公开(公告)号：US20090262276A1

公开(公告)日：2009-10-22

申请号：US12406882

申请日：2009-03-18

申请人： Wee-Joon JEONG ,  Tae-Hyung KIM ,  Ki-Hong SONG ,  Young-Suk HA ,  Jin-Woo PARK ,  Min-Soo CHOI

发明人： Wee-Joon JEONG ,  Tae-Hyung KIM ,  Ki-Hong SONG ,  Young-Suk HA ,  Jin-Woo PARK ,  Min-Soo CHOI

IPC分类号： G02F1/1333

CPC分类号： G02B6/0085 ,  G02B6/0068 ,  G02B6/0086 ,  G02F1/13318 ,  G02F1/133603 ,  G02F1/133609 ,  G02F1/133611 ,  G02F1/133615 ,  G02F2001/133314 ,  G02F2001/133628 ,  G02F2201/46 ,  G02F2201/58

摘要： A liquid crystal display (“LCD”) includes; a lower receiving container which includes; a bottom plate, sidewalls extending from the bottom plate, a first through-hole formed in the bottom plate, and a guide pole disposed on the bottom plate and which substantially surrounds the first through-hole, a plurality of light sources disposed within the lower receiving container; an optical sensor printed circuit board (“PCB”) attached to a bottom surface of the bottom plate, wherein the optical sensor printed circuit board covers the first through-hole, and an optical sensor mounted on the optical sensor PCB and inserted into the first through-hole.

摘要翻译： 液晶显示器（“LCD”）包括： 下部容纳容器包括： 底板，从底板延伸的侧壁，形成在底板中的第一通孔，以及设置在底板上并基本上围绕第一通孔的导柱，设置在下底板内的多个光源 接收容器 附接到底板底面的光学传感器印刷电路板（“PCB”），其中光学传感器印刷电路板覆盖第一通孔，以及安装在光学传感器PCB上并插入到第一通孔中的光学传感器 通孔。

公开(公告)号：US20140284565A1

公开(公告)日：2014-09-25

申请号：US13963278

申请日：2013-08-09

申请人： Jin-Woo PARK ,  Myung-Jong JUNG ,  Sung-Woo CHO ,  Hyung-Tag LIM

发明人： Jin-Woo PARK ,  Myung-Jong JUNG ,  Sung-Woo CHO ,  Hyung-Tag LIM

IPC分类号： H01L51/50 ,  H01L51/56

CPC分类号： H01L51/504 ,  H01L27/3211 ,  H01L51/0013 ,  H01L51/5012 ,  H01L51/56

摘要： An OLED display and associated methods, including a substrate; a first electrode; a second electrode; and an organic emission layer between the first and second electrodes, the organic emission layer including first-third organic emission layers, wherein the third organic emission layer is commonly disposed on the first electrode in the first-third subpixels, the first organic emission layer is in the first subpixel, the second organic emission layer is on the third organic emission layer in the first to third subpixels, an intermediate layer is between the first organic emission layer and the third organic emission layer in the first subpixel and between the second organic emission layer and the third organic emission layer in the second subpixel, and a HTL is between the first organic emission layer and the intermediate layer in the first subpixel and between the second organic emission layer and the intermediate layer in the second subpixel.

摘要翻译： OLED显示器及相关方法，包括基板; 第一电极; 第二电极; 以及所述第一和第二电极之间的有机发光层，所述有机发光层包括第三有机发光层，其中所述第三有机发光层通常设置在所述第一三分之一子像素中的所述第一电极上，所述第一有机发光层为 在第一子像素中，第二有机发光层位于第一至第三子像素中的第三有机发光层上，中间层位于第一子像素中的第一有机发光层与第三有机发光层之间，第二有机发光 层和第二子像素中的第三有机发光层，HTL位于第一子像素中的第一有机发光层与中间层之间，第二子像素中的第二有机发光层与中间层之间。

