公开(公告)号：JP2018510507A

公开(公告)日：2018-04-12

申请号：JP2017544948

申请日：2016-02-25

Applicant: エプコス アクチエンゲゼルシャフト ,  EPCOS AG

Inventor： コイニ,マルクス ,  アウアー,クリストフ ,  コンラッド,ユルゲン ,  リンナー,フランツ ,  プフ,マルクス ,  シュタットローバー,モニカ ,  ビッペル,トーマス

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/38 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10909 ,  Y02P70/613

Abstract: セラミック素子(2)用の電気接続用接点(5)を示す。この接続用接点(5)は、第1材料(M1)と、その上に配置されている第2材料(M2)とを有し、第1材料(M1)は導電性が大きく、第2材料(M2)は熱膨張係数が小さい。

公开(公告)号：JP5350962B2

公开(公告)日：2013-11-27

申请号：JP2009228371

申请日：2009-09-30

Applicant: 富士通株式会社 ,  富士通コンポーネント株式会社

Inventor： 浩晃 田村 ,  史彦 十倉 ,  進直 野村 ,  敏弘 草谷 ,  和宏 水上

IPC: H01R4/02 ,  G06F1/18 ,  H01R12/57

CPC classification number: H05K3/3426 ,  H01L23/495 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H05K2201/09136 ,  H05K2201/10189 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2201/10984 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion.

公开(公告)号：JP4595835B2

公开(公告)日：2010-12-08

申请号：JP2006060432

申请日：2006-03-07

Applicant: 株式会社日立製作所

Inventor： 哲也 中塚 ,  弘二 芹沢

IPC: H01L23/50

CPC classification number: H01L23/49537 ,  H01L23/3107 ,  H01L23/49579 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/19041 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10848 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：JP4554873B2

公开(公告)日：2010-09-29

申请号：JP2002118905

申请日：2002-04-22

Applicant: 日本電気株式会社

Inventor： 裕希 百川

IPC: H05K3/34 ,  H05K1/03 ,  H05K1/11 ,  H05K3/30

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

公开(公告)号：JP2010073341A

公开(公告)日：2010-04-02

申请号：JP2008236579

申请日：2008-09-16

Applicant: Kitagawa Ind Co Ltd ,  北川工業株式会社

Inventor： YUMI HIDEO

IPC: H01R13/24 ,  H01R13/03

CPC classification number: H01R13/03 ,  H01R13/2442 ,  H05K1/0233 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/086 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To prevent impedance from being changed due to the formation of a new conductive passage, in a surface-mounted contact. SOLUTION: A series of insulation coating films Fa are formed on an inner face of a base plate 3, that is an inner face of a spring 6, that is an inner face of a movable plate 8, and that is an inner face of a guide 4. Furthermore, the other insulation coating film Fb is formed on a top face of the movable plate 8. As for a region where the insulation coating films Fa are formed, no new conductive channels are formed even if a movable part 7 comes in contact with the other part when elastically deformed in a direction approaching a base 2. Therefore, such a problem that an electric resistance value as a whole, that is impedance, is delicately changed at forming such electric conductive channels is not generated, and also, failures caused by an impedance change do not occur. Since a magnetic body of the insulation coating film Fb is dispersed, the magnetic body is functioned as a noise filter. The insulation coating film Fb fitted on an adsorption face 9 enhances the detection accuracy of the adsorption face 9 by an optical means. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了防止由于形成新的导电通道而导致的阻抗在表面安装的接触中。 解决方案：在基板3的内表面上形成一系列绝缘涂膜Fa，即基板3的内表面，即作为可移动板8的内表面的弹簧6的内表面， 另外，另一绝缘涂膜Fb形成在可动板8的上表面上。对于形成绝缘涂膜的区域，即使形成有导电通道也不会形成新的导电通道， 7在接近基座2的方向弹性变形时与另一部分接触。因此，不会产生在形成这种导电通道时整体上作为阻抗的电阻值被精细地改变的问题， 并且也不会发生由阻抗变化引起的故障。 由于绝缘涂膜Fb的磁体分散，因此磁性体作为噪声滤波器起作用。 安装在吸附面9上的绝缘涂膜Fb通过光学装置提高吸附面9的检测精度。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010010187A

公开(公告)日：2010-01-14

申请号：JP2008164388

申请日：2008-06-24

Applicant: Renesas Technology Corp ,  株式会社ルネサステクノロジ

Inventor： NAKAMURA HIROYUKI ,  NISHIKIZAWA ATSUSHI ,  KOIKE SHINYA

IPC: H01L21/56 ,  H01L23/50

CPC classification number: H01L21/4835 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3426 ,  H05K2201/10795 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a highly reliable semiconductor integrated circuit device in an onboard QFN-type package or the like which requires high reliability. SOLUTION: In a method of manufacturing a semiconductor integrated circuit device of a QFN-type package using a multiple leadframe having tie bars for bundling the outer ends of a plurality of leads, a sealing resin filling the gap between the outer circumference of a mold cavity and the tie bars is removed by means of a laser beam and then surface treatment such as solder plating is carried out. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种制造高可靠性的半导体集成电路器件的方法，该半导体集成电路器件需要高可靠性的板载QFN型封装等。 解决方案：在使用具有用于捆扎多个引线的外端的连接杆的多引线框的QFN型封装的半导体集成电路器件的制造方法中，填充密封树脂的外周的间隙的密封树脂 通过激光束去除模腔和连接杆，然后进行诸如焊料镀层的表面处理。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2008258411A

