公开(公告)号：US20100147376A1

公开(公告)日：2010-06-17

申请号：US12633098

申请日：2009-12-08

申请人： Yoshihide Iwazaki ,  Kohji Miyata ,  Shohnosuke Ueno

发明人： Yoshihide Iwazaki ,  Kohji Miyata ,  Shohnosuke Ueno

IPC分类号： H01L31/0216 ,  H01L31/18

CPC分类号： H01L31/0236 ,  H01L31/048 ,  H02S10/40 ,  Y02E10/50

摘要： A solar battery device includes: a substrate; a plurality of solar cells on the substrate; and a surface protector on the solar cell, so as to protect a surface of the solar battery device. The surface protector has an incident surface to which light enters, and which is subjected to an anti-reflection process for preventing reflection of the light, thereby to improve power generation efficiency. The anti-reflection process for examples gives the surface protector a saw-tooth-like shape. The surface protector is made of a synthetic resin. In this way, the present invention provides a solar battery device in which reduction in the power generation efficiency due to the surface protector or the like on the surface thereof is prevented, and which has excellent transportability and applicability to portable devices.

摘要翻译： 太阳能电池装置包括：基板; 在基板上的多个太阳能电池; 以及太阳能电池上的表面保护器，以保护太阳能电池装置的表面。 表面保护器具有光入射的入射面，并且进行防反射处理以防止光的反射，从而提高发电效率。 实施例的防反射工艺给了表面保护器锯齿状的形状。 表面保护膜由合成树脂制成。 以这种方式，本发明提供了一种太阳能电池装置，其中防止了由于其表面上的表面保护器等导致的发电效率的降低，并且其具有优异的可移植性和对便携式装置的适用性。

公开(公告)号：US20100294342A1

公开(公告)日：2010-11-25

申请号：US12783859

申请日：2010-05-20

申请人： Hiroyuki Nakanishi ,  Kohji Miyata ,  Yoshihide Iwazaki ,  Seiji Ishihara ,  Masato Yokobayashi ,  Etsuko Ishizuka ,  Kiyoharu Shimano ,  Katsunobu Mori

发明人： Hiroyuki Nakanishi ,  Kohji Miyata ,  Yoshihide Iwazaki ,  Seiji Ishihara ,  Masato Yokobayashi ,  Etsuko Ishizuka ,  Kiyoharu Shimano ,  Katsunobu Mori

IPC分类号： H01L31/048 ,  H01L31/18

CPC分类号： H01L31/0508 ,  H01L31/0201 ,  H01L31/048 ,  H01L31/0504 ,  H01L31/0512 ,  Y02E10/50

摘要： A solar cell module 1 includes a plurality of solar cells 30. Each of the plurality of solar cells 30 is disposed on a corresponding one of a plurality of pad sections in such a manner that the each of the plurality of solar cells 30 is electrically connected to the corresponding one of the plurality of pad sections. The each of the plurality of solar cells 30 is electrically connected to a corresponding inner lead section 120. A cathode section 114 and an anode section 116 feed an electric current generated by the plurality of solar cells 30. A metal lead frame is provided such that the plurality of pad sections, the inner lead sections 120, the cathode section 114 and the anode section 116 are provided therein as a part of the lead frame itself. This configuration enables the solar cell module 1 to endure against bending stress and to be curved. As a result, it is possible to provide a solar cell module which can be disposed along a curved surface of an electronics device.

摘要翻译： 太阳能电池模块1包括多个太阳能电池30.多个太阳能电池30中的每一个以多个太阳能电池30中的每一个电连接的方式设置在多个焊盘部分中的相应的一个上 到多个垫部分中的对应的一个。 多个太阳能电池30中的每一个电连接到相应的内部引线部分120.阴极部分114和阳极部分116馈送由多个太阳能电池30产生的电流。金属引线框架设置成使得 多个焊盘部分，内部引线部分120，阴极部分114和阳极部分116作为引线框架本身的一部分设置在其中。 这种构造使得太阳能电池模块1能够耐受弯曲应力并弯曲。 结果，可以提供一种可以沿着电子设备的曲面布置的太阳能电池模块。

