公开(公告)号：US08426965B2

公开(公告)日：2013-04-23

申请号：US13567112

申请日：2012-08-06

申请人： Teppei Iwase ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa

发明人： Teppei Iwase ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa

IPC分类号： H01L23/48

CPC分类号： H01L24/75 ,  B30B5/02 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75303 ,  H01L2224/75315 ,  H01L2224/75756 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.

摘要翻译： 当形成在半导体芯片的焊盘上的凸起和具有粘附在其表面上的片状密封粘合树脂的板彼此面对地设置时，用工具将凸块和板彼此挤压，从而形成半导体芯片 其中密封粘合树脂填充在半导体芯片和板之间，并且其中半导体芯片的焊盘和板的电极分别经由凸块相互连接。 半导体芯片的角部的整个侧面被密封接合树脂覆盖。 因此，由于板弯曲而在安装期间由加热和冷却引起的各个部件之间的热膨胀和收缩差异的板弯曲产生的负载以及安装之后的机械负载，从而可以避免半导体芯片的内部击穿。

公开(公告)号：US20110001233A1

公开(公告)日：2011-01-06

申请号：US12445793

申请日：2007-10-16

申请人： Teppei Iwase ,  Yoshihiro Tomura ,  Kazuhiro Nobori

发明人： Teppei Iwase ,  Yoshihiro Tomura ,  Kazuhiro Nobori

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L23/315 ,  H01L23/49811 ,  H01L23/562 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/29 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： In a semiconductor device mounted structure in which device electrodes of a semiconductor device and board electrodes of a board are connected to each other via bump electrodes, respectively, and in which a sealing-bonding use resin is placed between the semiconductor device and the board, a void portion is placed at a position corresponding to an edge portion of the semiconductor device in the sealing-bonding use resin. Thus, stress loads generated at corner portions of the semiconductor device due to board flexures for differences in thermal expansion and thermal contraction among the individual members caused by heating and cooling steps in mounting process of the semiconductor device, as well as for mechanical loads after the mounting process, can be absorbed by the void portion and thereby reduced, so that breakdown of the semiconductor device mounted structure is prevented.

摘要翻译： 在半导体器件安装结构中，半导体器件的器件电极和板的基板电极分别通过凸块电极彼此连接，并且其中密封用途树脂放置在半导体器件和板之间， 在与密封用树脂中的半导体器件的边缘部分相对应的位置放置空隙部分。 因此，由于板弯曲而导致的半导体器件的拐角部分产生的应力负荷，由于半导体器件的安装过程中由于加热和冷却步骤引起的各个部件之间的热膨胀和热收缩的差异而导致的弯曲，以及在 安装过程可被空隙部分吸收并由此减小，从而防止了半导体器件安装结构的击穿。

公开(公告)号：US20070079957A1

公开(公告)日：2007-04-12

申请号：US11541945

申请日：2006-10-02

申请人： Yoshihiro Tomura

发明人： Yoshihiro Tomura

IPC分类号： F28F9/02

CPC分类号： F28F9/0226 ,  F28F9/0246 ,  F28F9/0265

摘要： A heat exchanger comprises: a long and slender entrance side tank connected to one end side in the longitudinal direction of a plurality of laminated tubes; and an entrance pipe protruded from a wall face laid in the longitudinal direction of the entrance side tank, communicated with the inside of the entrance side tank, the heat exchanger further comprising: a division plate shifted from a center of a projected region which is formed when an inner diameter portion of the entrance pipe is projected into the entrance side tank, the division plate being formed into a plate-shape, the division plate being arranged so that the inside of the entrance side tank can be divided into two portions in the longitudinal direction and the plate face of the division plate can be laid in the axial direction of the entrance pipe, wherein the division plate divides a flow of fluid flowing into the entrance pipe by a plate-shaped end portion so that a flow of fluid flowing onto one side in the longitudinal direction of the entrance side tank and a flow of fluid flowing onto the other side in the longitudinal direction of the entrance side tank can be set at a predetermined ratio.

摘要翻译： 一种热交换器，包括：长且细长的入口侧罐，其连接到多个层叠管的纵向方向上的一端侧; 以及从入口侧槽的长度方向的壁面突出的入口管，与入口侧槽的内部连通，所述热交换器还包括：分隔板，其从形成的突出区域的中心偏移 当入口管的内径部分突出到入口侧罐中时，分隔板形成为板状，分隔板布置成使得入口侧罐的内部可以分成两部分 分割板的板面可以沿着入口管的轴向铺设，其中分隔板将流入入口管的流体流通过板状端部分开，使流体流动 在入口侧箱体的纵向方向上的一侧上，并且流入在入口侧箱体的纵向方向上的另一侧的流体流可以被设定在 预定比例。