公开(公告)号：US20120161088A1

公开(公告)日：2012-06-28

申请号：US13217581

申请日：2011-08-25

申请人： Jung-Sik CHOI ,  Chang-Min LEE ,  Jin-Woo PARK ,  Kyung-Won AHN ,  Myung-Ho CHO

发明人： Jung-Sik CHOI ,  Chang-Min LEE ,  Jin-Woo PARK ,  Kyung-Won AHN ,  Myung-Ho CHO

IPC分类号： G02B5/23 ,  G03F7/032

CPC分类号： G03F7/0007 ,  G02B5/201 ,  G03F7/027 ,  G03F7/032 ,  G03F7/0388

摘要： Disclosed is a photosensitive resin composition including (A) a photopolymerizable monomer including a compound represented by the following Chemical Formula 1, wherein the substituents of Chemical Formula 1 are the same as defined in the specification, (B) a binder resin, (C) a photopolymerization initiator, (D) a pigment and (E) a solvent, and a color filter using the same.

摘要翻译： 公开了包含（A）包含由以下化学式1表示的化合物的光聚合性单体的光敏树脂组合物，其中化学式1的取代基与说明书中所定义的相同，（B）粘合剂树脂，（C） 光聚合引发剂，（D）颜料和（E）溶剂，以及使用其的滤色器。

公开(公告)号：US20110215444A1

公开(公告)日：2011-09-08

申请号：US13042855

申请日：2011-03-08

申请人： Jin-Woo PARK ,  Hwan-Sik Lim ,  Eunchul Ahn

发明人： Jin-Woo PARK ,  Hwan-Sik Lim ,  Eunchul Ahn

IPC分类号： H01L23/58 ,  H01L23/48

CPC分类号： H01L21/50 ,  H01L21/563 ,  H01L23/48 ,  H01L23/58 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2924/00012

摘要： A package substrate, a semiconductor package having the same, and a method for fabricating the semiconductor package. The semiconductor package includes a semiconductor chip, a package substrate, and a molding layer. The package substrate provides a region mounted with the semiconductor chip. The molding layer is configured to mold the semiconductor chip. The package substrate includes a first opening portion that provides an open region connected electrically to the semiconductor chip and extends beyond sides of the semiconductor chip to be electrically connected to the semiconductor chip.

摘要翻译： 封装基板，具有该封装基板的半导体封装以及半导体封装的制造方法。 半导体封装包括半导体芯片，封装基板和模制层。 封装衬底提供安装有半导体芯片的区域。 模制层被配置成模制半导体芯片。 封装基板包括第一开口部分，该第一开口部分提供与半导体芯片电连接的开放区域，并且延伸超过半导体芯片的两侧以与半导体芯片电连接。

公开(公告)号：US20110080357A1

公开(公告)日：2011-04-07

申请号：US12834102

申请日：2010-07-12

申请人： Jin-Woo PARK ,  Sang-Uk Kim ,  Hee-Chul Hwang ,  My-Kyung Jeon ,  Hideo Yoshimura

发明人： Jin-Woo PARK ,  Sang-Uk Kim ,  Hee-Chul Hwang ,  My-Kyung Jeon ,  Hideo Yoshimura

IPC分类号： G06F3/041

CPC分类号： G06F3/0412 ,  G02F1/13338 ,  G02F1/133514 ,  G02F2001/13312 ,  G02F2001/136222 ,  G06F3/044

摘要： A liquid crystal display (LCD) with a built-in touch screen includes: a first substrate including a pixel area having a plurality of pixels and a sensor area having a plurality of photosensors; a second substrate positioned over the first substrate, and including a color filter, a light receiving portion, a transparent electrode layer, and a front polarizing plate; an LCD panel including a liquid crystal layer interposed between the first and second substrates; and a touch screen driver circuit to sense a capacitance variation provided through a first sensing line connected to the transparent electrode layer when an object is in contact with the LCD panel, and to output position information of the object, sensed by using optical information sensed through a second sensing line connected the plurality of photosensors when the capacitance variation is greater than or equal to a predetermined threshold value.

