Electrical interconnect structure and process thereof and circuit board structure
    91.
    发明公开
    Electrical interconnect structure and process thereof and circuit board structure 有权
    Elektrische Verbindungsstruktur und Verfahrendafürund Schalttafelstruktur

    公开(公告)号:EP2120519A1

    公开(公告)日:2009-11-18

    申请号:EP09250489.3

    申请日:2009-02-24

    Abstract: An electrical interconnecting structure suitable for a circuit board is provided. The electrical interconnecting structure includes a core (200), an ultra fine pattern (204a, 204b), and a patterned conductive layer. The core (200) has a surface, and the ultra fine pattern (204a, 204b) is inlaid in the surface of the core. The patterned conductive layer (210a, 210b) is disposed on the surface of the core (200) and is partially connected to the ultra fine pattern, since the ultra fine pattern of the electrical interconnecting structure is inlaid in the surface of the core and is partially connected to the patterned conductive layer located on the surface of the core. There is a through hole (200) and a through via (202a).

    Abstract translation: 提供了适用于电路板的电互连结构。 电互连结构包括芯(200),超细图案(204a,204b)和图案化导电层。 芯(200)具有表面,并且超细图案(204a,204b)镶嵌在芯的表面中。 图案化的导电层(210a,210b)设置在芯(200)的表面上,并且部分地连接到超细图案,因为电互连结构的超细图案镶嵌在芯的表面中,并且是 部分地连接到位于芯的表面上的图案化导电层。 通孔(200)和通孔(202a)。

    Multilayer printed wiring board and manufacturing method thereof
    96.
    发明公开
    Multilayer printed wiring board and manufacturing method thereof 失效
    多层印刷线路板及其制造方法

    公开(公告)号:EP1981317A2

    公开(公告)日:2008-10-15

    申请号:EP08011580.1

    申请日:1996-12-19

    Abstract: A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and that of another opening are equalized, the quantity of resin which is filled in each opening or is equalized throughout a printed wiring board and the quantity of resin overflowing from each opening or when resin is filled in each opening or is uniformed is provided. According to such a printed wiring board, a reliable printed wiring board wherein secure connection is enabled without causing disconnection can be realized when a circuit pattern provided on an interlayer insulating board formed on the printed wiring board and a conductor pad are connected by arranging an opening existing around a conductor pad so that it is not overlapped with the conductor pad and substantially equalizing the quantity of resin which is filled in an opening around a conductor pad and that of resin which is filled in another opening.

    Abstract translation: 本发明提供一种印刷线路板,该印刷线路板中,在作为光电晶体管的焊盘周围存在的开口以不与焊盘重叠的方式配置,焊盘周围的开口部的面积与其他开口的面积相等, 其填充在每个开口中或者在整个印刷线路板中均匀化,并且提供从每个开口溢出的树脂量,或者当树脂被填充在每个开口中或者被均匀化时。 根据这样的印刷布线板,当在印刷布线板上形成的层间绝缘板上提供的电路图案和导体焊盘通过布置开口而连接时,可以实现可靠的印刷布线板,其中可靠地连接而不会导致断开 存在于导体焊盘周围,使得其不与导体焊盘重叠并且实质上均衡填充在导体焊盘周围的开口中的树脂量和填充在另一个开口中的树脂量。

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