公开(公告)号：US20100101626A1

公开(公告)日：2010-04-29

申请号：US12603926

申请日：2009-10-22

申请人： Yoshihide Iwazaki ,  Hiroyuki Nakanishi ,  Kohji Miyata ,  Masahiro Okita ,  Hideya Takakura

发明人： Yoshihide Iwazaki ,  Hiroyuki Nakanishi ,  Kohji Miyata ,  Masahiro Okita ,  Hideya Takakura

IPC分类号： H02N6/00

CPC分类号： H04M19/08 ,  G03B17/02 ,  H01L31/02008 ,  H01L31/022433 ,  H01L31/0504 ,  Y02D70/122 ,  Y02D70/164 ,  Y02E10/50

摘要： A solar battery apparatus 10 has a plurality of solar battery cells 3 and electrode terminals 4, other than common electrode terminals, for making an electrical connection (i) between each of the solar battery cells 3 and another or (ii) between the solar battery cell 3 and an external apparatus, the solar battery apparatus 10 including: metal wires 5 for making an electrical connection between the solar battery cell 3 and the electrode terminals 4 in a plurality of places on the solar battery cell 3, whereby a decrease in power generation capacity of the solar battery cell 3 is prevented even if the solar battery cell 3 is ruptured by a physical force. This makes it possible to provide a solar battery apparatus in which a decrease in power generation capacity of a solar battery cell can be prevented even if the solar battery cell is ruptured by a physical force.

摘要翻译： 太阳能电池装置10具有多个太阳能电池单元3和除公共电极端子之外的电极端子4，用于在每个太阳能电池单元3与另一个之间进行电连接（i），或者（ii）太阳能电池 电池3和外部装置，太阳能电池装置10包括：用于在太阳能电池单元3的多个位置中在太阳能电池单元3和电极端子4之间进行电连接的金属线5，由此功率的降低 即使太阳能电池单元3被物理力破坏，太阳能电池单元3的发电能力也被防止。 这使得可以提供太阳能电池装置，其中即使太阳能电池单元被物理力破坏，也能够防止太阳能电池单元的发电量的降低。

公开(公告)号：US06838748B2

公开(公告)日：2005-01-04

申请号：US10434205

申请日：2003-05-09

申请人： Toshiya Ishio ,  Hiroyuki Nakanishi ,  Katsunobu Mori ,  Yoshihide Iwazaki ,  Shinji Suminoe

发明人： Toshiya Ishio ,  Hiroyuki Nakanishi ,  Katsunobu Mori ,  Yoshihide Iwazaki ,  Shinji Suminoe

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/552 ,  H01L29/06

CPC分类号： H01L23/552 ,  H01L23/3114 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip of the present invention is so arranged that a front face on which an element circuit is formed has electrode pads and a side face and a back face are coated with a shielding layer for shielding electromagnetic waves. With this, it is possible to provide a semiconductor element capable of being easily manufactured into a smaller semiconductor device compared with a conventional semiconductor device equipped with a shielding cap; a semiconductor device; and a method for manufacturing a semiconductor element.

摘要翻译： 本发明的半导体芯片被布置成使得其上形成有元件电路的正面具有电极焊盘，并且侧面和背面涂覆有用于屏蔽电磁波的屏蔽层。 由此，与配备有屏蔽盖的现有的半导体装置相比，可以提供能够容易地制造成较小的半导体装置的半导体元件; 半导体器件; 以及半导体元件的制造方法。

公开(公告)号：US06372080B1

公开(公告)日：2002-04-16

申请号：US08542576

申请日：1995-10-13

申请人： Hidekazu Matsuura ,  Yoshihide Iwazaki ,  Naoto Ohta

发明人： Hidekazu Matsuura ,  Yoshihide Iwazaki ,  Naoto Ohta

IPC分类号： C09J700

CPC分类号： H01L23/4951 ,  H01L23/49513 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part between the semiconductor chip and the lead frame with a sealant. The adhesive has a coming-out length of not more than 2 mm and a water absorption rate of not more than 3 wt. %. Preferably, the adhesive has a glass transition point of at least 200° C.

