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公开(公告)号：US20060073383A1
公开(公告)日：2006-04-06
申请号：US11194058
申请日：2005-07-28
CPC分类号： H01M10/4257 , B32B7/12 , B32B15/085 , B32B15/09 , B32B15/18 , B32B27/08 , B32B27/18 , B32B27/32 , B32B27/36 , B32B2264/0207 , B32B2307/558 , B32B2307/734 , B32B2439/46 , B32B2457/10 , B32B2553/02 , H01M2/0207 , H01M2/0275 , H01M2/0277 , H01M2/0285 , H01M2/0287 , H01M2/0295 , H01M10/0525 , H01M10/0565 , Y10T428/31692 , Y10T428/31797
摘要： A battery sheath having enough mechanical strength to stably protect a battery from external impact is provided. The battery sheath also has reduced thickness, thereby increasing battery capacity. In addition, the battery sheath suppresses swelling, thereby preventing battery deformation. The battery sheath includes a base layer having a first surface and a second surface opposite the first surface. A first adhesive is applied to the first surface of the base layer to a predetermined thickness. A CPP layer is applied to the first adhesive to a predetermined thickness. A PET layer is laminated at high temperature on the second surface of the base layer to a predetermined thickness.
摘要翻译： 提供了具有足够的机械强度以稳定地保护电池免受外部冲击的电池护套。 电池护套也具有减小的厚度，从而增加电池容量。 此外，电池护套抑制膨胀，防止电池变形。 电池护套包括具有第一表面和与第一表面相对的第二表面的基底层。 将第一粘合剂施加到基层的第一表面至预定厚度。 将CPP层施加到第一粘合剂到预定厚度。 PET层在基层的第二表面上以高温层压到预定厚度。
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公开(公告)号：US20070072330A1
公开(公告)日：2007-03-29
申请号：US10548134
申请日：2004-03-05
申请人： Dan Popa , Byoung Kang , Jian-Qiang Lu , Taejoo Hwang , Eric Leonard , Harry Stephanou
发明人： Dan Popa , Byoung Kang , Jian-Qiang Lu , Taejoo Hwang , Eric Leonard , Harry Stephanou
IPC分类号： H01L21/00
CPC分类号： H01L21/00 , B81B2201/058 , B81C3/001
摘要： A method for forming a microstructure is disclosed in which, after a polymer substance has been applied to a first substrate, the first substrate is micromachined to remove at least one portion of the first substrate. A second substrate is then adhered to the first substrate via the polymer substance. One application of such a method is in the fabrication of three-dimensional microfluidics. The polymer substance may, for example, be benzocyclobutene (BCB), and the first substrate may, for example, be a silicon wafer or a photo-etchable glass.
摘要翻译： 公开了一种用于形成微结构的方法，其中在将聚合物物质施加到第一基底之后，第一基底被微加工以去除第一基底的至少一部分。 然后通过聚合物物质将第二衬底粘附到第一衬底。 这种方法的一个应用是制造三维微流体。 聚合物物质可以是例如苯并环丁烯（BCB），第一基质可以是例如硅晶片或光刻蚀玻璃。
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公开(公告)号：US20060126956A1
公开(公告)日：2006-06-15
申请号：US11300759
申请日：2005-12-14
申请人： Jin Lee , Min Kim , Byoung Kang
发明人： Jin Lee , Min Kim , Byoung Kang
IPC分类号： G06K9/46
CPC分类号： H04N19/20
摘要： A method of coding/decoding an image is provided. The coding method includes comparing a previous image and a current image of successive images to divide a background region from an object region including an object of the previous image and an object of the current image, coding the object region, and creating data indicating whether the above coding operation is intended for the entire image or the object region and adding the created data to coded data.
