公开(公告)号：EP2809135B1

公开(公告)日：2017-07-19

申请号：EP14170461.9

申请日：2014-05-29

Applicant: Mavel S.r.l. ,  IFP Énergies nouvelles

Inventor： Bettoni, Davide ,  Stirano, Giorgio

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/0204 ,  H05K1/0206 ,  H05K1/0265 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/42 ,  H05K2201/09236 ,  H05K2201/09309 ,  H05K2201/09609 ,  H05K2201/0979 ,  H05K2201/10022 ,  H05K2201/10053 ,  H05K2201/10166

Abstract: What is described is an electronic device (1) comprising a power component (3) and a printed circuit board (2) . The power component comprises a main body (30) and a lead (31) . The printed circuit board comprises at least two conductive layers (21) parallel to a plane xy, a mounting element (23) and a conductor (24) . The mounting element and the conductor respectively comprise first (23b) and second (24b) conductive tubes, which elongate through a thickness of the printed circuit board along a direction z substantially perpendicular to the plane xy. The main body of the power component is fixed to the mounting element, while the lead thereof is fixed to the conductor.

Abstract translation: 所描述的是包括功率部件（3）和印刷电路板（2）的电子设备（1）。 功率元件包括主体（30）和引线（31）。 印刷电路板包括至少两个平行于平面xy的导电层（21），安装元件（23）和导体（24）。 安装元件和导体分别包括第一导电管（23b）和第二导电管（24b），其沿着基本上垂直于平面xy的方向z延伸穿过印刷电路板的厚度。 功率元件的主体固定在安装元件上，而其引线固定在导体上。

公开(公告)号：EP2829163A2

公开(公告)日：2015-01-28

申请号：EP13711574.7

申请日：2013-03-19

Applicant: Giesecke & Devrient GmbH

Inventor： BALDISCHWEILER, Michael ,  BOHN, Carsten

IPC: H05K1/11 ,  H05K3/40 ,  G06K19/077 ,  H05K1/09 ,  H05K1/16 ,  H05K3/12 ,  H05K3/00

CPC classification number: H05K1/116 ,  G06K19/0772 ,  G06K19/07754 ,  H05K1/092 ,  H05K1/165 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/4069 ,  H05K2201/0266 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/09854 ,  H05K2201/10098 ,  H05K2203/1453

Abstract: A substrate (1) for a portable data carrier (10) comprises an electrical component (2, 3), such as an antenna, which has two parts applied on mutually opposite surfaces of the substrate (1). The parts of the electrical component (2, 3) comprise an electrically conductive material and are electrically conductively connected to one another in through-plating regions (4, 5, 6, 7) of the substrate (1) through perforations (8, 13) of the substrate (1). The perforations (8, 13) are produced by means of a laser and have a maximum width of a maximum of 20 μm. A through-plating region (4, 5, 6, 7) preferably has a multiplicity of perforations (8, 13) distributed over the through-plating region (4, 5, 6, 7).

Abstract translation: 用于便携式数据载体（10）的基板（1）包括诸如天线的电气部件（2,3），其具有施加在基板（1）的相互相对的表面上的两个部分。 电气部件（2,3）的部件包括导电材料，并且通过穿孔（8,13）在基板（1）的穿镀区域（4,5,6,7）中彼此导电地连接 ）的基板（1）。 穿孔（8,13）通过激光产生，最大宽度最大为20um。 穿透区域（4,5,6,7）优选地具有分布在通镀区域（4,5,6,7）上的多个穿孔（8,13）。

公开(公告)号：EP2454781A4

公开(公告)日：2013-01-16

申请号：EP09847410

申请日：2009-07-14

Applicant: SAAB AB

Inventor： VICKES HANS-OLOF ,  KRISTIANSSON SIMON

IPC: H01P1/203 ,  H01P5/02 ,  H05K1/02 ,  H05K1/16

CPC classification number: H05K1/0251 ,  H01P1/20372 ,  H01P5/028 ,  H05K1/0222 ,  H05K1/0227 ,  H05K1/0239 ,  H05K2201/09609 ,  H05K2201/0979

Abstract: A filter unit and a corresponding printed circuit board. The filter unit and the printed circuit board have been equipped with modified end portions being matched such that a number of filter units can be used on the printed circuit board without changing the printed circuit board.

