公开(公告)号：US08011777B2

公开(公告)日：2011-09-06

申请号：US12121289

申请日：2008-05-15

申请人： Yoshihisa Yamashita ,  Kenji Nishiguchi ,  Aki Takano

发明人： Yoshihisa Yamashita ,  Kenji Nishiguchi ,  Aki Takano

IPC分类号： G01D11/00

CPC分类号： C09D11/322 ,  C09D11/38 ,  C09D11/40

摘要： An ink set includes a combination of a first ink and a second ink, the first ink containing a self-dispersion pigment having at least one hydrophilic group directly or through another atomic group bonded to the surface of the pigment particle, and ammonium ions, the second ink containing a pigment, a polymer having an acid value of 160 mg KOH/g or less, and alkali metal ions, wherein the first ink further contains a compound (A) selected from nonionic surfactants and/or a compound (B) selected from the group consisting of polyethylene glycol with an average molecular weight of 600 to 2,000, α,ω-alkanediol having six carbon atoms, and an imidazolidinone derivative.

摘要翻译： 油墨组包括第一油墨和第二油墨的组合，第一油墨含有直接或通过与颜料颗粒表面结合的另一原子团的至少一个亲水基团的自分散颜料和铵离子， 含有颜料的第二油墨，酸值为160mg KOH / g以下的聚合物和碱金属离子，其中第一油墨还含有选自非离子表面活性剂和/或选自下列化合物（B）的化合物（A） 来自平均分子量为600〜2,000的聚乙二醇，具有6个碳原子的α，ω-链烷二醇和咪唑烷酮衍生物。

公开(公告)号：US07909449B2

公开(公告)日：2011-03-22

申请号：US12121310

申请日：2008-05-15

申请人： Shin-ichi Sato ,  Hideki Takayama ,  Yoshihisa Yamashita ,  Kenji Nishiguchi ,  Aki Takano

发明人： Shin-ichi Sato ,  Hideki Takayama ,  Yoshihisa Yamashita ,  Kenji Nishiguchi ,  Aki Takano

IPC分类号： G01D11/00

CPC分类号： B41J2/16508

摘要： An ink jet recording apparatus is provided with a plurality of inks and includes a unit configured to perform a recovery operation by suction of inks from a plurality of ink ejection portions using a suction cap, wherein the plurality of inks include an ink set including a combination of at least a first ink and a second ink, the first ink containing (i) a self-dispersion pigment having at least one hydrophilic group directly or through another atomic group bonded to the surface of the pigment, and (ii) ammonium ions, the second ink containing a pigment, a polymer having an acid value of 160 mg KOH/g or less, and alkali metal ions, and the suction cap used in the recovery operation is individually provided for each of the first ink and the second ink.

摘要翻译： 一种喷墨记录装置设置有多种墨水，并且包括被配置为通过使用吸嘴从多个墨水喷射部分抽吸墨水进行恢复操作的单元，其中所述多种墨水包括包括组合的墨水组 至少第一油墨和第二油墨，所述第一油墨含有（i）具有至少一个亲水基团的自分散颜料，或通过与所述颜料的表面键合的另一原子团，和（ii）铵离子， 分别为第一墨水和第二墨水分别提供含有颜料的第二墨水，酸值为160mg KOH / g以下的聚合物和碱金属离子，以及用于回收操作的吸嘴。

公开(公告)号：US20080292794A1

公开(公告)日：2008-11-27

申请号：US12121310

申请日：2008-05-15

申请人： Shin-ichi Sato ,  Hideki Takayama ,  Yoshihisa Yamashita ,  Kenji Nishiguchi ,  Aki Takano

发明人： Shin-ichi Sato ,  Hideki Takayama ,  Yoshihisa Yamashita ,  Kenji Nishiguchi ,  Aki Takano

IPC分类号： B05D5/00 ,  G01D11/00 ,  B41J2/165

CPC分类号： B41J2/16508

摘要： An ink jet recording apparatus is provided with a plurality of inks and includes a unit configured to perform a recovery operation by suction of inks from a plurality of ink ejection portions using a suction cap, wherein the plurality of inks include an ink set including a combination of at least a first ink and a second ink, the first ink containing (i) a self-dispersion pigment having at least one hydrophilic group directly or through another atomic group bonded to the surface of the pigment, and (ii) ammonium ions, the second ink containing a pigment, a polymer having an acid value of 160 mg KOH/g or less, and alkali metal ions, and the suction cap used in the recovery operation is individually provided for each of the first ink and the second ink.