摘要翻译： 提供了一种对图像进行编码/解码的方法。 编码方法包括比较先前图像和连续图像的当前图像，以从包括先前图像的对象和当前图像的对象的对象区域划分背景区域，对目标区域进行编码，以及创建指示是否 上述编码操作用于整个图像或对象区域，并将创建的数据添加到编码数据。
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公开(公告)号：US20060126951A1
公开(公告)日：2006-06-15
申请号：US11304391
申请日：2005-12-14
申请人： Jin Lee , Min Kim , Byoung Kang
发明人： Jin Lee , Min Kim , Byoung Kang
IPC分类号： G06K9/36
CPC分类号： H04N1/646
摘要： A method of coding/decoding a still picture is provided. The coding method includes transforming color components of image data based on a first color space into components on a first color space using an integer-integer color transform, and constructing frames for the transformed components on the second color space and coding image data of the frames. In the decoding method, the coded image data are transformed form the second color space to the fist color space and a dictionary-based decoding operation is performed.
摘要翻译： 提供了一种对静止图像进行编码/解码的方法。 编码方法包括使用整数整数颜色变换将基于第一颜色空间的图像数据的颜色分量变换为第一颜色空间上的分量，并且对第二颜色空间上的变换分量构造帧，并对该帧的图像数据进行编码 。 在解码方法中，将编码图像数据从第二颜色空间变换为第一颜色空间，并执行基于字典的解码操作。
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公开(公告)号：US20060094848A1
公开(公告)日：2006-05-04
申请号：US11311198
申请日：2005-12-19
申请人： Byoung Kang , Hyuk Moon , Jong Lee , Kyoung Wi , Tae Kim
发明人： Byoung Kang , Hyuk Moon , Jong Lee , Kyoung Wi , Tae Kim
CPC分类号： C08G59/306 , C08G59/3254 , C08G59/504 , C08L61/00 , C08L79/08 , C08L83/00 , C09J5/02 , C09J2400/123 , C09J2400/143 , C09J2400/163 , C09J2461/00 , C09J2479/00 , C09J2483/00 , H05K3/389
摘要： The present invention relates to silane adducts having a relatively higher adhesive strength as expressed formula X3SiR1, and manufacturing method thereof. wherein X is a hydrogenated form selected from one of epoxy compounds, amino compounds and bisphenolic, and R1 is selected from one of glycidyloxypropyl group, 2-(3,4-epoxycyclohexyl)ethyl group, 3-acryloxypropyl group, 3-methacryloxypropyl group, amino-propyl group, 3-[2-(2-aminoethylamino)ethylamino]propyl group, N-methylaminopropyl group, N-phenylaminopropyl group, N,N-dimethyl-3-aminopropyl group, mercapto-propyl group, cyano-propyl group, and isocyanato-propyl group.
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公开(公告)号：US20050104370A1
公开(公告)日：2005-05-19
申请号：US10788366
申请日：2004-03-01
申请人： Hyung Kim , In Jeon , Sung Hur , Chun Chol , Byoung Kang
发明人： Hyung Kim , In Jeon , Sung Hur , Chun Chol , Byoung Kang
CPC分类号： F16L47/32
摘要： A hose clamping assembly comprises a branched pipe having a plurality of projected stoppers thereon, each of the stoppers formed around an outer surface of each branch of the branched pipe and spaced apart a certain distance from each other, a hose connected to each branch of the branched pipe by sliding onto each of the branches, the hose contacting a nearest stopper from the end portion of the branch among the plurality of stoppers, a clamp formed on an outer surface of the hose and between the stoppers by a molding apparatus, a portion of the clamp on the outer surface of the hose connected to a portion of the clamp between the stoppers and an arm connecting the clamp to an adjacent clamp having a different axial direction, the arm formed by the molding apparatus.
摘要翻译： 软管夹紧组件包括分支管，其上具有多个突出的塞子，每个止动件形成在分支管的每个分支的外表面周围并彼此隔开一定距离，连接到 分支管通过滑动到每个分支上，软管接触来自多个止动件中的分支端部的最近的止动件，夹具形成在软管的外表面上，并通过模制装置形成在止动件之间，部分 所述夹具的外表面上的连接到所述夹持件的所述止动件的一部分之间的所述夹具，以及将所述夹具连接到具有不同轴向方向的相邻夹具的臂，所述臂由所述模制设备形成。
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公开(公告)号：US20060091488A1
公开(公告)日：2006-05-04
申请号：US11241044
申请日：2005-09-30
申请人： Byoung Kang
发明人： Byoung Kang
IPC分类号： H01L31/0203 , H01L21/00
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14632 , H01L27/14634 , H01L27/14687 , H01L31/0203 , H01L31/02161 , H01L31/0232 , H01L2224/32013 , H01L2224/45124 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , H01L2924/16195 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to an image sensor chip package and a method for fabricating the same. In one embodiment of an image sensor chip package, chip pads on a first surface of an image sensor chip are attached to electrode pads of a glass substrate with conductive material. In addition, electrode pads are connected to solder balls via a metal wiring pattern arranged on a second surface of the image sensor chip. As a result, the present invention can provide further miniaturized and thinned image sensor chip packages, reduce fabricating processes, and improve device performance and reliability.