摘要翻译： 具有内置触摸屏的液晶显示器（LCD）包括：第一基板，包括具有多个像素的像素区域和具有多个光电传感器的传感器区域; 位于第一基板上的第二基板，包括滤色器，受光部，透明电极层和前偏振片; 液晶显示面板，包括插入在第一和第二基板之间的液晶层; 以及触摸屏驱动器电路，用于感测当物体与LCD面板接触时通过连接到透明电极层的第一感测线提供的电容变化，并且输出通过使用通过以下方式感测的光学信息感测的物体的位置信息 当电容变化大于或等于预定阈值时，连接多个光电传感器的第二传感线。

公开(公告)号：US20090149016A1

公开(公告)日：2009-06-11

申请号：US12330416

申请日：2008-12-08

申请人： Jin-Woo PARK ,  Tae-Joo HWANG ,  Nam-Seog KIM

发明人： Jin-Woo PARK ,  Tae-Joo HWANG ,  Nam-Seog KIM

IPC分类号： H01L21/768

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/10126 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/13565 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014

摘要： Provided is a semiconductor device and a method of fabricating the same. The method of fabricating the semiconductor device includes forming a mask pattern having an opening corresponding to an electrode pad formed on a semiconductor substrate; forming a bump by filling the opening with a conductive first material; forming a sidewall film on sidewalls of the bump using a second material; forming a connection member between an upper surface of the bump and a wire substrate using a conductive third material in order to electrically connect the bump and the wire substrate; and forming an underfill resin between the wire substrate and the semiconductor substrate, wherein a wetting angle between the second material and the third material is greater than that between the first material and the third material.

摘要翻译： 提供一种半导体器件及其制造方法。 制造半导体器件的方法包括形成具有对应于形成在半导体衬底上的电极焊盘的开口的掩模图案; 通过用导电的第一材料填充开口形成凸起; 使用第二材料在所述凸块的侧壁上形成侧壁膜; 在所述突起的上表面和使用导电的第三材料的金属基底之间形成连接构件，以便电连接所述凸块和所述金属丝基底; 以及在所述金属丝衬底和所述半导体衬底之间形成底部填充树脂，其中所述第二材料和所述第三材料之间的润湿角度大于所述第一材料和所述第三材料之间的润湿角度。

公开(公告)号：US20110242021A1

公开(公告)日：2011-10-06

申请号：US12949874

申请日：2010-11-19

申请人： Woo-Sik JUN ,  Jin-Woo PARK ,  Won-Kyu KWAK ,  Won-Woong JUNG ,  Dae-Hyun KIM ,  Tae-Hun KIM ,  Jae-Sun LEE ,  Ung-Soo LEE ,  Ryan CHOI ,  Kevin HEO

发明人： Woo-Sik JUN ,  Jin-Woo PARK ,  Won-Kyu KWAK ,  Won-Woong JUNG ,  Dae-Hyun KIM ,  Tae-Hun KIM ,  Jae-Sun LEE ,  Ung-Soo LEE ,  Ryan CHOI ,  Kevin HEO

IPC分类号： G06F3/041 ,  B05D5/12

CPC分类号： G06F3/044 ,  G02F1/13338 ,  G06F2203/04103 ,  G06F2203/04111

摘要： A structure for forming a touch screen panel directly on an upper substrate of a flat panel display device, and more particularly a touch screen panel integrated flat panel display device in which an insulating layer formed on the touch screen panel is implemented by a spin on glass (SOG layer having stable thermal property suitable for high temperature plastic process of a sealing material for encapsulating the upper substrate and a lower substrate of the flat panel display device, and a method of fabricating the same.

