公开(公告)号：EP1890872A1

公开(公告)日：2008-02-27

申请号：EP06760562.6

申请日：2006-05-31

Applicant: Texas Instruments Incorporated

Inventor： EDWARDS, Darvin, R. ,  CHIU, Tz-cheng ,  ZENG, Kejun

IPC: B32B15/08 ,  B32B15/20 ,  H01L23/532

CPC classification number: H05K3/3436 ,  H01L21/4846 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/09 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T428/12715 ,  Y10T428/1291 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A metal interconnect structure (100) comprising a bond pad (101), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 μm in their main direction, and 30 or less volume percent composed of crystal grains, which expand less than 1 μm in their main crystal direction. A body (102) of tin alloy is in contact with the bond pad.

公开(公告)号：EP1253650A3

公开(公告)日：2008-02-20

申请号：EP02009479.3

申请日：2002-04-25

Applicant: Avago Technologies ECBU IP (Singapore) Pte. Ltd.

Inventor： Yogandan, Sundar a/l Natarajan ,  Choon, Lim Seong

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L33/54 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/3025 ,  H05K1/183 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/0394 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned aperture. A light emitting diode is mounted on a metallic layer covering the bottom of the aperture, and is encapsulated by a transparent encapsulant material. The metallic layer provides a thermal path for heat generated by the light emitting diode.

公开(公告)号：EP1267597B1

公开(公告)日：2008-01-16

申请号：EP02013103.3

申请日：2002-06-13

Applicant: Denso Corporation

Inventor： Kondo, Koji, c/o DENSO CORPORATION ,  Yokochi, Tomohiro, c/o DENSO CORPORATION ,  Miyake, Toshihiro, c/o DENSO CORPORATION ,  Takeuchi, Satoshi, c/o DENSO CORPORATION

IPC: H05K3/46 ,  H05K1/18

CPC classification number: H05K1/186 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0394 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05624

公开(公告)号：EP1850647A1

公开(公告)日：2007-10-31

申请号：EP06712216.8

申请日：2006-01-24

Applicant: MITSUBISHI PLASTICS, INC.

Inventor： YAMADA, Shingetsu

IPC: H05K3/46

CPC classification number: H05K3/4617 ,  H05K3/4626 ,  H05K2201/0129 ,  H05K2201/0394 ,  H05K2201/10378

Abstract: A multilayer printed circuit board is characterized in that circuit boards 1 and 2 and a circuit board 3 are laminated alternately to form a multilayer body using a simultaneous lamination method, the circuit boards 1 and 2 including a film-, thin plate-, or sheet-like insulating substrate 11 made of a thermosetting resin containing any one of epoxy resin, bismaleimide/triazine resin, and allylic polyphenylene ether resin as a major component, the circuit board 3 including a film-, thin plate-, or sheet-like insulating substrate 21 made of a thermoplastic resin containing a polyaryl ketone resin and amorphous polyether imide resin having a crystal-fusing peak temperature of 260°C or more. By the present invention, it is possible to provide a multilayer printed circuit board which has small fusion or flow deformation at the time of simultaneous lamination, which does not have unevenness in positional precision in the lamination direction, which has no need for the processes to be readjusted, and which has high reliability in interlayer electrical connection.

Abstract translation: 多层印刷电路板的特征在于，电路板1和2以及电路板3交替层叠以使用同时层压方法形成多层体，电路板1和2包括薄膜，薄板或片材 由含有环氧树脂，双马来酰亚胺/三嗪树脂和烯丙基聚苯醚树脂中的任何一种作为主要组分的热固性树脂制成的绝缘基板11，电路板3包括薄膜，薄板或片状绝缘体 由含有聚芳基酮树脂和结晶熔融峰值温度为260℃以上的无定形聚醚酰亚胺树脂的热塑性树脂构成的基材21。 根据本发明，能够提供一种同时层叠时熔融或流动变形小，层叠方向的位置精度不均匀的多层印刷电路板，不需要进行 重新调整，并且层间电连接具有高可靠性。

公开(公告)号：EP1827065A2

公开(公告)日：2007-08-29

申请号：EP07075318.1

申请日：1998-01-23

Applicant: IBIDEN CO., LTD.

Inventor： Takada, Masaru c/o Ibiden Co., Ltd. ,  Tsukada, Kiyotaka c/o Ibiden Co., Ltd. ,  Kobayashi, Hiroyuki c/o Ibiden Co., Ltd. ,  Minoura, Hisashi c/o Ibiden Co., Ltd. ,  Ukai, Yoshikazu c/o Ibiden Co., Ltd. ,  Kondo, Mitsuhiro c/o Ibiden Co., Ltd.

IPC: H05K3/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4652 ,  H01L21/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/0366 ,  H05K1/112 ,  H05K1/116 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/385 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2203/0315 ,  H05K2203/041 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A method of producing a printed wiring board (3) comprising a mounting recess portion (1) for mounting an electronic part, a conductor pattern (7), and a heat-sink plate (6) arranged at the bottom of the mounting recess portion (1), characterized in that a conductor pattern (7) is formed on an insulating substrate (5);
a heat-sink plate (6) is adhered to a lower face of a portion of the insulating substrate (5) forming the mounting recess portion; and
a laser beam (2) is irradiated to an upper face of the portion (10) forming the mounting recess portion to form a mounting recess portion (1).

