公开(公告)号：EP1119048A4

公开(公告)日：2007-07-04

申请号：EP99944820

申请日：1999-09-24

Applicant: TOYO KOHAN CO LTD

Inventor： SAIJO KINJI ,  YOSHIDA KAZUO ,  OHSAWA SINJI

IPC: H01L23/50 ,  B23K20/04 ,  B23K20/233 ,  H01L21/48 ,  H01L23/495 ,  H05K3/06 ,  H05K3/20 ,  H05K3/40

CPC classification number: H01L21/4842 ,  B23K20/04 ,  B23K20/233 ,  B23K2201/34 ,  B23K2203/10 ,  B23K2203/12 ,  B23K2203/18 ,  B23K2203/26 ,  H01L23/49582 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H05K3/062 ,  H05K3/202 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49204 ,  Y10T428/12438 ,  Y10T428/1275 ,  Y10T428/1291 ,  H01L2224/48

Abstract: A clad plate for lead frames, capable of being manufactured at a low cost and having excellent characteristics; a lead frame using the same; and a method of manufacturing the lead frame, the clad plate for lead frames being manufactured by pressure-welding a copper foil material and a nickel foil material to each other at a draft of 0.1-3 %, or by pressure-welding a copper foil material plated at one or both surfaces thereof with nickel and other copper foil material to each other at a draft of 0.1-3 %, or by pressure-welding an aluminum foil material and a nickel foil material to each other at a draft of 0.1-3 %, or by pressure-welding a copper foil material plated at one surface thereof with nickel and an aluminum foil material other than the aluminum foil material mentioned above to each other at a draft of 0.1-3 %, the clad plate having a structure of three layers of copper, nickel and copper, or copper, nickel and aluminum.

公开(公告)号：EP1797748A1

公开(公告)日：2007-06-20

申请号：EP05802576.8

申请日：2005-09-29

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE

Inventor： DAVOINE, Cécile ,  FENDLER, Manuel

IPC: H05K3/34

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/114 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/116 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/83894 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10977 ,  H05K2203/0278 ,  Y10T29/49126 ,  H01L2224/13099 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: The invention concerns a method for electric connection between a first component (10) comprising, on one side, a set of first contact pads (8) and a set of hard conductive tips (13) and a second component (11) comprising, on one side a set of second pads (9) and a set of ductile conductive bumps (14), which consists in placing opposite each other both sides and bringing them closer together such that the tips (13) may penetrate into said bumps (14), said bumps being buried. The invention also concerns a component equipped with a set of buried ductile conductive bumps.

公开(公告)号：EP1783867A3

公开(公告)日：2007-06-20

申请号：EP06450159.6

申请日：2006-11-07

Applicant: I & T Innovation Technology Entwicklungs- und Holding Aktiengesellschaft

Inventor： Ziegler, Wolfgang

IPC: H01R12/12

CPC classification number: H01R12/62 ,  H01R9/2466 ,  H01R43/24 ,  H01R2201/26 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/326 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10356 ,  H05K2201/1059 ,  H05K2201/10598

Abstract: Die Erfindung betrifft ein Verfahren zum Herstellen einer elektrischen Verbindung zwischen einem Kabel (1) mit einem oder einer Vielzahl von elektrischen Leitern (1.1) und einer Schaltung (2) auf einem dreidimensionalen, insbesondere spritzgegossenen Schaltungsträger (3), umfassend die folgenden Schritte:
- auf dem Schaltungsträger (3) wird ein Kontaktelement (4) ausgebildet, welches eine erhabene, metallisierte Oberfläche (4.1) aufweist, die mit der Schaltung (3) elektrisch verbunden ist;
- in dem Kabel (1) wird eine Aussparung (5) in Form eines Durchgangsloches vorgesehen, wobei
- die Aussparung (5) derart in das Kabel (1) eingebracht wird, dass sie wenigstens einen Leiter (1.1) in dem Kabel (1) vollständig durchdringt und dadurch eine leitende Oberfläche des Leiters (1.1) freilegt;
- das Kabel (1) wird derart mit seiner Aussparung auf das Kontaktelement (4) geschoben, dass die freigelegte leitende Oberfläche des Leiters in einen elektrisch leitenden Kontakt mit der metallisierten Oberfläche (4.1) des Kontaktelementes (4) gelangt.

