公开(公告)号：US20010026016A1

公开(公告)日：2001-10-04

申请号：US09826436

申请日：2001-04-04

发明人： Shigeyoshi Yoshida ,  Hiroshi Ono ,  Koji Kamei

IPC分类号： H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC分类号： H05K1/0233 ,  H01L23/4952 ,  H01L23/66 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/745 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/432 ,  H01L2224/43826 ,  H01L2224/43827 ,  H01L2224/451 ,  H01L2224/45117 ,  H01L2224/45118 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45163 ,  H01L2224/45166 ,  H01L2224/45179 ,  H01L2224/45181 ,  H01L2224/45188 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/45617 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45663 ,  H01L2224/45666 ,  H01L2224/45679 ,  H01L2224/45681 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/745 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03H2001/0092 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/01008 ,  H01L2924/01009 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2224/45015 ,  H01L2924/207

摘要： In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (nullm) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.

摘要翻译： 为了提供高频电流抑制型的电子部件，能够完全抑制高频电流，即使在高频时使用也能够发生电磁干扰，也可以使用该接合线等。 集成电路器件（IC）17在高频使用时高速工作，并且预定数量的端子（19）设置有高频电流抑制器（21），用于衰减通过的高频电流 终端本身。 该高频电流抑制器（21）是厚度为0.3〜20（μm）范围的薄膜磁性物质，并且设置在各端子（19）的整个表面上，覆盖安装部 用于安装IC（17）的印刷布线电路板（23）和包括设置在印刷布线电路板（23）上的导电图案的连接部分的边缘。 当在安装IC（17）的印刷布线电路板（23）时顶端通过焊料（27）与导电图案（25）连接时，安装部分的附近具有使用频带的导电性 ，小于几十MHz。

公开(公告)号：US20180102469A1

公开(公告)日：2018-04-12

申请号：US15684337

申请日：2017-08-23

申请人： Massachusetts Institute of Technology

发明人： Rabindra N. Das ,  Eric A. Dauler

IPC分类号： H01L39/04 ,  H01L27/18 ,  H01L39/12 ,  H01L23/498 ,  H01L25/00 ,  H01L39/02 ,  H01L25/065 ,  H01L39/24

CPC分类号： H01L39/06 ,  G06N10/00 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49888 ,  H01L23/5386 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/167 ,  H01L25/50 ,  H01L27/18 ,  H01L39/025 ,  H01L39/045 ,  H01L39/12 ,  H01L39/223 ,  H01L39/2416 ,  H01L39/2493 ,  H01L2224/10 ,  H01L2224/13109 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/45179 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06589 ,  H01L2924/13055 ,  H01P7/086 ,  H01L2924/00 ,  H01L2924/00014

摘要： A cryogenic electronic package includes a first superconducting multi-chip module (SMCM), a superconducting interposer, a second SMCM and a superconducting semiconductor structure. The interposer is disposed over and coupled to the first SMCM, the second SMCM is disposed over and coupled to the interposer, and the superconducting semiconductor structure is disposed over and coupled to the second SMCM. The second SMCM and the superconducting semiconductor structure are electrically coupled to the first SMCM through the interposer. A method of fabricating a cryogenic electronic package is also provided.

公开(公告)号：US20040188833A1

公开(公告)日：2004-09-30

申请号：US10355593

申请日：2003-01-31

发明人： Shigeyoshi Yoshida ,  Hiroshi Ono ,  Koji Kamei

IPC分类号： H01L023/34

CPC分类号： H05K1/0233 ,  H01L23/4952 ,  H01L23/66 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/745 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/432 ,  H01L2224/43826 ,  H01L2224/43827 ,  H01L2224/451 ,  H01L2224/45117 ,  H01L2224/45118 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45163 ,  H01L2224/45166 ,  H01L2224/45179 ,  H01L2224/45181 ,  H01L2224/45188 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/45617 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45663 ,  H01L2224/45666 ,  H01L2224/45679 ,  H01L2224/45681 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/745 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03H2001/0092 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/01008 ,  H01L2924/01009 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2224/45015 ,  H01L2924/207

摘要： In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (nullm) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.

