公开(公告)号：EP0719442B1

公开(公告)日：2002-11-20

申请号：EP94928052.3

申请日：1994-09-13

Applicant: TYCO Electronics Corporation

Inventor： FANG, Shou-Mean ,  SIDEN, Dennis ,  THOMPSON, Mark ,  ZHANG, Michael

IPC: H01C1/14 ,  H01C7/02

CPC classification number: H01C17/28 ,  H01C1/1406 ,  H01C7/027 ,  H01C17/06586 ,  H05K1/182 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10469 ,  H05K2201/10666

Abstract: Laminar electrical devices, in particular circuit protection devices, contain two laminar electrodes, with a PTC element between them, and a cross-conductor which passes through the thickness of the device and contacts one only of the two electrodes. This permits connection to both electrodes from the same side of the device. It also makes it possible to carry out the steps for preparing such devices on an assembly which corresponds to a number of individual devices, with division of the assembly as the final step.

公开(公告)号：EP1058307A1

公开(公告)日：2000-12-06

申请号：EP00304333.8

申请日：2000-05-23

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Nakano, Kazuhiro

IPC: H01L23/498

CPC classification number: H01L23/49805 ,  H01L2224/32225 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/10075 ,  H05K2201/10666 ,  H05K2201/10727 ,  Y02P70/613

Abstract: Disclosed is an electronic unit in which wiring patterns (2) and grounding patterns (3) provided on the upper surface (1a) of a circuit board (1) are connected to wiring terminal electrode portions (4) and grounding terminal electrode portions (5) by connection conductors (6) and (7), respectively, provided in through-holes, so that in mounting a cover (8), there is no need to avoid side through portions (21c) as in the prior art. Thus, it is possible for the cover to occupy the entire outer periphery of the upper surface of the circuit board (1), whereby it is possible to effectively utilize the entire upper surface la as a wiring pattern (2) and reduce the size of the electronic unit.

Abstract translation: 公开了一种电子单元，其中设置在电路板（1）的上表面（1a）上的布线图案（2）和接地图案（3）连接到布线端子电极部分（4）和接地端子电极部分（5） ）通过分别设置在通孔中的连接导体（6）和（7），使得在安装盖（8）时，不需要如现有技术那样避免侧通部分（21c）。 因此，覆盖物可以占据电路板（1）的上表面的整个外周，由此可以有效地利用整个上表面1a作为布线图案（2）并且减小尺寸 电子单位。

公开(公告)号：EP0959648A1

公开(公告)日：1999-11-24

申请号：EP98900160.7

申请日：1998-01-05

Applicant: IBIDEN CO., LTD.

Inventor： ISHIDA, Naoto ,  ASANO, Kouji

IPC: H05K1/14 ,  H05K3/36 ,  H01L23/12

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K3/308 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10871 ,  Y02P70/613 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 greater than an opening diameter of the through hole and forming a joining portion to the opposite party pad, and a leg portion 12 having a size capable of inserting this leg portion into the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. A joining ball approximately having a spherical shape instead of the joining pin can be also joined to the through hole by the conductive material.

公开(公告)号：EP0956748A1

公开(公告)日：1999-11-17

申请号：EP97901361.0

申请日：1997-01-03

Applicant: AlliedSignal Incorporated

Inventor： POMMER, Richard, J.

IPC: H05K1 ,  H05K3

CPC classification number: H05K3/462 ,  H01L2224/83138 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H05K1/141 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/368 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/0195 ,  H05K2201/10378 ,  H05K2201/10666 ,  H05K2201/10977 ,  H05K2203/063 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49126 ,  H01L2924/00

Abstract: A printed circuit assembly and method of making the same utilize in one embodiment an adhesive layer including a plurality of non-conductive 'gauge particles' disposed within a non-conductive adhesive. When the adhesive layer is disposed between opposing printed circuit layers (be they insulating substrates, conductive layers, or other layers), individual gauge particles (44, 174) are interposed or sandwiched at various points between the layers such that the diameters of the particles control the layer separation throughout overlapping areas of thereof, thereby permitting careful control over layer separation. A printed circuit assembly and method of making the same utilize in another embodiment an interlayer interconnecting technology incorporating conductive posts that are deposited on one of a pair of contact pads formed on opposing printed circuit boards and thereafter bonded to the other in the pair of contact pads during lamination. Fusible material may be utilized in the conductive posts (208, 209) to facilitate mechanical bonding to a contact pad, and the posts project through a dielectric layer disposed between the printed circuit boards, thereby forming the electrical connections between the boards at discrete locations.

公开(公告)号：EP0600051B1

公开(公告)日：1999-05-12

申请号：EP93909754.9

申请日：1993-06-09

Applicant: DYCONEX PATENTE AG

Inventor： SCHMIDT, Walter ,  MARTINELLI, Marco

IPC: H05K3/00 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4655 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/4084 ,  H05K3/42 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4635 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09572 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917

Abstract: The initial intention in the semi-finished product of the invention is to provide a functional separation between the requirement for mechanical strength and the previously concomitant requirement, for completing a circuit, in order to bring the pure circuit connection, especially for signals, 'closer' to the electrical and technical properties of chips. To do this, the layout miniaturisation is optimised without regard for the mechanical strength of the substrate. Instead of a printed circuit board (MCM), a semi-finished product which can be developed into a printed circuit board is made. The semi-finished product of the invention consists of an extremely thin film (8) with a plurality of extremely small holes (14) made simultaneously by an etching process. The hole diameters can be reduced by almost an order of magnitude (down to 20 νm), facilitating, for instance, definite sub-100 νm technology. Such a semi-finished product (19) does not act as a mechanical support but is designed only for signal conduction. The semi-finished product (19) which carries the densely packed wiring pattern, is bonded to a not densely packed power supply plane (22) acting as the service plane and the printed circuit board thus made is finally secured to a mechanical support (20).