摘要翻译： 提供一种耐热粘合剂，用于制造半导体封装的粘合剂部件，其通过用粘合剂部件将半导体芯片接合到引线框架上，并且至少密封半导体芯片以及半导体芯片和半导体芯片之间的接合部分 引线框与密封剂。 粘合剂的出料长度不大于2mm，吸水率不超过3重量％。 ％。 优选地，粘合剂具有至少200℃的玻璃化转变点

公开(公告)号：US06248613B1

公开(公告)日：2001-06-19

申请号：US09468684

申请日：1999-12-21

申请人： Hidekazu Matsuura ,  Yoshihide Iwazaki ,  Naoto Ohta

发明人： Hidekazu Matsuura ,  Yoshihide Iwazaki ,  Naoto Ohta

IPC分类号： H01L2144

CPC分类号： H01L23/4951 ,  H01L23/49513 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/181 ,  Y10T428/2852 ,  Y10T428/2887 ,  Y10T428/2896 ,  Y10T428/31663 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part between the semiconductor chip and the lead frame with a sealant. The adhesive has a coming-out length of not more than 2 mm and a water absorption rate of not more than 3 wt. %. Preferably, the adhesive has a glass transition point of at least 200° C.

摘要翻译： 提供一种耐热粘合剂，用于制造半导体封装的粘合剂构件，其通过用粘合剂构件将半导体芯片接合到引线框架并且至少密封半导体芯片以及半导体芯片与第二半导体芯片之间的接合部分 引线框与密封剂。 粘合剂的出料长度不大于2mm，吸水率不超过3重量％。 ％。 优选地，粘合剂具有至少200℃的玻璃化转变点

公开(公告)号：US20080105555A1

公开(公告)日：2008-05-08

申请号：US11792812

申请日：2005-12-08

申请人： Yoshihide Iwazaki

发明人： Yoshihide Iwazaki

IPC分类号： C25D5/02 ,  C25D17/02 ,  C25D5/08 ,  C25D21/06

CPC分类号： H01L24/11 ,  C25D5/02 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/02 ,  C25D17/10 ,  C25D21/06 ,  H01L21/2885 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05647 ,  H01L2224/1148 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/00014 ,  H01L2924/013

摘要： An object of the present invention is to provide a face-down type jet plating device in which deterioration in plating quality due to minute solid foreign matters derived from a black film etc. is prevented without impairing operativity. The plating device is designed such that a partition (7) is provided between a semiconductor wafer (1) and an anode (5) so that the anode (5) and the semiconductor wafer (7) are separated from each other and a plating tank (100) is divided into a substrate-to-be-plated chamber and an anode chamber.

摘要翻译： 本发明的目的是提供一种面向下型喷射镀覆装置，其中防止由黑色膜等导致的微小的固体异物导致的电镀质量劣化，而不损害操作性。 电镀装置被设计成使得在半导体晶片（1）和阳极（5）之间设置隔板（7），使得阳极（5）和半导体晶片（7）彼此分离，镀槽 （100）被分为待镀覆基板的室和阳极室。

公开(公告)号：US20060237848A1

公开(公告)日：2006-10-26

申请号：US11474469

申请日：2006-06-26

申请人： Shinji Suminoe ,  Hiroyuki Nakanishi ,  Toshiya Ishio ,  Yoshihide Iwazaki ,  Katsunobu Mori

发明人： Shinji Suminoe ,  Hiroyuki Nakanishi ,  Toshiya Ishio ,  Yoshihide Iwazaki ,  Katsunobu Mori

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/10 ,  H01L23/3114 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05006 ,  H01L2224/05546 ,  H01L2224/05567 ,  H01L2224/13 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2224/05552 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor device, comprising the steps of forming an insulation layer, which has an opening section in an area including an area on an electrode pad, on a top surface of the semiconductor substrate on which the electrode pad is formed; at least forming a first barrier metal layer, which becomes a part of a leading wiring layer, in an inner peripheral surface of the opening section including the top surface of the electrode pad; at least forming a main conductor layer, which becomes a part of the leading wiring layer, in an area surrounded by the first barrier metal layer in the opening section; eliminating an upper portion of the main conductor layer at least to a position at which the first barrier metal layer is exposed, and forming a second barrier metal layer, which becomes a part of the leading wiring layer, so as to cover the whole top surface of the main conductor layer.