摘要翻译： 为了提供高频电流抑制型的电子部件，能够完全抑制高频电流，即使在高频时使用也能够发生电磁干扰，也可以使用该接合线等。 集成电路器件（IC）17在高频使用时高速工作，并且预定数量的端子（19）设置有高频电流抑制器（21），用于衰减通过的高频电流 终端本身。 该高频电流抑制器（21）是厚度为0.3〜20（μm）范围的薄膜磁性物质，并且设置在各端子（19）的整个表面上，覆盖安装部 用于安装IC（17）的印刷布线电路板（23）和包括设置在印刷布线电路板（23）上的导电图案的连接部分的边缘。 当在安装IC（17）的印刷布线电路板（23）时顶端通过焊料（27）与导电图案（25）连接时，安装部分的附近具有使用频带的导电性 ，小于几十MHz。

公开(公告)号：US5592732A

公开(公告)日：1997-01-14

申请号：US334161

申请日：1994-10-26

申请人： Arthur C. Leuthold ,  Ronald T. Wakai

发明人： Arthur C. Leuthold ,  Ronald T. Wakai

IPC分类号： H01L39/02 ,  H01L39/24

CPC分类号： H01L39/02 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05679 ,  H01L2224/45179 ,  H01L2224/4847 ,  H01L2224/8502 ,  H01L2224/85801 ,  H01L2924/10253 ,  Y10S505/927 ,  Y10T29/49014 ,  Y10T29/49147 ,  Y10T29/49149

摘要： An electrical connection between first and second members of superconductive material, such as niobium, is made by coating each member with an indium-lead-tin alloy solder. Each member is coated by initially applying a layer of either an indium-lead alloy or indium to a surface of the member. Then the surface is mechanically worked to break up any oxide coating that is underneath the applied layer. Next a lead-tin alloy or tin is alloyed with the applied layer to form a resultant surface layer of a indium-lead-tin alloy. The first and second members are placed in contact with each other and their respective surface layers of the indium-lead-tin alloy are melted to produce a bond therebetween. A bond form by this method also is described.

摘要翻译： 超导材料如铌的第一和第二元件之间的电连接是通过用铟 - 铅 - 锡合金焊料涂覆每个元件来制成的。 通过首先将铟 - 铅合金或铟层施加到构件的表面上来涂覆每个构件。 然后机械加工表面以分解涂覆层下面的任何氧化物涂层。 接下来，铅锡合金或锡与所施加的层合金化以形成铟 - 铅 - 锡合金的合成表面层。 第一和第二构件彼此接触并且它们各自的铟 - 铅 - 锡合金的表面层被熔化以在它们之间形成结合。 还描述了通过该方法的债券形式。

公开(公告)号：US06903440B2

公开(公告)日：2005-06-07

申请号：US10355593

申请日：2003-01-31

申请人： Shigeyoshi Yoshida ,  Hiroshi Ono ,  Koji Kamei

发明人： Shigeyoshi Yoshida ,  Hiroshi Ono ,  Koji Kamei

IPC分类号： H01L21/60 ,  H01L23/49 ,  H01L23/495 ,  H01L23/66 ,  H03H1/00 ,  H05K1/02 ,  H01L27/082

CPC分类号： H05K1/0233 ,  H01L23/4952 ,  H01L23/66 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/745 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/432 ,  H01L2224/43826 ,  H01L2224/43827 ,  H01L2224/451 ,  H01L2224/45117 ,  H01L2224/45118 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45163 ,  H01L2224/45166 ,  H01L2224/45179 ,  H01L2224/45181 ,  H01L2224/45188 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/45617 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45663 ,  H01L2224/45666 ,  H01L2224/45679 ,  H01L2224/45681 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/745 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03H2001/0092 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/01008 ,  H01L2924/01009 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2224/45015 ,  H01L2924/207

摘要： In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (μm) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.