摘要翻译： 一种喷墨记录装置设置有多种墨水，并且包括被配置为通过使用吸嘴从多个墨水喷射部分抽吸墨水进行恢复操作的单元，其中所述多种墨水包括包括组合的墨水组 至少第一油墨和第二油墨，所述第一油墨含有（i）具有至少一个亲水基团的自分散颜料，或通过与所述颜料的表面键合的另一原子团，和（ii）铵离子， 分别为第一墨水和第二墨水分别提供含有颜料的第二墨水，酸值为160mg KOH / g以下的聚合物和碱金属离子，以及用于回收操作的吸嘴。

公开(公告)号：US20080292793A1

公开(公告)日：2008-11-27

申请号：US12121289

申请日：2008-05-15

申请人： Yoshihisa Yamashita ,  Kenji Nishiguchi ,  Aki Takano

发明人： Yoshihisa Yamashita ,  Kenji Nishiguchi ,  Aki Takano

IPC分类号： C09D11/02 ,  G01D11/00 ,  B05D5/00

CPC分类号： C09D11/322 ,  C09D11/38 ,  C09D11/40

摘要： An ink set includes a combination of a first ink and a second ink, the first ink containing a self-dispersion pigment having at least one hydrophilic group directly or through another atomic group bonded to the surface of the pigment particle, and ammonium ions, the second ink containing a pigment, a polymer having an acid value of 160 mg KOH/g or less, and alkali metal ions, wherein the first ink further contains a compound (A) selected from nonionic surfactants and/or a compound (B) selected from the group consisting of polyethylene glycol with an average molecular weight of 600 to 2,000, a,w-alkanediol having six carbon atoms, and an imidazolidinone derivative.

摘要翻译： 油墨组包括第一油墨和第二油墨的组合，第一油墨含有直接或通过与颜料颗粒表面结合的另一原子团的至少一个亲水基团的自分散颜料和铵离子， 含有颜料的第二油墨，酸值为160mg KOH / g以下的聚合物和碱金属离子，其中第一油墨还含有选自非离子表面活性剂和/或选自下列化合物（B）的化合物（A） 来自平均分子量为600〜2,000的聚乙二醇，具有6个碳原子的ω-链烷二醇和咪唑烷酮衍生物。

公开(公告)号：US08960879B2

公开(公告)日：2015-02-24

申请号：US13291984

申请日：2011-11-08

申请人： Yoshihisa Yamashita ,  Takashi Saito ,  Tsuyoshi Furuse ,  Nobuyuki Matsumoto

发明人： Yoshihisa Yamashita ,  Takashi Saito ,  Tsuyoshi Furuse ,  Nobuyuki Matsumoto

IPC分类号： B41J2/01 ,  C09D11/322 ,  B41J2/21 ,  C09D11/326 ,  C08K5/00

CPC分类号： C09D11/322 ,  B41J2/2107 ,  C08K5/0091 ,  C09D11/326

摘要： An ink jet ink contains a resin A, a resin B, and a pigment, in which the pigment is a halogenated metal phthalocyanine pigment being dispersed by the resin B, the resin A is a random copolymer having a carboxy group, the resin B is a block copolymer having a carboxy group, the acid value of the resin A is less than the acid value of the resin B, and the ink further includes a polybasic acid having a functional group whose pKa is 4.3 or less and a functional group whose pKa is 5.0 or more and 6.6 or less.

摘要翻译： 喷墨油墨包含树脂A，树脂B和颜料，其中颜料是由树脂B分散的卤化金属酞菁颜料，树脂A是具有羧基的无规共聚物，树脂B是 具有羧基的嵌段共聚物，树脂A的酸值小于树脂B的酸值，并且墨水还包含具有pKa为4.3以下的官能团的多元酸和pKa 为5.0以上且6.6以下。

公开(公告)号：US08617943B2

公开(公告)日：2013-12-31

申请号：US12746440

申请日：2009-07-22

申请人： Takashi Ichiryu ,  Seiichi Nakatani ,  Koichi Hirano ,  Yoshihisa Yamashita ,  Shingo Komatsu

发明人： Takashi Ichiryu ,  Seiichi Nakatani ,  Koichi Hirano ,  Yoshihisa Yamashita ,  Shingo Komatsu