摘要翻译： 一种半导体器件的制造方法，包括以下步骤：在形成有电极焊盘的半导体衬底的顶表面上形成绝缘层，该绝缘层在包括电极焊盘的区域的区域中具有开口部分; 至少在包括所述电极焊盘的顶面的所述开口部的内周面中形成成为前导布线层的一部分的第一阻挡金属层; 至少在由开口部分中的第一阻挡金属层包围的区域中形成成为引导布线层的一部分的主导体层; 消除主导体层的上部至少到第一阻挡金属层露出的位置，形成作为引导布线层的一部分的第二阻挡金属层，以覆盖整个顶表面 的主导体层。

公开(公告)号：US20050194686A1

公开(公告)日：2005-09-08

申请号：US11072238

申请日：2005-03-07

申请人： Yoshihide Iwazaki ,  Shinji Suminoe ,  Katsunobu Mori

发明人： Yoshihide Iwazaki ,  Shinji Suminoe ,  Katsunobu Mori

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/44 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485 ,  H01L23/525 ,  H05K3/34

CPC分类号： H05K3/3452 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/1148 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/2081 ,  H05K2203/0315 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/013

摘要： A semiconductor device according to the present invention comprises an electrode pad electrically conducted to an electric circuit formed on an element-formed surface of a silicon wafer; a wiring pattern re-wired by being electrically conducted to the electrode pad; and an oxide film formed on a surface of the wiring pattern, the oxide film being formed by subjecting the wiring pattern to oxidization. With the provision of oxide film, the semiconductor device prevents a decrease in reliability in terms of electric characteristic or the like, and also achieves reduction in fabrication cost compared to a conventional semiconductor device.

摘要翻译： 根据本发明的半导体器件包括电导体，该电极焊盘导电到形成在硅晶片的元件形成表面上的电路; 通过对电极焊盘进行导电而重新布线的布线图案; 以及形成在所述布线图案的表面上的氧化膜，所述氧化膜通过对所述布线图案进行氧化而形成。 通过提供氧化膜，半导体器件防止电特性等的可靠性降低，并且与现有的半导体器件相比，也可以实现制造成本的降低。

公开(公告)号：US20050104165A1

公开(公告)日：2005-05-19

申请号：US11023389

申请日：2004-12-29

申请人： Toshiya Ishio ,  Hiroyuki Nakanishi ,  Katsunobu Mori ,  Yoshihide Iwazaki ,  Shinji Suminoe

发明人： Toshiya Ishio ,  Hiroyuki Nakanishi ,  Katsunobu Mori ,  Yoshihide Iwazaki ,  Shinji Suminoe

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/552 ,  H01L29/06 ,  H01L21/302

CPC分类号： H01L23/552 ,  H01L23/3114 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip of the present invention is so arranged that a front face on which an element circuit is formed has electrode pads and a side face and a back face are coated with a shielding layer for shielding electromagnetic waves. With this, it is possible to provide a semiconductor element capable of being easily manufactured into a smaller semiconductor device compared with a conventional semiconductor device equipped with a shielding cap; a semiconductor device; and a method for manufacturing a semiconductor element.

摘要翻译： 本发明的半导体芯片被布置成使得其上形成有元件电路的正面具有电极焊盘，并且侧面和背面涂覆有用于屏蔽电磁波的屏蔽层。 由此，与配备有屏蔽盖的现有的半导体装置相比，可以提供能够容易地制造成较小的半导体装置的半导体元件; 半导体器件; 以及半导体元件的制造方法。