摘要翻译： 为了提供高频电流抑制型的电子部件，能够完全抑制高频电流，即使在高频时使用也能够发生电磁干扰，也可以使用该接合线等。 集成电路器件（IC）17在高频使用时高速工作，并且预定数量的端子（19）设置有高频电流抑制器（21），用于衰减通过的高频电流 终端本身。 该高频电流抑制器（21）是厚度为0.3〜20（μm）范围的薄膜磁性物质，并且设置在各端子（19）的整个表面上，覆盖安装部 用于安装IC（17）的印刷布线电路板（23）和包括设置在印刷布线电路板（23）上的导电图案的连接部分的边缘。 当在安装IC（17）的印刷布线电路板（23）时顶端通过焊料（27）与导电图案（25）连接时，安装部分的附近具有使用频带的导电性 ，小于几十MHz。

公开(公告)号：US06635961B2

公开(公告)日：2003-10-21

申请号：US09826436

申请日：2001-04-04

申请人： Shigeyoshi Yoshida ,  Hiroshi Ono ,  Koji Kamei

发明人： Shigeyoshi Yoshida ,  Hiroshi Ono ,  Koji Kamei

IPC分类号： H01L2334

CPC分类号： H05K1/0233 ,  H01L23/4952 ,  H01L23/66 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/745 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/432 ,  H01L2224/43826 ,  H01L2224/43827 ,  H01L2224/451 ,  H01L2224/45117 ,  H01L2224/45118 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45163 ,  H01L2224/45166 ,  H01L2224/45179 ,  H01L2224/45181 ,  H01L2224/45188 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/45617 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45663 ,  H01L2224/45666 ,  H01L2224/45679 ,  H01L2224/45681 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/745 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03H2001/0092 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/01008 ,  H01L2924/01009 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2224/45015 ,  H01L2924/207

摘要： In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (&mgr;m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.

摘要翻译： 为了提供高频电流抑制型的电子部件，能够完全抑制高频电流，即使在高频时使用也能够发生电磁干扰，也可以使用该接合线等。 集成电路器件（IC）17在高频使用时高速工作，并且预定数量的端子（19）设置有高频电流抑制器（21），用于衰减通过的高频电流 终端本身。 该高频电流抑制器（21）是薄膜磁性物质，其厚度范围为0.3〜20（μm），并且设置在各端子（19）的整个表面上，覆盖安装在安装部 用于安装IC（17）的印刷布线电路板（23）和包括设置在印刷布线电路板（23）上的导电图案的连接部分的边缘。 当在安装IC（17）的印刷布线电路板（23）时顶端通过焊料（27）与导电图案（25）连接时，安装部分的附近具有使用频带的导电性 ，小于几十MHz。

公开(公告)号：US5110034A

公开(公告)日：1992-05-05

申请号：US575164

申请日：1990-08-30

申请人： Michael B. Simmonds

发明人： Michael B. Simmonds

IPC分类号： H01L39/02

CPC分类号： H01L39/02 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45033 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45179 ,  H01L2224/45181 ,  H01L2224/45664 ,  H01L2224/45679 ,  Y10S505/927

摘要： A method of bonding a superconductive ribbon lead to a superconducting bonding pad connected to superconducting circuitry. The thin ribbon is first coated with a fresh layer of the same material from which it is made and then a very thin layer of a noble metal is applied over that fresh layer. The bonding pad is also prepared with a very thin layer of the noble metal. Those coated surfaces are placed in facing contact and ultrasonically bonded.

摘要翻译： 将超导带引线连接到连接到超导电路的超导焊盘的方法。 薄带首先涂覆有与之相同的材料的新层，然后在该新层上施加非常薄的贵金属层。 接合焊盘也用非常薄的贵金属层制成。 将这些涂覆表面放置在面对接触中并进行超声波粘合。