Des weiteren betrifft die vorliegende Erfindung eine Baugruppe aus einem dreidimensionalen Schaltungsträger und einem Kabel mit einer entsprechenden elektrisch leitenden Verbindung zwischen den Bauteilen.

公开(公告)号：EP1792528A2

公开(公告)日：2007-06-06

申请号：EP05802474.6

申请日：2005-09-13

Applicant: OBERTHUR CARD SYSTEMS SA ,  Francois Charles Oberthur Fiduciaire

Inventor： ENOUF, Guy ,  BORDE, Xavier ,  DEMAIMAY, Florian

IPC: H05K1/02

CPC classification number: H01L23/66 ,  G06K19/07745 ,  G07D7/01 ,  H01L23/13 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83138 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01094 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/18301 ,  H05K3/326 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T428/25 ,  Y10T428/2804 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: The invention concerns a method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component (40) comprising connection pads, whereof one predetermined pad (41A) is provided with a bump (42); providing a support (30) comprising at least one terminal (31) to be electrically connected to said predetermined pad via said bump; aligning said predetermined pad provided with the bump with said terminal; contacting said bump and said terminal and assembling them in specific temperature and pressure conditions. Prior to contacting and fixing said bump and said terminal, the surface of said terminal is covered with an insulating layer (32), said insulating layer being a material selected so as to be traversed by said bump in said temperature and pressure conditions.

公开(公告)号：EP1403686B1

公开(公告)日：2007-05-16

申请号：EP03028996.1

申请日：1998-03-04

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Shiota, Motoji ,  Inada, Kiyoshi ,  Yoshida, Hirokazu

IPC: G02F1/13 ,  H01L21/60 ,  H05K3/32

CPC classification number: H01L24/83 ,  G02F1/13452 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/0367 ,  H05K2201/09709 ,  H05K2201/10674 ,  H01L2924/00

公开(公告)号：EP1691206A3

公开(公告)日：2006-08-30

申请号：EP06075592.3

申请日：1996-04-30

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Wood, Alan G. ,  Farnworth, Warren M. ,  Akram, Salman ,  Hembree, David R.

IPC: G01R31/02 ,  G01R1/073 ,  G01R31/28 ,  G01R1/04 ,  H01L21/66

CPC classification number: G01R1/07314 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R3/00 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  G01R31/2893 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/80 ,  H01L24/85 ,  H01L2224/16145 ,  H01L2224/48 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: A method and apparatus for testing unpackaged semiconductor dice includes a mother board (10) and a plurality of interconnects (12) mounted on the mother board (10) and adapted to establish a temporary electrical connection with the dice (14). The interconnects (12) can be formed with a silicon substrate (20) and raised contact members (16) for contacting the bond pads (22) of a die (14). Alternately the interconnects (16) can be formed with micro bump contact members (16) mounted on an insulating film (74). The mother board (10) allows each die (14) to be tested separately for speed and functionality and to also be burn-in tested in parallel using standard burn-in ovens. In an alternate embodiment testing is performed using a mother board/daughter board arrangement. Each daughter board (82) includes interconnects (12) that allow the dice (14) to be tested individually for speed and functionality. Multiple daughter boards (82) can then be mounted to the mother board (10) for burn-in testing using standard burn-in ovens.