IPC分类号： H01L21/00

CPC分类号： H01L29/78603 ,  H01L24/19 ,  H01L24/82 ,  H01L27/1218 ,  H01L29/66765 ,  H01L29/78609 ,  H01L29/78681 ,  H01L29/7869 ,  H01L51/0024 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/0541 ,  H01L51/0545 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/00

摘要： A method for fabricating a flexible semiconductor device includes: preparing a layered film 80 including a first metal layer 10, an inorganic insulating layer 20, a semiconductor layer 30, and a second metal layer 40 which are sequentially formed; etching the first metal layer 10 to form a gate electrode 12g; compression bonding a resin layer 50 to a surface of the layered film 80 provided with the gate electrode 12g to allow the gate electrode 12g to be embedded in the resin layer 50; and etching the second metal layer 40 to form a source electrode 42s and a drain electrode 42d, wherein the inorganic insulating layer 20 on the gate electrode 12g functions as a gate insulating film 22, and the semiconductor layer 30 between the source electrode 42s and drain electrode 42d on the inorganic insulating layer 20 functions as a channel 32.

摘要翻译： 一种制造柔性半导体器件的方法包括：制备包括依次形成的第一金属层10，无机绝缘层20，半导体层30和第二金属层40的层状膜80; 蚀刻第一金属层10以形成栅电极12g; 将树脂层50压接到设置有栅电极12g的层叠膜80的表面，以使栅电极12g嵌入树脂层50中; 并且蚀刻第二金属层40以形成源电极42s和漏电极42d，其中栅电极12g上的无机绝缘层20用作栅极绝缘膜22，并且源电极42s和漏极之间的半导体层30 无机绝缘层20上的电极42d用作通道32。

公开(公告)号：US08389600B2

公开(公告)日：2013-03-05

申请号：US12534969

申请日：2009-08-04

申请人： Katsuhiko Suzuki ,  Katsuhiro Shirota ,  Hirofumi Ichinose ,  Masashi Tsujimura ,  Hiromitsu Kishi ,  Takashi Saito ,  Sayoko Nagashima ,  Fumihiko Mukae ,  Yoshihisa Yamashita

发明人： Katsuhiko Suzuki ,  Katsuhiro Shirota ,  Hirofumi Ichinose ,  Masashi Tsujimura ,  Hiromitsu Kishi ,  Takashi Saito ,  Sayoko Nagashima ,  Fumihiko Mukae ,  Yoshihisa Yamashita

IPC分类号： A61Q19/00 ,  B41J2/01 ,  B41J2/015 ,  B41J2/17 ,  B41J2/175 ,  B60C1/00 ,  C08F290/06 ,  C08J3/00 ,  C08K5/54 ,  C08L31/00 ,  C08L33/00 ,  C08L33/06 ,  C09B67/00 ,  C09D5/00 ,  C09D11/00 ,  G01D11/00

CPC分类号： B41J29/00 ,  B41J2/1752 ,  C09D11/322 ,  C09D11/54

摘要： Provided are an ink jet ink set, an ink jet recording method, and an ink jet recording apparatus each of which can reduce the graininess of an image to be recorded and improve the water fastness of the image even in a recording medium such as plain paper. The ink jet ink set has a first ink and a second ink independently, and is used so that the first and second inks overlap each other at least partly upon application of the inks to a recording medium. The first ink contains at least a pigment and a silicone oil. The second ink contains at least a pigment and a graft polymer that includes at least a nonionic unit represented by the general formula (I) and a unit having a polysiloxane structure.

摘要翻译： 提供了一种喷墨油墨组，喷墨记录方法和喷墨记录装置，其中每一种都可以降低要记录的图像的颗粒度，并且即使在诸如普通纸的记录介质中也能提高图像的耐水性 。 喷墨油墨组独立地具有第一油墨和第二油墨，并且被使用以使得第一和第二油墨至少部分地在将油墨施加到记录介质上时彼此重叠。 第一油墨至少含有颜料和硅油。 第二油墨含有至少含有由通式（I）表示的非离子单元和具有聚硅氧烷结构的单元的至少一种颜料和接枝聚合物。