公开(公告)号：EP2397745A3

公开(公告)日：2012-09-19

申请号：EP11169813.0

申请日：2011-06-14

Applicant: Toshiba Lighting & Technology Corporation

Inventor： Shibusawa, Soichi ,  Betsuda, Nobuhiko ,  Nishimura, Kiyoshi ,  Matsuda, Shuhei ,  Kumagai, Masatoshi

IPC: F21K99/00 ,  F21V9/00 ,  F21Y101/02

CPC classification number: H05K1/181 ,  F21K9/00 ,  F21K9/64 ,  F21S8/04 ,  F21V19/0055 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48137 ,  H05K2201/0979 ,  H05K2201/10106 ,  Y02P70/611 ,  H01L2924/00014

Abstract: According to one embodiment, a light-emitting device (1) includes a substrate (2), a plurality of light-emitting elements (3) and a sealing resin (4). The substrate (2) is formed in a substantially rectangular shape. The plurality of light-emitting elements (3) forms a plurality of rows (30) by being arranged in a direction perpendicular to a longer dimension of the substrate (2). The rows (30) are arranged in a longer direction of the substrate (2) with a gap provided therebetween. The gap is set between the rows (30) such that illumination intensity is evenly produced. The sealing resin (4) coves each of the rows (30) of the light-emitting elements (3).

公开(公告)号：EP2011376B1

公开(公告)日：2012-04-18

申请号：EP07742003.2

申请日：2007-04-13

Applicant: Panasonic Corporation

Inventor： KAWANO, Hiroshi c/o Panasonic Corporation ,  FUJIMURA, Munenori c/o Panasonic Corporation ,  NARUSE, Takumi c/o Panasonic Corporation ,  YAMAGUCHI, Shuichiro c/o Panasonic Corporation ,  HASHIMOTO, Yoshinori c/o Panasonic Corporation

IPC: H05K1/02 ,  H05K1/18 ,  H04B3/54 ,  H04B3/56

CPC classification number: H05K1/0243 ,  H01L2224/82047 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H04B3/54 ,  H04B3/56 ,  H04B2203/5483 ,  H04L27/2626 ,  H04L27/2647 ,  H05K1/112 ,  H05K1/186 ,  H05K3/4614 ,  H05K2201/09509 ,  H05K2201/0979 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10689 ,  H05K2203/061

Abstract: A circuit module is mounted with an IC that modulates and demodulates a multicarrier signal. The circuit module has a laminated board, which is provided internally with a plurality of conductive layers laminated having insulating layers in between, and an IC, which is provided with a plurality of ground terminals to be grounded. Of the plurality of conductive layers, a conductive layer provided proximate to the IC configures a ground layer electrically connected to the plurality of ground terminals.

公开(公告)号：EP2152050B1

公开(公告)日：2011-10-26

申请号：EP09167291.5

申请日：2009-08-05

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hayashi, Seiji

IPC: H05K1/11 ,  H05K1/02 ,  H01L23/498

CPC classification number: H05K1/116 ,  H01L23/49827 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0265 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/09745 ,  H05K2201/0979 ,  H05K2201/10734 ,  H01L2924/00

公开(公告)号：EP2134147A3

公开(公告)日：2011-04-13

申请号：EP09161821.5

申请日：2009-06-03

Applicant: Valeo Equipements Electriques Moteur

Inventor： Mandion, Thierry ,  Chemin, Michaël

IPC: H05K3/34

CPC classification number: H05K3/3421 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3452 ,  H05K2201/0979 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/09918 ,  H05K2201/10166 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00

Abstract: L'invention concerne un procédé de positionnement d'un circuit intégré (3) du type dit à montage en surface, notamment du type "D 2 PAK-7", et de soudure sur un substrat à plages métallisées isolées (50 à 52). Typiquement les plages métallisées isolées sont en cuivre et ont une épaisseur supérieure ou égale à 50 microns. La distance séparant (L 7 ) les plages métallisées sous-jacentes aux broches de grille (31) et de première source (32) étant critique, cette distance est rendue égale à celle séparant les deux broches (31, 32). Pour pouvoir opérer un positionnement et un alignement optiques des broches (31 à 33, 35 à 37) par rapport aux plages métallisées (50 à 52), on dépose entre les paires de broches des bandes (40 à 43) de vernis isolant formant repères d'index.