公开(公告)号：US5651179A

公开(公告)日：1997-07-29

申请号：US731521

申请日：1996-10-15

申请人： Yoshihiro Bessho ,  Yoshihiro Tomura

发明人： Yoshihiro Bessho ,  Yoshihiro Tomura

IPC分类号： H01L21/56 ,  H01L23/485 ,  H05K3/30

CPC分类号： H01L24/10 ,  H01L21/563 ,  H01L24/13 ,  H01L24/28 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/351 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A method for mounting a semiconductor device on a circuit board which includes the steps of: joining a terminal electrode of the semiconductor device to a connecting electrode of the circuit board by means of a thermoplastic conductive adhesive; allowing a thermosetting resin to fill a gap between the semiconductor device and the circuit board; and curing the thermosetting resin at a temperature equal to or higher than the plasticizing temperature of the thermoplastic conductive adhesive is disclosed.

摘要翻译： 一种将半导体器件安装在电路板上的方法，包括以下步骤：通过热塑性导电粘合剂将半导体器件的端子电极连接到电路板的连接电极; 允许热固性树脂填充半导体器件和电路板之间的间隙; 并且公开了在等于或高于热塑性导电粘合剂的塑化温度的温度下固化热固性树脂。

公开(公告)号：US20120298310A1

公开(公告)日：2012-11-29

申请号：US13567112

申请日：2012-08-06

申请人： Teppei IWASE ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa

发明人： Teppei IWASE ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa

IPC分类号： B30B9/00

CPC分类号： H01L24/75 ,  B30B5/02 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75303 ,  H01L2224/75315 ,  H01L2224/75756 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/18161 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.

摘要翻译： 当形成在半导体芯片的焊盘上的凸起和具有粘附在其表面上的片状密封粘合树脂的板彼此面对地设置时，用工具将凸块和板彼此挤压，从而形成半导体芯片 其中密封粘合树脂填充在半导体芯片和板之间，并且其中半导体芯片的焊盘和板的电极分别经由凸块相互连接。 半导体芯片的角部的整个侧面被密封接合树脂覆盖。 因此，由于板弯曲而在安装期间由加热和冷却引起的各个部件之间的热膨胀和收缩差异的板弯曲产生的负载以及安装之后的机械负载，从而可以避免半导体芯片的内部击穿。

公开(公告)号：US08207618B2

公开(公告)日：2012-06-26

申请号：US12692872

申请日：2010-01-25

申请人： Kazumichi Shimizu ,  Yoshihiro Tomura ,  Masahiro Ono

发明人： Kazumichi Shimizu ,  Yoshihiro Tomura ,  Masahiro Ono

IPC分类号： H01L23/28

CPC分类号： H01L21/563 ,  H01L21/561 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/0401

摘要： This semiconductor device is a semiconductor device in which a semiconductor element is flip-chip mounted onto a circuit substrate and the semiconductor element is covered and sealed with a sealing resin. A recess portion is formed in the sealing resin on a surface opposite to the mounting surface of the semiconductor element. Warping of the semiconductor device is reduced by the action of this recess portion.

摘要翻译： 该半导体装置是将半导体元件倒装芯片安装在电路基板上的半导体装置，半导体元件被密封树脂​​覆盖并密封。 在与半导体元件的安装表面相对的表面上的密封树脂中形成凹部。 通过该凹部的作用可以减小半导体器件的翘曲。

公开(公告)号：US08080884B2

公开(公告)日：2011-12-20

申请号：US12486841

申请日：2009-06-18

申请人： Kojiro Nakamura ,  Yoshihiro Tomura ,  Kentaro Kumazawa

发明人： Kojiro Nakamura ,  Yoshihiro Tomura ,  Kentaro Kumazawa

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40 ,  H01L23/485 ,  H01L23/498

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/11901 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13027 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/14104 ,  H01L2224/16227 ,  H01L2224/85148 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/351 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A mounting structure of the present invention includes a semiconductor element 101, a circuit board 301 having electrodes 302 opposed to electrodes 102 of the semiconductor element 101, and conductive two-layer bumps 213. Second bumps 210 joined to the electrodes 302 of the circuit board 301 are formed larger than first bumps 209 joined to the electrodes 102 of the semiconductor element 101. The axis of the first bump 209 and the axis of the second bump 210 are not aligned with each other.

