Abstract:
The invention comprises: processing for receiving an OFDM packet having a preamble and the following data transmission symbol, in which packet the subcarrier interval of the preamble is set wider than that of the data transmission symbol; processing for estimating a DC offset occurring at a receiving side by using the received preamble; processing for correcting the DC offset on the received data transmission symbol, according to the estimation result of the DC offset; and processing for demodulating the DC offset corrected data transmission symbol. Thus, it is possible to estimate a DC offset and then correct the DC offset according to the estimated value, in the OFDM packet with no nul symbol defined there.
Abstract:
An electrically writable/erasable nonvolatile semiconductor memory such as an AND-type or NOR-type flash memory having an array structure, in which numerous memory cells are connected in parallel between common bit lines and source lines, is capable of readily detecting a memory cell in depletion failure which occurs in the event of a power supply cutoff during a memory cell threshold voltage shift-down operation by the writing or erasing operation. In operation, at the entry of a certain command or at the time of power-on, all word lines are unselected and bit line selecting switches are turned on to find the presence of a memory cell having a current flow due to depletion failure with sense amplifiers connected to the bit lines. On finding the presence of a failing cell, a voltage of selection level (VSS or negative voltage) is applied to each word line in turn, with remaining word lines being pulled to an unselection voltage level (negative voltage or VSS).
Abstract:
The present invention provides a semiconductor device having a power transistor of low ON resistance. The semiconductor device includes a metal-made header, a semiconductor chip which is fixed to the header and constitutes a MOSFET, and a sealing body made of insulating resin which covers the semiconductor chip, the header and the like. The semiconductor device further includes a drain lead which is contiguously formed with the header and projects from one side surface of the sealing body, and a source lead and a gate lead which project in parallel from one side surface of the sealing body, and wires which are positioned in the inside of the sealing body and connect electrodes on an upper surface of the semiconductor chip and source lead and the gate lead. In such a semiconductor device, a gate electrode pad is arranged at a position close to lead posts of the gate lead and the source lead and a source electrode pad is arranged at a position far from the lead posts of the gate lead and the source lead.
Abstract:
Heightening of breakdown voltage of a trench gate type power MISFET is actualized without increasing the number of manufacturing steps. In the manufacturing method of the semiconductor device according to the present invention, pnull type semiconductor region and pnull type field limiting rings are formed in a gate line area simultaneously in one impurity ion implantation step so as to bring them into contact with a groove having a gate extraction electrode formed therein. Upon formation, supposing that the width of the gate extraction electrode disposed outside the groove is CHSP, and the resistivity of the nnull type single crystal silicon layer 1B is null (nullnullcm), the CHSP is set to satisfy the following equation: CHSPnull3.80null0.148null.
Abstract:
The present invention provides a semiconductor device and a manufacturing method thereof which can make a ground/power source potential stable without reducing the number of pins for signals. The semiconductor device includes a plurality of leads, a tab having a size smaller than a size of a semiconductor chip, suspending leads connected to the tab and having suspending lead exposing portions, four bar leads connected to the suspending leads and arranged outside the semiconductor chip, first wires for connecting pads of the semiconductor chip and the leads, second wires for connecting the pads of the semiconductor chip and the bar leads, and a sealing body for sealing the semiconductor chip using resin. On a back surface of the sealing body, a distance between the suspending lead exposing portion and the lead exposing portion is set to a value equal to or more than a distance between the lead exposing portions. Due to such a constitution, the suspending leads can be used as external terminals and hence, the ground and the power source potential can be made stable.
Abstract:
A boundary scan cell in a semiconductor memory device (memory core) is provided corresponding to each terminal for performing a boundary scan test. A test controller and a read/write control circuit cause the boundary scan cell to latch input write data in a late write operation, until a next write cycle of the write cycle at which the write data was input from the terminal.
Abstract:
In a flash memory write mode, a microcomputer operation mode setting circuit sets a mode setting signal at one level. At this stage, a voltage drop caused by an LPF formed of a resistor, an inductor, and a capacitor can be suppressed at a low level. In a mode other than the flash memory write mode, the microcomputer operation mode setting circuit sets the mode setting signal at another level. At this stage, high frequency noise can be removed by the LPF formed of the resistor, the inductor, and the capacitor.
Abstract:
Level control signals are both set to H level, and potentials of power supply lines are both set to be lower than a power supply potential. In this manner, a gate leakage current during waiting and writing operation of a memory cell array can significantly be reduced. The level control signals are set to L level and H level respectively, and solely the potential of one of the power supply lines is set to be lower than the power supply potential. In this manner, power consumption during a reading operation of the memory cell array can be reduced.
Abstract:
A microcomputer is provided having a memory card interface capable of correctly latching data even when a card such as an MMC card is connected thereto. In the microcomputer having an interface with an external device such as a memory card, the interface unit is provided with an output driver connected to an external terminal for outputting a clock signal to output the clock signal and with an equivalent load circuit capable of imparting, to the clock signal extracted from an arbitrary position in a stage previous to the output driver in a clock signal path, delay equivalent to delay resulting from an external load connected to the external terminal in order to generate a clock signal for latching data inputted from the memory card.
Abstract:
Disclosed herein is a nonvolatile memory device having a plurality of nonvolatile memory cells. In the nonvolatile memory cell, a memory gate electrode is formed over a first semiconductor region with a gate insulating film and a gate nitride film interposed therebetween. First and second switch gate electrodes, and first and second signal electrodes used as source/drain electrodes are formed on both sides of the memory gate electrode. Electrons are injected into the gate nitride film from the source side so that each of the memory cells stores information therein. The memory gate electrode and the switch gate electrodes extend in the same direction. Thus, even if a high voltage is applied to the memory gate electrode of each write-intended memory cell which uses the memory gate electrode and switch gate electrodes in common, and write and write blocking voltages are applied through the first and second signal electrodes, each memory cell intended for write non-selection can avoid the application of a high electric field thereto owing to the switch gate electrodes held in a cut-off state.