公开(公告)号：EP2048745A3

公开(公告)日：2011-03-09

申请号：EP08166056.5

申请日：2008-10-08

Applicant: Würth Elektronik ICS GmbH & Co. KG

Inventor： Wittig, Klaus ,  Kallee, Werner

IPC: H01R12/34

CPC classification number: H01R12/585 ,  H01H1/5805 ,  H01H50/14 ,  H01H85/0417 ,  H01H2085/0412 ,  H05K3/308 ,  H05K3/3426 ,  H05K2201/0979 ,  H05K2201/10053 ,  H05K2201/10856 ,  Y02P70/613

Abstract: Die Erfindung schlägt vor, Steckelemente wie Schaltelemente, beispielsweise Relais oder Sicherungen, anstelle von Flachsteckzungen mit Kontaktstiften (3) zu versehen, die dort angeordnet sind, wo die Seitenkanten der bisherigen Flachsteckzungen angeordnet sind. Für jede Flachsteckzunge wird also ein Paar von Kontaktstiften verwendet, gegebenenfalls auch ein dritter Kontaktstift in der Mitte. Diese Kontaktstifte lassen sich in durchkontaktierte Bohrungen (5) einer Leiterplatte (4) einpressen, so dass zur Anbringung eines solchen Schaltelements oder Steckelements kein Sockel mehr erforderlich ist.
Auch eine direkte Verbindung der Schaltelemente in SMT Technik wird vorgeschlagen.

公开(公告)号：EP1827063A3

公开(公告)日：2009-11-25

申请号：EP07003621.5

申请日：2007-02-22

Applicant: MINEBEA Co., Ltd.

Inventor： Ohno, Yasuo ,  Ota, Chiharu

IPC: H05K1/11 ,  H01L33/00

CPC classification number: H05K1/112 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0085 ,  H01L33/64 ,  H01L33/641 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/0209 ,  H05K2201/09072 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: In a spread illuminating apparatus including: an LED (3) at a side surface of a light conductor plate; and an FPC (10) having a land (26) formed on a side thereof for mounting the LED, throughholes (42) are formed at the land, and solder is contained at least partly in each of the throughholes, whereby the LED can be mounted solidly on the FPC with a high precision in height position from the FPC, and at the same time the heat emitted from the LED can be efficiently conducted to a conductive pattern at the rear side of the FPC through an electrode terminal of the LED and the throughholes filled with the solder composed of a metallic material having a high heat conductance.

公开(公告)号：EP1921904A4

公开(公告)日：2009-09-23

申请号：EP06766615

申请日：2006-06-13

Applicant: MURATA MANUFACTURING CO

Inventor： MATSUBARA DAIGO ,  CHIKAGAWA OSAMU

IPC: H05K3/46 ,  H01L23/13

CPC classification number: H05K3/4007 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/113 ,  H05K1/115 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0367 ,  H05K2201/0979 ,  H05K2203/308 ,  Y10T29/49163 ,  H01L2224/05599

Abstract: A ceramic electronic component is provided which can realize a sufficient drop resistance strength even when terminal electrodes are formed at a higher density. A ceramic electronic component 10 of the present invention has a ceramic laminate 11 composed of ceramic laminates 11A which are laminated to each other, first terminal electrodes 13 disposed in a peripheral portion of a bottom surface of the ceramic laminate 11, catch pad electrodes 15A provided in the ceramic laminate 11 to face the respective first terminal electrodes 13, and sets each including at least two first via hole conductors 16A and 16B, which electrically connect the first terminal electrodes 13 and the respective catch pad electrodes 15A.