公开(公告)日：2008-10-23

申请号：JP2007099221

申请日：2007-04-05

Applicant: Rohm Co Ltd ,  ローム株式会社

Inventor： KASUYA YASUMASA ,  HAGA MOTOHARU

IPC: H01L23/50 ,  H01L23/12

CPC classification number: H05K3/3442 ,  H01L23/3121 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/29111 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/18301 ,  H05K2201/10727 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method by which solder can be soaked on the end face of a lead when the semiconductor device is mounted to a mounting board. SOLUTION: In the semiconductor device 1, a lead 4 (body part 9) of which the end face 9B is exposed from the side face 5B of seal resin 5. A metal plating layer 14 is formed on the end face 9B. The metal plating layer 14 is composed of a pure metal such as tin (Sn) and indium (In) and having a melting point of 260°C and lower. Thereby, solder can be soaked on the end face 9B of the lead 4 (body part 9) when the semiconductor device 1 is mounted. Consequently, the mounting strength of the semiconductor device 1 on the mounting board can be improved and the reliability of mounting can be improved. Further, a solder fillet can be formed on the end face 9B of the lead 4 (body part 9), so that the appearance of a joined (soldered) state between the lead 4 and the mounting board can be easily inspected. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供半导体器件及其制造方法，当半导体器件安装到安装板时，可以通过其将焊料浸渍在引线的端面上。 解决方案：在半导体器件1中，端面9B从密封树脂5的侧面5B露出的引线4（主体部分9）。在端面9B上形成金属镀层14。 金属镀层14由锡（Sn）和铟（In）等纯金属构成，熔点为260℃以下。 因此，当安装半导体器件1时，焊料可以浸渍在引线4（主体部分9）的端面9B上。 因此，可以提高半导体器件1在安装板上的安装强度，并且可以提高安装的可靠性。 此外，可以在引线4（主体部分9）的端面9B上形成焊接圆角，使得可以容易地检查引线4和安装板之间的接合（焊接）状态的外观。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP3839178B2

公开(公告)日：2006-11-01

申请号：JP2124099

申请日：1999-01-29

Applicant: 株式会社ルネサステクノロジ

Inventor： 宗久 岸本 ,  顕 樋口 ,  一男 清水

IPC: H01L21/56 ,  H01L23/50 ,  B29C45/02 ,  B29C45/14 ,  H01L23/28 ,  H01L23/29 ,  H01L23/495 ,  H05K3/34

CPC classification number: H05K3/341 ,  H01L23/49503 ,  H01L23/49555 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/09663 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/10969 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

公开(公告)号：JP6187918B2

公开(公告)日：2017-08-30

申请号：JP2015088001

申请日：2015-04-23

Applicant: パナソニックIPマネジメント株式会社

Inventor： 岸 新 ,  前田 憲 ,  境 忠彦

IPC: H01R4/02 ,  H01R11/01 ,  B23K35/26 ,  C22C12/00 ,  C22C28/00 ,  H05K3/36 ,  H05K3/32 ,  H05K3/34 ,  G09F9/00 ,  H05K1/14

CPC classification number: H05K1/0274 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/264 ,  B23K35/3613 ,  B23K35/362 ,  H05K1/11 ,  H05K1/14 ,  H05K3/323 ,  H05K3/3436 ,  H01R12/714 ,  H05K1/09 ,  H05K1/092 ,  H05K1/097 ,  H05K1/111 ,  H05K2201/0108 ,  H05K2201/0133 ,  H05K2201/0218 ,  H05K2201/0326 ,  H05K2201/10136 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2201/2036 ,  H05K3/3463

公开(公告)号：JP5732627B2

公开(公告)日：2015-06-10

申请号：JP2013245191

申请日：2013-11-27

Applicant: パナソニックIPマネジメント株式会社

Inventor： 古澤 彰男 ,  日根 清裕 ,  森 将人 ,  中村 太一

IPC: C22C13/00 ,  H05K3/34 ,  B23K35/26

CPC classification number: B23K35/262 ,  B23K35/0222 ,  B23K35/26 ,  B23K35/40 ,  C22C13/00 ,  H05K1/18 ,  H05K3/3463 ,  H05K1/111 ,  H05K2201/0338 ,  H05K2201/10909 ,  H05K3/244