to spontaneously form a rough surface due to phase separation. The surface topography of such a film consists of characteristic mounds and dimples depending upon the composition of the solution. Direct metal vapor deposition onto the roughened surface results in an enhanced adhesion of the metal to the organic polymer surface. The organic polymer surface or substrate may be, but need not be, attached to yet another underlying substrate such as a ceramic (e.g., a silicon semiconductor chip), plastic or metal.

摘要翻译： 实现气相沉积金属与有机聚合物表面之间的增强粘附，而不用任何中间表面的准备步骤。 聚合物表面的形态被定制以在表面上产生墩和凹坑，这导致机械上更坚韧，交错的金属/聚合物界面。 在优选的实施方案中，将溶剂或溶剂体系和两种或更多种聚合物前体或聚合物或其组合的溶液浇铸在基材上的膜中，并由于相分离而加热以自发形成粗糙表面。 根据溶液的组成，这种薄膜的表面形貌由特征土丘和凹坑构成。 在粗糙化表面上的直接金属气相沉积导致金属对有机聚合物表面的附着力增强。 有机聚合物表面或衬底可以是但不必须附着到另一个下面的衬底，例如陶瓷（例如，硅半导体芯片），塑料或金属。

公开(公告)号：US5897336A

公开(公告)日：1999-04-27

申请号：US864196

申请日：1997-05-28

申请人： Guy Paul Brouillette ,  David Hirsch Danovitch ,  Michael Liehr ,  William Thomas Motsiff ,  Judith Marie Roldan ,  Carlos Juan Sambucetti ,  Ravi F. Saraf

发明人： Guy Paul Brouillette ,  David Hirsch Danovitch ,  Michael Liehr ,  William Thomas Motsiff ,  Judith Marie Roldan ,  Carlos Juan Sambucetti ,  Ravi F. Saraf

IPC分类号： H01L21/60 ,  H01L23/556 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34 ,  H01L21/44

CPC分类号： H01L24/83 ,  H01L23/556 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/244 ,  H05K3/321

摘要： An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.

摘要翻译： 具有用于电子设备的低α粒子发射特性的互连系统包括半导体芯片，该半导体芯片具有位于上表面的导电区域上的上表面和间隔开的电阻凸起，电阻凸起由复合材料制成 的聚合物和金属颗粒，以及在接合工艺中具有与电阻凸块接合的导电区域的基板，其中在粘合工艺之后电阻凸块转换为导电凸块。