公开(公告)号：EP0613331B1

公开(公告)日：1996-11-13

申请号：EP94101655.2

申请日：1994-02-03

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Hans-Bodo, Laue, Ing.

IPC: H05K3/34 ,  H05K3/36

CPC classification number: H05K3/363 ,  H05K1/141 ,  H05K1/162 ,  H05K1/167 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09772 ,  H05K2201/10666 ,  H05K2201/10689 ,  H05K2203/0455

公开(公告)号：EP0719442A1

公开(公告)日：1996-07-03

申请号：EP94928052.0

申请日：1994-09-13

Applicant: RAYCHEM CORPORATION

Inventor： FANG, Shou-Mean ,  SIDEN, Dennis ,  THOMPSON, Mark ,  ZHANG, Michael

IPC: H01C1 ,  H01C7 ,  H01C17 ,  H05K1 ,  H05K3

CPC classification number: H01C17/28 ,  H01C1/1406 ,  H01C7/027 ,  H01C17/06586 ,  H05K1/182 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10469 ,  H05K2201/10666

Abstract: Laminar electrical devices, in particular circuit protection devices, contain two laminar electrodes, with a PTC element between them, and a cross-conductor which passes through the thickness of the device and contacts one only of the two electrodes. This permits connection to both electrodes from the same side of the device. It also makes it possible to carry out the steps for preparing such devices on an assembly which corresponds to a number of individual devices, with division of the assembly as the final step.

公开(公告)号：EP0619935A4

公开(公告)日：1995-03-22

申请号：EP93902885

申请日：1992-12-30

Applicant: TESSERA INC

Inventor： DISTEFANO THOMAS H ,  KHANDROS IGOR ,  GRUBE GARY W ,  EHRENBERG SCOTT G

IPC: H05K1/11 ,  H01L21/48 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10 ,  H05K3/02

CPC classification number: H05K3/462 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R12/523 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/0298 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10666 ,  H05K2203/175 ,  H01L2924/00

Abstract: A multi-layer circuit panel assembly is formed by laminating circuit panels (10) with interposers (12) incorporating flowable conductive material (48) at interconnect locations and a flowable dielectric material (30, 38) at other locations. Excess materials are captured in reservoirs (20) in the circuit panels. The flowable materials and reservoirs allow the interposers to compress and take up tolerances in the components. The stacked panels may have contacts (538) on their top surfaces, through conductors (527) extending between top and bottom and terminals (530) connected to the bottom end of each through conductor. The terminals and contacts are nonselectively connected to one another at each interface so that wherever a terminal and contact an adjacent panels are aligned with one another, these are connected to one another. This forms composite vertical conductors extending through a plurality of the panels. The selective treatment of the panel top and bottom surfaces provides selective interruptions in the vertical conductors.

公开(公告)号：EP0535491B1

公开(公告)日：1995-02-08

申请号：EP92116098.2

申请日：1992-09-21

Applicant: Bodenseewerk Gerätetechnik GmbH

Inventor： Neumann, Werner

IPC: H05K3/36 ,  H01R9/09

CPC classification number: H01R12/62 ,  H05K3/281 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/363 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/09736 ,  H05K2201/10666 ,  H05K2201/10977

公开(公告)号：EP0613331A1

公开(公告)日：1994-08-31

申请号：EP94101655.2

申请日：1994-02-03

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Hans-Bodo, Laue, Ing.

IPC: H05K3/34 ,  H05K3/36

CPC classification number: H05K3/363 ,  H05K1/141 ,  H05K1/162 ,  H05K1/167 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09772 ,  H05K2201/10666 ,  H05K2201/10689 ,  H05K2203/0455

Abstract: Hybrid-Schaltungen werden üblicherweise mit Kontaktstiften (Kämmen) auf den jeweiligen Leiterplatten durch Einbringen in ein Schwallbad befestigt. Weiterhin werden auf der Leiterplatte oberflächenmontierbare Bauteile in einem Ofen aufgelötet. Zu diesem Zweck sind zwei Lötvorgänge nötig. Das erfindungsgemäße Verfahren schafft hier Abhilfe, indem auf dem Trägersubstrat der Hybrid-Schaltung (H) durchkontaktierte Bohrungen (B) angebracht werden. Diese werden auf mit einer Lötpaste versehene Lötflächen der Leiterplatte (L) aufgesetzt und die gesamte Anordnung in einem Ofen gelötet.

Abstract translation: 混合电路通常通过放置在浸焊槽中而与接触针（梳）连接在相应的印刷电路板上。 表面贴装元件另外还在烤箱中焊接到印刷电路板上。 为此目的需要两个焊接步骤。 根据本发明的方法在这方面提供了改进，因为在混合电路（H）的支撑衬底上形成通孔（B）。 将它们放置在设置有焊膏的印刷电路板（L）的焊接表面上，并且将整个布置焊接在烘箱中。