摘要翻译： 本发明的安装结构包括半导体元件101，具有与半导体元件101的电极102相对的电极302的电路板301和导电的双层凸块213.接合到电路板的电极302的第二凸块210 301形成为大于连接到半导体元件101的电极102的第一凸起209.第一凸起209的轴线和第二凸块210的轴线彼此不对准。

公开(公告)号：US20110175237A1

公开(公告)日：2011-07-21

申请号：US13056462

申请日：2009-11-06

申请人： Yoshihiro Tomura ,  Kazumichi Shimizu ,  Kentaro Kumazawa

发明人： Yoshihiro Tomura ,  Kazumichi Shimizu ,  Kentaro Kumazawa

IPC分类号： H01L23/48 ,  H01L21/50 ,  B29C65/20

CPC分类号： H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/3142 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75303 ,  H01L2224/75313 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75501 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/9221 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512

摘要： A semiconductor chip (1) is flip-chip mounted on a circuit board (4) with an underfill resin (6) interposed between the semiconductor chip (1) and the circuit board (4) and a container covering the semiconductor chip (1) is bonded on the circuit board (4). At this point, the semiconductor chip (1) positioned with the underfill resin (6) interposed between the circuit board (4) and the semiconductor chip (1) is pressed and heated by a pressure-bonding tool (8); meanwhile, the surface of the underfill resin (6) protruding around the semiconductor chip (1) is pressed by the pressure-bonding tool (8) through a film (13) on which a surface unevenness is formed in a periodically repeating pattern, so that a surface unevenness (16a) is formed. The inner surface of the container covering the semiconductor chip (1) is bonded to the surface unevenness (16a) on the surface of the underfill resin.

摘要翻译： 将半导体芯片（1）倒装安装在电路板（4）上，其中底部填充树脂（6）插入在半导体芯片（1）和电路板（4）之间以及覆盖半导体芯片（1）的容器中， 被接合在电路板（4）上。 此时，通过压接工具（8）对设置在电路基板（4）与半导体芯片（1）之间的底部填充树脂（6）的半导体芯片（1）进行加压加压。 同时，通过压接工具（8）以周期性重复的图案形成有表面凹凸的膜（13），将半导体芯片（1）周围突出的底部填充树脂（6）的表面按压 形成表面凹凸（16a）。 覆盖半导体芯片（1）的容器的内表面与底部填充树脂的表面上的表面凹凸（16a）接合。

公开(公告)号：US20110061913A1

公开(公告)日：2011-03-17

申请号：US12992306

申请日：2009-03-23

申请人： Takayuki Higuchi ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Kentaro Kumazawa

发明人： Takayuki Higuchi ,  Yoshihiro Tomura ,  Kazuhiro Nobori ,  Kentaro Kumazawa

IPC分类号： H05K1/02 ,  H05K3/30

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/731 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K2201/0187 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A method of manufacturing a mounting structure includes: an insulating resin arranging step of forming, on a circuit board, two kinds of insulating resin including first insulating resin cured at first curing temperature and second insulating resin cured at second curing temperature higher than the first curing temperature; a mounting step of aligning the bumps formed on an electronic component such that the bumps are opposed to counter electrodes of the circuit board; and a full-scale pressing step of performing, after the mounting step, full-scale pressing to join the electronic component and the circuit board. The insulating resin is heated to reach the first curing temperature before the full-scale pressing, and the insulating resin is heated to reach the second temperature during the full-scale pressing after the curing of the first insulating resin.

摘要翻译： 一种制造安装结构的方法包括：绝缘树脂布置步骤，在电路板上形成两种绝缘树脂，所述绝缘树脂包括在第一固化温度下固化的第一绝缘树脂和在比第一固化的第二固化温度下固化的第二绝缘树脂 温度; 将形成在电子部件上的凸块对准使得凸块与电路板的对置电极相对的安装步骤; 以及全尺寸按压步骤，在安装步骤之后进行全尺寸按压以连接电子部件和电路板。 在全压制之前，将绝缘树脂加热到达第一固化温度，并且在固化第一绝缘树脂之后，在全压制期间将绝缘树脂加热到达第二温度。

公开(公告)号：US20100032832A1

公开(公告)日：2010-02-11

申请号：US12531819

申请日：2008-05-09

申请人： Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa ,  Teppei Iwase

发明人： Yoshihiro Tomura ,  Kazuhiro Nobori ,  Yuichiro Yamada ,  Kentaro Kumazawa ,  Teppei Iwase

IPC分类号： H01L23/488

CPC分类号： H01L24/13 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/05076 ,  H01L2224/05554 ,  H01L2224/05576 ,  H01L2224/05599 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.

摘要翻译： 在该半导体芯片3中，台面电极13插入在凸块电极14和电极焊盘6之间。台电极13通过在电极上形成具有比突起电极14更小的杨氏模量的多个芯15而形成 垫6，然后用导电电极16覆盖芯15的表面。当半导体芯片3倒装芯片安装时，凸起电极14塑性变形，并且台面电极13被适当地弹性变形，从而获得良好的 导电状态。