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公开(公告)号：US20060046348A1
公开(公告)日：2006-03-02
申请号：US11026661
申请日：2004-12-29
申请人： Byoung Kang
发明人： Byoung Kang
IPC分类号： H01L21/50
CPC分类号： H01L24/10 , H01L23/3114 , H01L23/481 , H01L24/13 , H01L24/48 , H01L2224/05001 , H01L2224/05009 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05171 , H01L2224/0557 , H01L2224/05571 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05681 , H01L2224/05684 , H01L2224/05686 , H01L2224/13 , H01L2224/13099 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/013 , H01L2924/0105 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor chip packages of a wafer level and method for fabricating the same are disclosed, in which a wafer electrode pad is connected with an external circuit by a via-electrode penetrating a silicon wafer. An illustrated example package includes a wafer having a first surface and a second surface opposite the first surface; a semiconductor device having at least one of electrode pad on the first surface; a protective layer covering the first surface of the silicon wafer; a via-hole from the second surface to the electrode pad on the first surface, a via electrode within the via-hole; and a solder ball or a solder bump on the second surface for electrical connection between the via-electrode and an external circuit.
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公开(公告)号：US20050201460A1
公开(公告)日：2005-09-15
申请号：US11076363
申请日：2005-03-09
申请人： Byoung Kang , Ki Park , Doe Yoon
发明人： Byoung Kang , Ki Park , Doe Yoon
CPC分类号： H04N19/152 , H04N19/124 , H04N19/159 , H04N19/172 , H04N19/176
摘要： A method for controlling a bit rate of an image is provided. The method comprises analyzing a motion level of the inputted image; classifying the inputted image into a picture category according to the image's number of intra-blocks; and controlling the image's bit rate by allocating a first quantization parameter value to an input frame when the inputted image is classified as a motion picture.
摘要翻译： 提供了一种用于控制图像的比特率的方法。 该方法包括分析输入图像的运动水平; 根据图像的块内数量将输入的图像分类为图像类别; 以及当输入的图像被分类为运动图像时，通过向输入帧分配第一量化参数值来控制图像的比特率。
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公开(公告)号：US20060213251A1
公开(公告)日：2006-09-28
申请号：US11089311
申请日：2005-03-24
申请人： Andrew Rinzler , Jennifer Sippel-Oakley , Byoung Kang , Hung-Ta Wang , Fan Ren , Stephen Pearton
发明人： Andrew Rinzler , Jennifer Sippel-Oakley , Byoung Kang , Hung-Ta Wang , Fan Ren , Stephen Pearton
IPC分类号： G01N7/00
CPC分类号： G01N27/127 , G01N33/005
摘要： A multi-layer H2 sensor includes a carbon nanotube layer, and a ultra-thin metal or metal alloy layer in contact with the nanotube layer. The ultra-thin metal or metal alloy layer is preferably from 10 to 50 angstroms thick. An electrical resistance of the layered sensor increases upon exposure to H2 and can provide detection of hydrogen gas (H2) down to at least 10 ppm, The metal or metal alloy layer is preferably selected from the group consisting of Ni, Pd and Pt, or mixtures thereof. Multi-layered sensors and can be conveniently operated at room temperature.
摘要翻译： 多层H 2传感器包括碳纳米管层和与纳米管层接触的超薄金属或金属合金层。 超薄金属或金属合金层的厚度优选为10〜50埃。 层状传感器的电阻在暴露于H 2 2时增加，并且可以将氢气（H 2 O 2）的检测降低至至少10ppm。金属或金属合金 层优选选自Ni，Pd和Pt，或其混合物。 多层传感器，可方便地在室温下运行。
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