摘要翻译： 一种直接在平板显示装置的上基板上形成触摸屏面板的结构，更具体地说是一种触摸屏面板集成平板显示装置，其中形成在触摸屏面板上的绝缘层通过旋转玻璃 （适用于封装上基板的密封材料和平板显示装置的下基板的高温塑性加工的具有稳定的热性质的SOG层及其制造方法。

公开(公告)号：US20110072842A1

公开(公告)日：2011-03-31

申请号：US12724618

申请日：2010-03-16

申请人： Jin-Woo PARK

发明人： Jin-Woo PARK

IPC分类号： F25D27/00 ,  F25C1/00

CPC分类号： F25D27/00 ,  F25C5/22 ,  F25C2400/10 ,  F25D2327/001

摘要： Disclosed are a refrigerator and a lighting device therefor. Since an optical source, an LED is installed at a height to overlap a guide member, light emitted from the LED is widely dispersed through the guide member. This may allow a user to easily check a discharged degree of ice cubes or water, and to have sophisticated aesthetic feeling. Furthermore, since the optical source is fixed to an optical source accommodation portion by being encompassed thereby, a water leakage prevention function may be enhanced, and an additional coupling member for coupling the optical source may not be required. This may allow the number of components and assembly processes to be decreased, and the production costs to be reduced.

摘要翻译： 公开了一种冰箱及其照明装置。 由于光源，LED被安装在与引导构件重叠的高度处，所以从LED发射的光被引导构件广泛分散。 这可以允许用户容易地检查冰块或水的排出程度，并具有复杂的美学感觉。 此外，由于光源通过被包围而被固定到光源容纳部分，所以可以增强防漏水功能，并且可以不需要用于耦合光源的附加耦合部件。 这可能会减少组件和组装过程的数量，并降低生产成本。

公开(公告)号：US20150235939A1

公开(公告)日：2015-08-20

申请号：US14588506

申请日：2015-01-02

申请人： Sunyeong LEE ,  Kyoung-Hoon KIM ,  Jin-Woo PARK ,  SeungWoo PAEK ,  Seok-won LEE ,  Taekeun CHO

发明人： Sunyeong LEE ,  Kyoung-Hoon KIM ,  Jin-Woo PARK ,  SeungWoo PAEK ,  Seok-won LEE ,  Taekeun CHO

IPC分类号： H01L23/528 ,  H01L27/115

CPC分类号： H01L27/11582 ,  H01L27/11519 ,  H01L27/11526 ,  H01L27/11548 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11565 ,  H01L27/11573 ,  H01L27/11575 ,  H01L27/11578 ,  H01L2224/32145

摘要： Three-dimensional (3D) semiconductor devices are provided. The 3D semiconductor device includes a plurality of dummy pillars penetrating each cell pad of an electrode structure and the electrode structure disposed under each cell pad. Insulating patterns of a mold stack structure for formation of the electrode structure may be supported by the plurality of dummy pillars, so transformation and contact of the insulating patterns may be minimized or prevented.

摘要翻译： 提供三维（3D）半导体器件。 3D半导体器件包括穿过电极结构的每个电池衬垫的多个虚拟柱和设置在每个电池衬垫下方的电极结构。 用于形成电极结构的模具堆叠结构的绝缘图案可以由多个虚拟支柱支撑，因此可以最小化或防止绝缘图案的变形和接触。

公开(公告)号：US20150123289A1

公开(公告)日：2015-05-07

申请号：US14463854

申请日：2014-08-20

申请人： Jin-Woo PARK

发明人： Jin-Woo PARK

IPC分类号： H01L23/00 ,  H01L23/538 ,  H01L23/12

CPC分类号： H01L24/49 ,  H01L23/13 ,  H01L23/145 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/10 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2924/20757 ,  H01L2924/20756 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2224/05599 ,  H01L2924/014

摘要： Provided is a semiconductor package, the semiconductor package includes a first substrate, a first semiconductor chip which is mounted on the first substrate, a second substrate which is disposed on the first semiconductor chip, at least one second semiconductor chip which is disposed on the second substrate; and a plurality of wires which are in contact with the first substrate and the second substrate to connect the first substrate and the second substrate to each other.

摘要翻译： 提供一种半导体封装，该半导体封装包括第一衬底，安装在第一衬底上的第一半导体芯片，设置在第一半导体芯片上的第二衬底，设置在第二衬底上的至少一个第二半导体芯片 基质; 以及与第一基板和第二基板接触以将第一基板和第二基板彼此连接的多根电线。