公开(公告)号：EP2474211B1

公开(公告)日：2014-03-05

申请号：EP10747865.3

申请日：2010-09-02

Applicant: Applied Materials, Inc.

Inventor： GALIAZZO, Marco ,  BACCINI, Andrea ,  CELLERE, Giorgio ,  DE SANTI, Luigi ,  PASQUALIN, Gianfranco ,  VERCESI, Tommaso

IPC: H01L31/18 ,  H05K1/02 ,  H05K3/12 ,  H01L31/0224

CPC classification number: H05K1/0269 ,  H01L31/1876 ,  H05K3/12 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/09918 ,  H05K2203/1476 ,  H05K2203/166 ,  H05K2203/173 ,  Y02E10/50 ,  Y02P70/521

公开(公告)号：EP1873827A4

公开(公告)日：2014-01-01

申请号：EP06731255

申请日：2006-04-06

Applicant: TOYOTA JIDOSHOKKI KK ,  SHOWA DENKO KK

Inventor： OTOSHI KOTA ,  KONO EIJI ,  KUBO HIDEHITO ,  KIMBARA MASAHIKO ,  FURUKAWA YUICHI ,  YAMAUCHI SHINOBU ,  HOSHINO RYOICHI ,  WAKABAYASHI NOBUHIRO ,  NAKAGAWA SHINTARO

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/473 ,  H05K1/03 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/0373 ,  H05K2201/09681 ,  H05K2201/0969 ,  Y02P70/613 ,  H01L2924/00

Abstract: A heat radiator (1) includes an insulating substrate (3) whose first side serves as a heat-generating-element-mounting side, and a heat sink (5) fixed to a second side of the insulating substrate (3). A metal layer (7) is formed on a side of the insulating substrate (3) opposite the heat-generating-element-mounting side. A stress relaxation member (4) intervenes between the metal layer (7) of the insulating substrate (3) and the heat sink (5). The stress relaxation member (4) is formed of an aluminum plate (10) having a plurality of through holes (9) formed therein, and the through holes (9) serve as stress-absorbing spaces. The stress relaxation member (4) is brazed to the metal layer (7) of the insulating substrate (3) and to the heat sink (5). This heat radiator (1) is low in material cost and exhibits excellent heat radiation performance.

公开(公告)号：EP2573951A1

公开(公告)日：2013-03-27

申请号：EP11783425.9

申请日：2011-05-11

Applicant: Sony Corporation

Inventor： KIKUCHI, Hidekazu ,  MOGI, Takayuki ,  AKIYAMA, Yoshiyuki ,  KAWAMURA, Hirofumi

IPC: H04B5/02 ,  H01P5/107 ,  H04B1/40 ,  H04B3/02

CPC classification number: H01P5/02 ,  H01P1/208 ,  H01P3/12 ,  H01P3/121 ,  H01P3/165 ,  H01P5/024 ,  H01P5/082 ,  H01P5/087 ,  H01P5/1022 ,  H01P5/107 ,  H01P5/18 ,  H01P5/182 ,  H01P5/188 ,  H01R13/6461 ,  H01R13/665 ,  H01R24/28 ,  H01R24/76 ,  H01R2103/00 ,  H04B3/56 ,  H04B7/24 ,  H05K1/0225 ,  H05K1/0239 ,  H05K2201/093 ,  H05K2201/09672 ,  H05K2201/0969 ,  H05K2201/09754

Abstract: A signal transmission system including: a first connector apparatus, and a second connector apparatus that is coupled with the first connector apparatus. The first connector apparatus and the second connector apparatus are coupled together to form an electromagnetic field coupling unit, and a transmission object signal is converted into a radio signal, which is then transmitted through the electromagnetic field coupling unit, between the first connector apparatus and the second connector apparatus.

Abstract translation: 一种信号传输系统，包括：第一连接器装置和与第一连接器装置耦合的第二连接器装置。 第一连接器装置和第二连接器装置耦合在一起以形成电磁场耦合单元，并且传输对象信号被转换成无线电信号，然后通过电磁场耦合单元在第一连接器装置和 第二连接器装置。

公开(公告)号：EP2490514A1

公开(公告)日：2012-08-22

申请号：EP11008197.3

申请日：2011-10-11

Applicant: Mitsubishi Electric Corporation

Inventor： Miura, Tsuyoshi ,  Namikoshi, Kazuo

IPC: H05K3/34 ,  B23K1/08 ,  H05K1/11

CPC classification number: H05K3/3468 ,  B23K1/0016 ,  B23K1/085 ,  B23K1/203 ,  B23K2201/42 ,  H05K1/111 ,  H05K3/3421 ,  H05K2201/094 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/613

Abstract: A printed wiring board (1) has a solder-land group (5, 6) for placing a quad flat package IC (3), and the solder-land group (5, 6) consists of front solder-land groups (5) and rear solder-land groups (6). The printed wiring board 1 includes rear solder-drawing lands (9) that are positioned adjacent to rear solder-land groups (6), that have front edges each of which is substantially parallel to a longitudinal direction of rear solder lands (6a, 6b) constituting the rear solder-land group (6) and has a length approximately equal to or longer than that of the solder lands in the longitudinal direction, that are separated into two parts in a horizontal direction with respect to a traveling direction of solder flow such that a gap between the respective two separate lands (9) is made wider in its rearward portion than that in its frontward portion, and that have a slit (9a) substantially parallel to the longitudinal direction near the front edge.