公开(公告)号：US07875496B2

公开(公告)日：2011-01-25

申请号：US11914416

申请日：2006-03-30

申请人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu

发明人： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L21/67103 ,  H01L21/67126 ,  H01L23/3135 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2224/83886 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/381 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0126 ,  H05K2203/082 ,  Y02P70/613 ,  Y10T29/53183 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/0665 ,  H01L2924/0695 ,  H01L2224/05599

摘要： A flip chip mounting method includes holding a circuit board (213) and a semiconductor chip (206), aligning the circuit board (213) with the semiconductor chip (206) while holding them with a predetermined gap therebetween, heating the circuit board (213) or the semiconductor chip (206) to a temperature at which solder powder in a solder resin composition (216) formed of solder powder (214) and a resin (215) is melted, supplying the solder resin composition (216) by a capillary phenomenon, and curing the resin (215), wherein the melted solder powder (214) in the solder resin composition (216) is moved through the predetermined gap across which the circuit board (213) and the semiconductor chip (206) are held, and self-assembled and grown, whereby the connection terminals (211) and the electrode terminals (207) are connected to each other electrically. According to this configuration, a flip chip mounting method having high productivity and reliability, which enables a next generation semiconductor chip to be mounted on a circuit board, a mounted body thereof, and a mounting apparatus thereof are provided.

摘要翻译： 一种倒装芯片安装方法，包括保持电路板（213）和半导体芯片（206），使电路板（213）与半导体芯片（206）保持一定间隔，同时将电路板（213）加热 ）或半导体芯片（206）的温度升高到由焊料粉末（214）和树脂（215）形成的焊料树脂组合物（216）中的焊料粉末熔化的温度，通过毛细管 现象，固化树脂（215），其中焊料树脂组合物（216）中的熔融焊料粉末（214）移动通过保持电路板（213）和半导体芯片（206）的预定间隙， 并且自组装和生长，由此连接端子（211​​）和电极端子（207）彼此电连接。 根据该结构，提供了一种能够将下一代半导体芯片安装在电路板上的高生产率和可靠性的倒装芯片安装方法及其安装体及其安装装置。

公开(公告)号：US07799607B2

公开(公告)日：2010-09-21

申请号：US11661821

申请日：2005-08-30

申请人： Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

发明人： Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

IPC分类号： H01L21/44

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1579 ,  H05K3/323 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/083 ,  H05K2203/087 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00014

摘要： A process for forming bumps wherein a plurality of fine bumps are uniformly formed with high productivity. In this process, a resin (13) including solder powder and a convection additive (12) is supplied onto a substrate (10) having a plurality of electrodes (11) thereon. And subsequently the substrate (10) is heated to a temperature that enables the solder powder to melt while keeping a flat plate (14) in contact with a surface of the supplied resin (13). During this heating step, the molten solder powder is allowed to self-assemble onto the electrodes (11) so that a plurality of solder balls, resulting from the grown molten solder powder, are concurrently formed on the electrodes (11) in self-alignment manner. Finally, the flat plate (14) is moved away from the surface of the supplied resin (13), and then the resin (13) is removed to provide a substrate (10) having bumps (16) formed on the plurality of the electrodes.

摘要翻译： 一种用于形成凸块的方法，其中以高生产率均匀地形成多个细小凸块。 在该工序中，将具有焊料粉末和对流添加剂（12）的树脂（13）供给到其上具有多个电极（11）的基板（10）上。 然后将衬底（10）加热到使焊料粉末熔化同时保持平板（14）与所供应的树脂（13）的表面接触的温度。 在该加热步骤期间，允许熔融焊料粉末自组装在电极（11）上，使得由生长的熔融焊料粉末产生的多个焊球同时以自对准的方式形成在电极（11）上 方式。 最后，将平板（14）从所提供的树脂（13）的表面移开，然后除去树脂（13），以提供在多个电极上形成有凸点（16）的基板（10） 。

公开(公告)号：US07773386B2

公开(公告)日：2010-08-10

申请号：US11976848

申请日：2007-10-29

申请人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

发明人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

IPC分类号： H05K1/00

CPC分类号： H05K3/386 ,  H01L51/424 ,  H01L2924/0002 ,  H05K1/16 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0191 ,  H05K2201/0376 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A flexible substrate includes: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.

摘要翻译： 柔性基板包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; （iii）嵌入到形成在所述膜前表面上的所述绝缘树脂层中的正面布线图案和嵌入在所述膜背面形成的所述绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个布线图案上的绝缘树脂层 的膜的前表面和后表面比膜厚。