Abstract translation: 一种印刷电路板（3）的制造方法，其特征在于，具备安装电子部件的安装凹部（1），导体图案（7），以及配置在安装凹部的底部的散热板 （1），其特征在于，在绝缘基板（5）上形成导体图案（7）。 散热板（6）粘附到形成安装凹部的绝缘基板（5）的一部分的下表面; 并且激光束（2）照射到形成安装凹部的部分（10）的上表面以形成安装凹部（1）。

公开(公告)号：EP0966185B1

公开(公告)日：2007-05-30

申请号：EP98900044.3

申请日：1998-01-05

Applicant: IBIDEN CO., LTD.

Inventor： TAKADA, Masaru ,  KOBAYASHI, Hiroyuki ,  CHIHARA, Kenji ,  MINOURA, Hisashi ,  TSUKADA, Kiyotaka ,  KONDO, Mitsuhiro

IPC: H05K3/00 ,  H05K3/34 ,  H05K3/24 ,  H05K3/28 ,  H05K1/11

CPC classification number: H05K3/28 ,  H01L24/32 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15184 ,  H01L2924/15311 ,  H05K1/112 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01033

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract translation: 一种印刷电路板的制造方法，其中在绝缘基板（107）的表面上形成导体电路（106）。 接着，在所述绝缘基板（107）的表面上印刷由热固性树脂制成的阻焊剂。 然后通过热固化阻焊剂形成热膨胀系数等于或小于100ppm /℃的绝缘膜（101）。 接着，通过向绝缘膜（101）的开口部形成部照射激光而使该开口部形成部的绝缘膜（101）燃烧，形成开口部（110） ）。

公开(公告)号：EP0722264B1

公开(公告)日：2007-02-28

申请号：EP96300028.6

申请日：1996-01-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yamamoto, Osamu

IPC: H05K1/18 ,  H05K1/14 ,  H05K3/20

CPC classification number: H01R9/2466 ,  H05K1/0298 ,  H05K1/141 ,  H05K1/142 ,  H05K1/184 ,  H05K3/202 ,  H05K3/325 ,  H05K3/3447 ,  H05K3/4084 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09118 ,  H05K2201/0969

公开(公告)号：EP1744609A2

公开(公告)日：2007-01-17

申请号：EP06123074.4

申请日：2000-05-25

Applicant: IBIDEN CO., LTD.

Inventor： Asai, Motoo Ogaki-kita-kojou, Ibiden Co., Ltd. ,  Wang, Dongdong Ogaki-kita-kojou, Ibiden Co., Ltd. ,  Mori, Takahiro Ogaki-kita-kojou, Ibiden Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: The present invention relates to a multi-layer printed circuit board comprising a core substrate having through holes; and an interlayer resin insulating layer built up on said core substrate, wherein said through holes are constituted by filling a first metal layer formed by electroplating, a metal film formed by electroless plating, sputtering or evaporation and a second metal layer formed by electroplating.

Abstract translation: 本发明涉及包括具有通孔的芯基板的多层印刷电路板; 以及在所述芯基板上形成的层间树脂绝缘层，其中所述通孔由填充由电镀形成的第一金属层，通过无电镀，溅射或蒸发形成的金属膜和通过电镀形成的第二金属层构成。

公开(公告)号：EP1453364A4

公开(公告)日：2007-01-17

申请号：EP02747661

申请日：2002-07-12

Applicant: AJINOMOTO KK

Inventor： YOKOTA TADAHIKO ,  NAKAMURA SHIGEO

IPC: B32B15/08 ,  B32B27/08 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  B32B27/38

CPC classification number: H05K3/387 ,  B32B15/08 ,  B32B27/08 ,  H05K1/036 ,  H05K3/181 ,  H05K3/381 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2203/0264 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/265 ,  Y10T428/2804 ,  Y10T428/2852 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529

Abstract: A film for a circuit board, characterized in that it comprises the following A layer and B layer which are adjacent to each other: A layer: a heat-resistant resin layer having a thickness of 2 to 250 μm which comprises a heat-resistant resin having a glass transition temperature of 200˚C or higher or a decomposition temperature of 300˚C or higher, and B layer: a cured resin layer capable of being roughened which has a thickness of 5 to 20 μm and comprises a thermoset product derived from a thermosetting resin composition comprising the component (a) of an epoxy resin having two or more epoxy groups in one molecule thereof and the component (b) a curing agent for an epoxy resin and capable of being roughened by the use of an oxidizing agent. The film allows the production of a circuit board being excellent in the adhesion strength of a conductive layer with ease and simplicity.

公开(公告)号：EP1194022B1

公开(公告)日：2006-11-02

申请号：EP00931571.4

申请日：2000-05-25

Applicant: IBIDEN CO., LTD.

Inventor： ASAI, Motoo, Ogaki-kita-kojou, Ibiden Co., Ltd. ,  WANG, Dongdong, Ogaki-kita-kojou, Ibiden Co., Ltd. ,  MORI, Takahiro, Ogaki-kita-kojou, Ibiden Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: A multilayer printed wiring board in which the strength is ensured by sandwiching a metal layer (18) between insulating layers (14, 20), thereby a core sheet (30) can be thin, and the thickness of the multilayer printed wiring board is reduced. Moreover, since a blind hole (22) extending to the metal layer (18) is formed only in insulating layers (14, 20), the fine blind hole (22) can easily be made by a laser beam, and a through hole (36) having a small diameter can be formed.

Abstract translation: 金属层18被夹在绝缘层14之间和20，从而没必要的强度得以保持。 因此它遵循，芯的DASS模具厚度基片30可以减小，因此，多层印刷电路板的厚度可以减小。 非贯通孔22，其在绝缘层14和20到达金属层18的形成是简单地需要。 因此，小的非贯通孔22能够容易地通过施加激光束形成的。 因此，通过具有小直径的每个孔36可以被形成。