Abstract translation: 印刷电路板（1）具有用于放置四边形扁平封装IC（3）的焊锡焊盘组（5,6），并且焊接焊盘组（5,6）由前焊接焊盘组（5）组成， 和后焊接组（6）。 印刷电路板1包括位于与后焊接台组（6）相邻的后焊盘（9），前后焊盘（9）具有大致平行于后焊盘（6a，6b）的纵向方向的前边缘 ），其长度大致等于或长于焊锡焊盘的长度方向的长度，相对于焊料流的行进方向在水平方向分离成两部分 使得相应的两个分离的平台（9）之间的间隙在其后部比其前部更宽，并且具有在前边缘附近基本上平行于纵向的狭缝（9a）。

公开(公告)号：EP2278863B1

公开(公告)日：2012-05-30

申请号：EP10165403.6

申请日：2010-06-09

Applicant: Alps Electric Co., Ltd.

Inventor： Kawai, Satoshi

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/116 ,  H05K1/0224 ,  H05K1/113 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/0723 ,  H05K2201/093 ,  H05K2201/09454 ,  H05K2201/0969 ,  H05K2201/09709

公开(公告)号：EP1991040B1

公开(公告)日：2012-02-15

申请号：EP08155950.2

申请日：2008-05-09

Applicant: Nitto Denko Corporation

Inventor： Ishii, Jun ,  Yokai, Takahiko

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K1/0253 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/056 ,  H05K3/4644 ,  H05K2201/09081 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/0969

公开(公告)号：EP2152050B1

公开(公告)日：2011-10-26

申请号：EP09167291.5

申请日：2009-08-05

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hayashi, Seiji

IPC: H05K1/11 ,  H05K1/02 ,  H01L23/498

CPC classification number: H05K1/116 ,  H01L23/49827 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0265 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/09745 ,  H05K2201/0979 ,  H05K2201/10734 ,  H01L2924/00

公开(公告)号：EP1089334B8

公开(公告)日：2011-09-21

申请号：EP00120263.9

申请日：2000-09-27

Applicant: Kabushiki Kaisha Toshiba

Inventor： Naba, Takayuki ,  Komorita, Hiroshi ,  Nakayama, Noritaka ,  Iyogi, Kiyoshi

IPC: H01L23/373 ,  H01L23/13

CPC classification number: H05K1/0271 ,  C04B37/026 ,  C04B2235/786 ,  C04B2237/12 ,  C04B2237/121 ,  C04B2237/123 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/708 ,  C04B2237/72 ,  H01L23/13 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/38 ,  H05K3/4629 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2201/09745 ,  Y10T428/12028 ,  Y10T428/12069 ,  Y10T428/12201 ,  Y10T428/12396 ,  Y10T428/12528 ,  Y10T428/12576 ,  Y10T428/1259 ,  H01L2924/00

公开(公告)号：EP2312916A2

公开(公告)日：2011-04-20

申请号：EP10186521.0

申请日：2010-10-05

Applicant: IBIDEN CO., LTD.

Inventor： Tsukada, Kiyotaka ,  Muraki, Tetsuya

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/202 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L25/072 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/0969 ,  H05K2201/10166 ,  H05K2201/10303 ,  H01L2924/00

Abstract: A circuit board ( 10 ) comprises a first conductive post ( 31 ) for electrically connecting to the collector electrode of a semiconductor device ( 50 ), a first metal plate ( 11 ) connecting to the first conductive post ( 31 ), a second conductive post ( 32 ) for electrically connecting to the gate electrode ( 52 ) of the semiconductor device ( 50 ), a second metal plate ( 12 ) connecting to the second conductive post ( 32 ), a third conductive post ( 33 ) for electrically connecting to the emitter electrode ( 53 ) of the semiconductor device ( 50 ), and a third metal plate ( 13 ) connecting to the third conductive post ( 33 ).

Abstract translation: 电路板（10）包括用于电连接到半导体器件（50）的集电极的第一导电柱（31），连接到第一导电柱（31）的第一金属板（11），第二导电柱 （32），用于电连接到所述半导体器件（50）的栅极（52）;连接到所述第二导电柱（32）的第二金属板（12），用于电连接到所述第二导电柱 半导体器件（50）的发射极（53）和连接到第三导电柱（33）的第三金属板（13）。

公开(公告)号：EP2180595A4

公开(公告)日：2010-09-08

申请号：EP08832206

申请日：2008-09-09

Applicant: NEC CORP

Inventor： ISHINO TOORU

IPC: H03F3/24 ,  H03F1/30 ,  H03F3/193 ,  H03F3/60 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H05K1/021 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/0969 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/10969 ,  Y10T29/49117