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25 条记录 (耗时 0.033 秒)

    Rocking chair
    5.
    发明授权
    Rocking chair 失效
    摇椅

    公开(公告)号：US5558397A

    公开(公告)日：1996-09-24

    申请号：US467636

    申请日：1995-06-06

    申请人： Chih-Huang Chang

    发明人： Chih-Huang Chang

    IPC分类号： A47C3/02 ,  A47D13/10

    CPC分类号： A47C3/0255

    摘要： A rocking chair including a chair body having two parallel stands supported on a base by a linking mechanism, the base including two upright frames and four stretchers connected between the upright frames, the linking mechanism including two symmetrical pairs of links and two stretchers connected between the links, each link having one end pivoted to one stand on the chair body and an opposite end pivoted to one upright-frame of the base, wherein the stretchers of the linking mechanism and base each has two metal female screws embedded at two opposite ends and fixed in place by a respective locating pin and connected to a respective through hole on the upright frames of the base or on the links by a respective screw bolt so that the base and the linking mechanism are detachable.

    摘要翻译： 一种摇椅，包括具有两个平行架的椅子主体，所述座椅通过连接机构支撑在基座上，所述底座包括两个直立框架和连接在直立框架之间的四个伸展臂，所述连接机构包括两对对称的连杆和两个连接在 连杆，每个连杆的一端枢转到椅子主体上的一个支架，另一端枢转到基座的一个直立框架，其中连接机构和底座的伸缩臂各自具有嵌入在两个相对端的两个金属内螺纹， 通过相应的定位销固定到位，并通过相应的螺栓连接到基座的直立框架上或链节上的相应的通孔，使得基座和连接机构是可拆卸的。

    Electric fan structure
    6.
    发明申请
    Electric fan structure 审中-公开
    电风扇结构

    公开(公告)号：US20090068010A1

    公开(公告)日：2009-03-12

    申请号：US11898196

    申请日：2007-09-10

    申请人： Chih-Huang Chang ,  Shen-Yuan Chen

    发明人： Chih-Huang Chang ,  Shen-Yuan Chen

    IPC分类号： F01D25/24

    CPC分类号： F04D25/08 ,  F04D25/10

    摘要： The present invention provides an improved electric fan structure, in which an electric fan is structured from an air converging vent; a main body and a base. The air converging vent comprises a plurality of guide strips, which are used to concentrate the air at an upper portion of the main body, and the bevel angled guide strips guide the air draft into the main body. The air is made to form a powerful vortex by means of a pass through type wind wheel formed as an integrated body in conjunction with a drive device causing the wind wheel to rotate, after which an induced draft plate covering a periphery of the wind wheel sends the air to an air outlet, where the air is blow out, thereby achieving functionality to realize optimum air volume output, and, at the same time, reduce noise when the electric fan is rotating.

    摘要翻译： 本发明提供了一种改进的电风扇结构，其中电风扇由空气会聚排气口构成; 一个主体和一个基地。 空气会聚通风口包括多个导向条，其用于将空气集中在主体的上部，并且斜面成角度的引导条引导空气进入主体。 空气通过与驱动装置结合形成为整体的通过式风轮形成强大的涡流，使得风轮旋转，之后，覆盖风轮周边的感应通风板发送 空气到空气出口，空气吹出，从而实现最佳风量输出的功能，同时在电风扇转动时减少噪音。

    Multi-chips module assembly package
    8.
    发明授权
    Multi-chips module assembly package 有权
    多芯片模块组装包装

    公开(公告)号：US07015571B2

    公开(公告)日：2006-03-21

    申请号：US10704793

    申请日：2003-11-12

    申请人： Chih-Huang Chang ,  Shih-Chang Lee

    发明人： Chih-Huang Chang ,  Shih-Chang Lee

    IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H05K1/144 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/045 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2201/10378

    摘要： A multi-chips module assembly package mainly comprises a first package, a second package and an intermediate substrate. The intermediate substrate includes an opening, at least a via and a plurality of circuit layers, wherein the second package is accommodated in the opening. The via has an inner wall, and a plurality of separated electrically conductive layers, which is formed on the inner wall and connected with the corresponding circuit layers. The first package electrically connects with the second package through the intermediate substrate, and the intermediate substrate is interposed between the first package and the second package. At least an insulator is formed in the via, and the separated electrically conductive layers are separated from each other. After the intermediate substrate is interposed between the first package and the second package, there will be not enough space between the intermediate substrate, the first package and the second package for disposing conductive devices therein. Therefore, the first package will be electrically connected to the second package through the separated electrically conductive layers of the intermediate substrate for providing more conductive devices disposed and interposed between the intermediate substrate, the first package and the second package.

    摘要翻译： 多芯片模块组装封装主要包括第一封装，第二封装和中间基板。 中间基板包括开口，至少通孔和多个电路层，其中第二封装容纳在开口中。 通孔具有内壁和多个分离的导电层，其形成在内壁上并与相应的电路层连接。 第一包装通过中间基板与第二包装电连接，并且中间基板插入在第一包装和第二包装之间。 至少在通孔中形成绝缘体，并且分离的导电层彼此分离。 在中间基板插入在第一封装和第二封装之间之后，中间基板，第一封装和第二封装之间将没有足够的空间用于在其中设置导电器件。 因此，第一封装将通过中间衬底的分离的导电层电连接到第二封装，用于提供设置和介于中间衬底，第一封装和第二封装之间的更多导电器件。