Abstract translation: 用于测试未封装半导体晶片的方法和装置包括安装在母板（10）上的母板（10）和多个互连（12），并适于建立与芯片（14）的临时电连接。 互连（12）可以形成有用于接触管芯（14）的接合焊盘（22）的硅衬底（20）和凸起的接触构件（16）。 或者，互连（16）可以形成有安装在绝缘膜（74）上的微凸块接触构件（16）。 母板（10）允许每个模具（14）单独测试速度和功能，并且还可以使用标准老化炉并行测试。 在替代实施例中，使用母板/子板布置进行测试。 每个子板（82）包括允许骰子（14）单独测试速度和功能的互连（12）。 然后可以将多个子板（82）安装到母板（10）上，以使用标准老化烤箱进行老化测试。

公开(公告)号：EP1632354A2

公开(公告)日：2006-03-08

申请号：EP05025554.6

申请日：2003-09-24

Applicant: Brother Kogyo Kabushiki Kaisha

Inventor： Shinkai, Yuji Technology Planning & IP Dept.

IPC: B41J2/14 ,  B41J2/16

CPC classification number: H05K3/363 ,  B41J2/14209 ,  B41J2/1609 ,  B41J2/1623 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14459 ,  B41J2002/14491 ,  B41J2202/20 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10977 ,  H05K2201/2036 ,  Y10T29/42 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49401

Abstract: A surface electrode is provided on a surface of a piezoelectric, element for changing the volume of each pressure chamber in an inkjet head. The surface electrode has a main electrode portion opposed to the pressure chamber and a connecting portion not opposed to the pressure chamber. A land is provided on one end of the connecting portion of the surface electrode. The land is electrically connected to the surface electrode. When the land is connected to a terminal of an FPC, a driving signal can be transmitted to the surface electrode. The land is therefore connected to the terminal using solder and a thermosetting resin covering the surface of the solder, or using only a thermosetting resin.

Abstract translation: 表面电极设置在用于改变喷墨头中的每个压力室的容积的压电元件的表面上。 表面电极具有与压力室相对的主电极部分和不与压力室相对的连接部分。 在表面电极的连接部分的一端上提供焊盘。 焊盘电连接到表面电极。 当焊盘连接到FPC的端子时，驱动信号可以传输到表面电极。 因此，焊盘使用覆盖焊料表面的焊料和热固性树脂或仅使用热固性树脂连接到端子。

公开(公告)号：EP1403685B1

公开(公告)日：2005-11-09

申请号：EP03028995.3

申请日：1998-03-04

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Shiota, Motoji ,  Inada, Kiyoshi ,  Yoshida, Hirokazu

IPC: G02F1/13 ,  H01L21/60 ,  H05K3/32

CPC classification number: H01L24/83 ,  G02F1/13452 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/0367 ,  H05K2201/09709 ,  H05K2201/10674 ,  H01L2924/00

公开(公告)号：EP1554915A1

公开(公告)日：2005-07-20

申请号：EP03726799.4

申请日：2003-05-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hougham, Gareth G. ,  Fogel, Keith E. ,  Lauro, Paul A. ,  Zinter, Joseph

IPC: H05K1/00 ,  D03D15/00

CPC classification number: H01R13/2414 ,  H01R12/7082 ,  H01R12/714 ,  H01R43/007 ,  H05K3/4007 ,  H05K3/42 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0959 ,  H05K2201/10378 ,  Y10S439/931 ,  Y10T442/109 ,  Y10T442/172

Abstract: Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic.Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there isprovided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets,and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them intoconductive electrical contacts.

公开(公告)号：EP0863426B1

公开(公告)日：2004-09-22

申请号：EP98103837.5

申请日：1998-03-04

Applicant: Sharp Kabushiki Kaisha

Inventor： Shiota, Motoji ,  Inada, Kiyoshi ,  Yoshida, Hirokazu

IPC: G02F1/13 ,  H01L21/60

CPC classification number: H01L24/83 ,  G02F1/13452 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/0367 ,  H05K2201/09709 ,  H05K2201/10674 ,  H01L2924/00